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Analog Devices Inc. HMC-MDB169

Part No.:
HMC-MDB169
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
Die
Datasheet:
AetrixHMC-MDB169.pdf
Description:
IC MMIC MIXER DBL-BAL DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,108

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Product details

Overview

HMC-MDB169 from Analog Devices is a passive GaAs MMIC double-balanced mixer die operating at 54–64 GHz RF/LO and DC–5 GHz IF, delivering 8 dB typical conversion loss, 30 dB LO-to-RF isolation, and −55 °C to +85 °C operating temperature-designed for millimeter-wave up/downconversion in SATCOM transceivers.

For engineers reviewing the HMC-MDB169 datasheet, HMC-MDB169 pinout, HMC-MDB169 application, or HMC-MDB169 equivalent, key selection criteria include its 0.9 × 1.0 mm die size, Ti/Au metallized bond pads, DC-coupled 50 Ω RF/LO ports, and compatibility with eutectic die attach and thermosonic wire bonding in MCM/hybrid microcircuit assemblies.

Technical Context

The HMC-MDB169 implements a passive double-balanced topology using GaAs HBT Schottky diode technology, enabling bidirectional operation as both upconverter and downconverter without DC bias. Its RF and LO ports are DC-coupled and impedance-matched to 50 Ω, while the IF port supports DC coupling across 0–5 GHz.

Performance is characterized under probed-die conditions at TA = 25 °C with +13 dBm LO drive; it achieves 13 dBm input IP3 and +4 dBm input 1 dB compression, with all bond pads and backside metallized in gold for reliable hybrid integration and thermal management.

Key Specifications

Parameter Value and Actual Design Meaning
RF/LO Frequency Range 54–64 GHz - Enables E-band short-haul radio and military radar front-end operation.
IF Bandwidth DC–5 GHz - Supports baseband and wideband intermediate frequency signal processing.
Conversion Loss 8 dB typical - Minimizes signal path attenuation in high-frequency transceiver chains.
LO-to-RF Isolation 30 dB - Reduces LO leakage into antenna paths, easing filtering requirements.
DIE Size 0.9 × 1.0 × 0.1 mm - Enables compact MCM integration with minimal PCB footprint.
Operating Temperature −55 °C to +85 °C - Qualified for industrial and defense-grade environmental operation.
Input IP3 13 dBm - Provides linearity headroom for multi-carrier SATCOM and EW systems.

Pinout & Package

Package: Bare die (0.9 mm × 1.0 mm × 0.1 mm), Ti/Au metallized bond pads, gold backside ground plane, supplied in GP-2 gel pack. Compatible with eutectic (AuSn) and conductive epoxy die attach; RF/IF/LO pads support thermosonic ribbon or wedge wire bonding.

Pin/Terminal Circuit Role Design Meaning
1 RF DC-coupled 50 Ω RF port; accepts 54–64 GHz signals in up/downconversion mode.
2 IF DC-coupled IF port supporting 0–5 GHz baseband or intermediate frequency signals.
3 LO DC-coupled 50 Ω local oscillator port; requires +13 dBm drive for specified performance.

Key Features

Feature Design Value
Passive double-balanced topology Eliminates need for external biasing and enables inherent LO/RF/IF port isolation without active circuitry.
GaAs HBT Schottky diode process Delivers stable millimeter-wave performance with full passivation for reliability in harsh environments.
Gold metallization (pads & backside) Ensures robust wire bondability and low-resistance ground connection in hybrid microcircuits.
0.004″ square bond pads Supports standard 0.003″ × 0.0005″ ribbon bonding with 40–60 g force and ≤12 mil bond length.

Applications

Short-Haul Radios SATCOM Terminals

Use Scenario: High-capacity point-to-point wireless links in 60 GHz unlicensed band.

IC Role / Device Role / Timing Role: Downconverter in receiver chain and upconverter in transmitter chain.

Use Value: 8 dB conversion loss and 30 dB LO-to-RF isolation reduce cascaded noise figure and simplify front-end filtering.

Use Scenario: Mobile satellite communication terminals requiring compact, broadband RF front ends.

IC Role / Device Role / Timing Role: Fundamental mixer translating between L-band IF and E-band RF in transmit/receive modules.

Use Value: DC–5 GHz IF bandwidth accommodates wide modulation bandwidths; 0.9 × 1.0 mm die size enables dense array integration.

Military Radar ECM/EW Systems

Use Scenario: Active electronically scanned array (AESA) radar receivers operating at 57–64 GHz.

IC Role / Device Role / Timing Role: Low-noise downconversion stage in distributed receive modules.

Use Value: −55 °C to +85 °C operating range and MIL-STD-883 inspected die ensure field reliability under thermal stress.

Use Scenario: Broadband electronic countermeasures jammers covering 54–64 GHz threat bands.

IC Role / Device Role / Timing Role: Upconverter generating high-power jamming signals from baseband waveforms.

