My Inquiry
My Account
Analog Devices Inc. HMC858LC4B
- Part No.:
- HMC858LC4B
- Manufacturer:
- Analog Devices Inc.
- Category:
- Telecom
- Package:
- 24-TFCQFN Exposed Pad
- Datasheet:
-
HMC858LC4B.pdf
- Description:
- IC MULTIPLEXER 1 X 2:1 24QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,334
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC858LC4B from Hittite Microwave Corporation is a high-speed 2:1 differential selector IC designed for ultra-high-speed data routing in CML-based systems. It supports up to 14 Gbps data rates and 14 GHz select operation, features programmable differential output voltage swing (500–1300 mVp-p), -3.3 V single-supply operation, and on-chip 50 Ω input termination - ideal for redundant path switching in serial data links.
For engineers reviewing the HMC858LC4B datasheet, HMC858LC4B pinout, HMC858LC4B application, or HMC858LC4B equivalent, key selection considerations include its CML-compatible differential I/O architecture, VR-controlled output level tuning, sub-90 ps propagation delay, and ceramic 4×4 mm SMT package with exposed paddle grounding requirements.
Technical Context
The HMC858LC4B implements a current-mode logic (CML) 2:1 multiplexer with fully differential signal paths for both inputs (AP/AN, BP/BN) and outputs (OP/ON), plus differential select control (SP/SN). Its internal biasing and on-die 50 Ω input terminations eliminate external DC blocking or termination components for AC/DC-coupled CML sources.
Operation relies on a negative -3.3 V supply referenced to ground, with all signal pins (I/O and select) referenced to the positive supply rail. The VR pin enables real-time adjustment of differential output amplitude across process/voltage/temperature, supporting loss compensation in high-frequency PCB traces or interconnects.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Data Rate | 14 Gbps - supports 16G Fibre Channel and next-gen serial data protocols without retiming. |
| Propagation Delay | 87 ps - enables precise timing alignment in high-speed backplane or ASIC interface applications. |
| Output Swing Range | 500–1300 mVp-p differential - adjustable via VR pin to compensate for channel loss or match receiver sensitivity. |
| Rise/Fall Time | 19 / 20 ps - preserves signal integrity and eye opening at multi-GHz signaling frequencies. |
| Supply Voltage | -3.3 V (±0.3 V) - single negative rail simplifies power delivery vs. dual-rail CML solutions. |
| Input Termination | On-chip 50 Ω to ground - eliminates need for external resistors and reduces board space and parasitics. |
| Operating Temp | -40 °C to +85 °C - qualified for industrial and telecom infrastructure environments. |
Pinout & Package
Package: 24-lead ceramic RoHS-compliant SMT package, 4×4 mm body with exposed conductive paddle (Vee-connected); alumina substrate, gold-plated leads and paddle per MIL-STD-750.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 6, 8, 11, 13, 18 | Signal Ground (GND) | RF-signal reference planes; must connect to low-inductance PCB ground plane. |
| 2, 3, 4, 5 | AP, AN, BP, BN | Differential CML data inputs; internally terminated to 50 Ω ground; accept AC/DC coupling. |
| 9, 10 | SP, SN | Differential CML select control inputs; determine active input path (A→D or B→D). |
| 16, 17 | OP, ON | Differential CML outputs; support direct 50 Ω system termination; swing programmable via VR. |
| 19, 24 | Supply Ground (GND) | Return path for -3.3 V supply; must be soldered to Vee plane with low-impedance connection. |
| 20, 23 + Paddle | Vee | Negative supply terminal; exposed paddle and pins require solid solder joint to -3.3 V plane. |
| 7, 12, 14, 15, 22 | No Connect (N/C) | Internally unused; may be grounded RF/DC without performance impact. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Output Swing | VR pin adjusts differential output from 500 to 1300 mVp-p, enabling dynamic loss compensation across varying trace lengths. |
| On-Chip Input Termination | 50 Ω to ground on all differential inputs eliminates external resistors and improves impedance matching at 14 GHz. |
| Ultra-Low Propagation Skew | 87 ps A/B-to-DOUT delay with <2 ps path-to-path skew ensures deterministic timing in parallel data lanes. |
| Low-Power High-Speed Operation | 221 mW typical power at -3.3 V enables dense integration in thermal-constrained modules without forced cooling. |
| Robust Signal Integrity | 10 dB input/output return loss below 16 GHz and <0.11 ps rms random jitter preserve eye margin at 14 Gbps. |
Applications
| 16G Fibre Channel Switching | Redundant Serial Data Path |
|---|---|
Use Scenario: Selecting between primary and backup optical transceiver lanes in enterprise storage switches. IC Role / Device Role / Timing Role: 2:1 differential selector routing CML-encoded 16G FC signals with sub-90 ps latency and no added jitter. Use Value: Enables seamless failover with <2 ps skew between paths, preserving link training and BER compliance during switchover. |
Use Scenario: Providing hot-swappable signal routing in high-availability telecom line cards handling 10–14 Gbps serial streams. IC Role / Device Role / Timing Role: High-isolation (≥30 dB @ 14 GHz) selector isolating standby path while maintaining live data flow. Use Value: Eliminates need for external RF switches or relays, reducing bill-of-materials and improving MTBF in carrier-grade hardware. |
| Broadband Test Instrumentation | ASIC/FPGA Interposer Interface |
Use Scenario: Multiplexing calibrated reference signals into high-bandwidth oscilloscope or bit-error-rate tester front-ends. IC Role / Device Role / Timing Role: Low-jitter, flat-group-delay selector preserving signal fidelity for >10 GHz analog and digital measurements. Use Value: Maintains <0.11 ps rms jitter and >10 dB return loss up to 16 GHz, ensuring measurement accuracy traceability. |
Use Scenario: Routing high-speed SerDes lanes between FPGA banks and multi-die ASIC packages in AI accelerator modules. IC Role / Device Role / Timing Role: CML-compatible 2:1 mux enabling flexible lane assignment and debug path injection without signal degradation. Use Value: On-chip 50 Ω termination and 19/20 ps edges minimize reflections and ensure clean eye diagrams at 14 Gbps per lane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed differential selector applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC858LC5 | Same core functionality but in 5×5 mm LCC package; higher thermal resistance (42.5 °C/W vs. 32.8 °C/W); identical electrical specs. | Preferred where larger PCB footprint is acceptable and thermal dissipation margin is relaxed. | Select HMC858LC5 only if board layout allows larger package and thermal budget permits higher junction temperature rise. |
| ADN2880ACPZ-R7 | 3.3 V positive-supply CML mux; max 12.5 Gbps; no VR pin; fixed 800 mVp-p output; different pinout and biasing scheme. | Suitable for cost-sensitive, lower-speed designs where programmable swing and negative supply are not required. | Choose ADN2880ACPZ-R7 only when operating at ≤12.5 Gbps and using positive-rail CML infrastructure; not drop-in compatible. |
Compared with HMC858LC4B, HMC858LC5 offers identical performance in a larger thermally less efficient package, while ADN2880ACPZ-R7 provides a positive-supply alternative at reduced speed and fixed output swing - neither is pin-compatible, requiring layout and power delivery redesign.
Availability
HMC858LC4B is available at Aetrix Electronics and suitable for 16G Fibre Channel systems, redundant high-speed serial links, and broadband test instrumentation requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant ceramic packaging.
Supply support for HMC858LC4B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Hittite Microwave Corporation (acquired by Analog Devices in 2014) specialized in high-frequency RF, microwave, and high-speed analog ICs for defense, communications, and test equipment markets.
The HMC858LC4B belongs to Hittite's high-speed logic product line, engineered specifically for CML-based serial data routing in infrastructure equipment demanding sub-100 ps timing precision and 14+ Gbps throughput.
FAQ
What is the recommended power supply configuration for the HMC858LC4B?
The HMC858LC4B requires a clean, well-decoupled -3.3 V DC supply referenced to ground. Pins 20 and 23 plus the exposed paddle must be soldered directly to the -3.3 V plane. Use local 4.7 µF tantalum and 100 pF ceramic capacitors per supply pin as shown in the evaluation board schematic. Avoid shared return paths with noisy digital supplies to prevent jitter degradation in the HMC858LC4B.