Use Value: 13 dBm input IP3 and +4 dBm 1 dB compression enable linear amplification of complex modulated jamming signals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar passive millimeter-wave mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC-MDB168 Same die family; operates at 47–57 GHz RF/LO range with identical 0.9 × 1.0 mm package and 8 dB conversion loss. Targeted for V-band (47–57 GHz) systems rather than E-band (54–64 GHz); not interchangeable without RF redesign. Select HMC-MDB168 only when system RF center frequency falls below 54 GHz.
HMC-MDB170 Same architecture; extends RF/LO range to 63–73 GHz with 8.5 dB typical conversion loss and reduced LO-to-RF isolation (27 dB). Optimized for W-band extensions beyond 64 GHz; exhibits higher conversion loss and lower isolation than HMC-MDB169. Choose HMC-MDB170 only if system requires coverage above 64 GHz and can tolerate 0.5 dB higher loss.

Compared with HMC-MDB168 and HMC-MDB170, the HMC-MDB169 uniquely balances E-band coverage (54–64 GHz), 8 dB conversion loss, and 30 dB LO-to-RF isolation-making it the optimal choice for fixed 60 GHz radios, SATCOM terminals, and radar receivers where spectral purity and insertion loss are critical.

Availability

HMC-MDB169 is available at Aetrix Electronics and suitable for short-haul radios, SATCOM terminals, and military radar systems requiring stable component supply, traceable bare-die sourcing, and long-term production continuity.

Supply support for HMC-MDB169 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and defense markets with precision signal processing solutions.

The HMC-MDB169 belongs to Analog Devices' Hittite Microwave MMIC mixer product line, engineered specifically for millimeter-wave wireless infrastructure and defense electronics requiring compact, high-isolation, passive mixing at E-band frequencies.

FAQ

What is the recommended LO drive level for HMC-MDB169?

The HMC-MDB169 is characterized and optimized for +13 dBm LO drive power. Operating below this level increases conversion loss; exceeding +20 dBm risks permanent damage per absolute maximum ratings. For stable performance in production designs, maintain LO drive within +12 to +14 dBm using calibrated sources or controlled amplifier stages feeding the LO pad of the HMC-MDB169.

Is HMC-MDB169 a surface-mount device or bare die?

HMC-MDB169 is supplied as a bare GaAs die (0.9 × 1.0 × 0.1 mm), not a packaged SMT component. It requires hybrid assembly via die attach to a grounded substrate and wire bonding to RF transmission lines. The die features Ti/Au bond pads and a gold backside ground plane-making it suitable for MCM, LTCC, and alumina-based microwave modules-not standard PCB reflow processes.

Does HMC-MDB169 require DC bias or external power?

No, the HMC-MDB169 is a fully passive double-balanced mixer based on GaAs Schottky diodes and requires no DC bias or external power supply. All three ports-RF, IF, and LO-are DC-coupled, allowing baseband IF operation down to 0 Hz. This eliminates bias network design complexity and enhances reliability in high-frequency front ends using the HMC-MDB169.

What is the thermal handling limit during die attach for HMC-MDB169?

HMC-MDB169 must not be exposed to temperatures above 320 °C for more than 20 seconds during eutectic die attach. Recommended AuSn (80/20) attachment uses a work surface at 255 °C and tool tip at 265 °C (or 290 °C with hot N₂/H₂ gas). Exceeding thermal limits risks Schottky junction degradation-directly impacting conversion loss and isolation specs of the HMC-MDB169.

Can HMC-MDB169 be used for both upconversion and downconversion?

Yes, the HMC-MDB169 supports bidirectional operation: as an upconverter (IF → RF) or downconverter (RF → IF), due to its symmetric passive double-balanced topology. Performance data confirms consistent conversion loss and isolation in both modes when RF, LO, and IF ports are correctly assigned per the HMC-MDB169 pad layout-enabling flexible reuse in full-duplex or TDD transceiver architectures.

HMC-MDB169 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
Die
Packaging:
Bulk
Product Status:
Active
RF Type:
General Purpose
Frequency:
54GHz ~ 64GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
-
Secondary Attributes:
Up/Down Converter
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

HMC-MDB169 FAQ

1.How can I place an order for HMC-MDB169 through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC-MDB169 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC-MDB169 reliable?

The price and inventory of HMC-MDB169 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC-MDB169 is usually 5 days.

3.What payment methods are accepted for HMC-MDB169?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC-MDB169 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC-MDB169?

HMC-MDB169 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC-MDB169 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC-MDB169?

For technical support, including HMC-MDB169 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC-MDB169 requirements.

6.How does Aetrix verify that HMC-MDB169 is sourced from the original manufacturer or authorized distributors?

All HMC-MDB169 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC-MDB169 meets industry standards.

7.What is the process for return or replacement of HMC-MDB169?

All HMC-MDB169 units undergo pre-shipment inspection (PSI). If there is an issue with HMC-MDB169, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC-MDB169 part is unused and in its original packaging.

Return procedure for HMC-MDB169:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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