How does the VR pin affect output performance in the HMC858LC4B?
The VR pin on the HMC858LC4B sets the differential output voltage swing from 500 to 1300 mVp-p by adjusting internal current sources. At VR = 0 V, output is ~1080 mVp-p; increasing VR raises swing linearly. This allows real-time optimization for channel loss or receiver input range - critical for maintaining eye height in long FR4 traces. Do not leave VR floating; tie to GND or controlled voltage source.
Can the HMC858LC4B operate with single-ended inputs or outputs?
Yes - the HMC858LC4B supports single-ended operation. Differential inputs (AP/AN, BP/BN) may be driven single-ended with proper AC coupling and 50 Ω termination to ground. Outputs (OP/ON) can be used differentially or single-ended: for single-ended use, terminate one output leg to 50 Ω and take signal from the other. Output amplitude drops to ~540 mVp-p in single-ended mode, as specified in the HMC858LC4B datasheet.
What is the thermal management requirement for the HMC858LC4B?
The HMC858LC4B has a thermal resistance of 32.8 °C/W (junction-to-paddle). To maintain junction temperature ≤125 °C at maximum ambient (85 °C), the PCB must provide low-thermal-resistance conduction from the exposed paddle to a solid -3.3 V copper plane with ≥6 thermal vias. Derating begins above 85 °C ambient at 30 mW/°C. Thermal simulation is recommended for high-density layouts using the HMC858LC4B.
Is the HMC858LC4B pin-compatible with other Hittite 2:1 selectors like the HMC858LC5?
No - the HMC858LC4B is not pin-compatible with the HMC858LC5. Although both share identical electrical functionality and signal pin definitions, the HMC858LC4B uses a 24-lead 4×4 mm ceramic package with specific ground and N/C pin placements, while the HMC858LC5 uses a 25-lead 5×5 mm LCC. PCB layout, footprint, and thermal pad design differ significantly between the two, so the HMC858LC4B cannot serve as a drop-in replacement for the HMC858LC5.
HMC858LC4B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 24-TFCQFN Exposed Pad
- Packaging:
- Strip
- Product Status:
- Active
- Function:
- Differential Selector
- Interface:
- Serial
- Number of Circuits:
- -
- Voltage - Supply:
- -3.6V ~ -3V
- Current - Supply:
- 67mA
- Power (Watts):
- 221 mW
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-CSMT (4x4)
HMC858LC4B FAQ
1.How can I place an order for HMC858LC4B through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC858LC4B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC858LC4B reliable?
The price and inventory of HMC858LC4B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC858LC4B is usually 5 days.
3.What payment methods are accepted for HMC858LC4B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC858LC4B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC858LC4B?
HMC858LC4B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC858LC4B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC858LC4B?
For technical support, including HMC858LC4B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC858LC4B requirements.
6.How does Aetrix verify that HMC858LC4B is sourced from the original manufacturer or authorized distributors?
All HMC858LC4B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC858LC4B meets industry standards.
7.What is the process for return or replacement of HMC858LC4B?
All HMC858LC4B units undergo pre-shipment inspection (PSI). If there is an issue with HMC858LC4B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC858LC4B part is unused and in its original packaging.
Return procedure for HMC858LC4B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC858LC4B Tags
-
LMC567CMX/NOPB
Texas Instruments
-
LM567CMX/NOPB
Texas Instruments
-
LM567CM/NOPB
Texas Instruments
-
VSC8531XMW-02
Microchip Technology
-
VSC8531XMW-05
Microchip Technology
-
GPY115C0VI
MaxLinear, Inc.
-
SI32185-A-FMR
Skyworks Solutions Inc.
-
VSC8541XMV-05
Microchip Technology
-
SI32178-B-FM1R
Skyworks Solutions Inc.
-
GPY215C0VI
MaxLinear, Inc.
-
CPC7514ZTR
Littelfuse Inc.
-
VSC8502XML-03
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
