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Analog Devices Inc. HMC-MDB171

Part No.:
HMC-MDB171
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
Die
Datasheet:
AetrixHMC-MDB171.pdf
Description:
IC MMIC IQ MIXER DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,141

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Product details

Overview

HMC-MDB171 from Analog Devices is a GaAs HBT-based monolithic I/Q mixer die operating at 35–45 GHz RF/LO and DC–5 GHz IF, delivering 25 dB image rejection, 35 dB LO-to-RF isolation, and 11 dB typical conversion loss with external quadrature hybrid-used in millimeter-wave point-to-point radios and SATCOM downconverters.

For engineers reviewing the HMC-MDB171 datasheet, HMC-MDB171 pinout, HMC-MDB171 application, or HMC-MDB171 equivalent, key selection criteria include its passive operation (no DC bias), Ti/Au metallized bond pads, 1.5 × 2.0 mm die size, and compatibility with thermosonic wire bonding and eutectic die attach in MCM/hybrid microcircuit assemblies.

Technical Context

The HMC-MDB171 implements a passive double-balanced I/Q architecture using GaAs Heterojunction Bipolar Transistor (HBT) Schottky diode technology, enabling image-reject downconversion without DC power. It requires an external 90° hybrid on the IF ports to achieve 25 dB image rejection and operates with +16 dBm LO drive.

Its RF, LO, and IF ports are all DC-coupled and impedance-matched to 50 Ω, supporting both IRM and single-sideband upconversion modes. The die backside is fully metallized with Ti/Au and serves as RF ground, enabling direct eutectic or conductive-epoxy mounting to a grounded substrate.

Key Specifications

ParameterValue and Actual Design Meaning
RF/LO Frequency Range35–45 GHz - supports E-band fixed wireless and radar front-ends
IF BandwidthDC–5 GHz - enables baseband and wideband IF signal processing
Image Rejection25 dB typical - suppresses unwanted sideband by >300× voltage ratio
LO-to-RF Isolation35 dB typical - minimizes LO leakage into antenna path
Conversion Loss11 dB typical with external hybrid - defines minimum system NF penalty
Input IP317 dBm - sets third-order intermodulation threshold for two-tone signals
Die Size1.5 × 2.0 × 0.1 mm - fits compact MCM layouts with minimal RF parasitics

Pinout & Package

Package: Unpackaged GaAs MMIC die, 1.5 × 2.0 × 0.1 mm, Ti/Au metallized top and backside (backside grounded). Compatible with gel-pack (GP-2) shipping and standard die-attach/wire-bond processes.

Pin/TerminalCircuit RoleDesign Meaning
1RFDC-coupled 50 Ω RF input/output port; matched for 35–45 GHz operation
2IF1DC-coupled I-channel IF output; used with external 90° hybrid for image rejection
3LODC-coupled 50 Ω local oscillator input; requires +16 dBm drive level
4IF2DC-coupled Q-channel IF output; phase-quadrature to IF1 for SSB/IRM operation

Key Features

FeatureDesign Value
No DC bias requiredPassive operation eliminates bias network design, noise, and power supply routing
Ti/Au metallizationEnables reliable thermosonic wire bonding and high-temperature eutectic die attach
Backside ground planeProvides low-inductance RF return path and simplifies thermal management in hybrid assemblies
DC-coupled portsSupports baseband IF signals and eliminates blocking capacitors in IF chain

Applications

Point-to-Point RadiosTest & Measurement Equipment

Use Scenario: High-capacity E-band wireless backhaul links requiring low-phase-noise, high-dynamic-range downconversion.

IC Role / Device Role / Timing Role: Passive I/Q downconverter providing image-reject mixing at 38 GHz carrier with DC–5 GHz IF output.

Use Value: Enables 25 dB image suppression and 11 dB conversion loss without DC bias, reducing system power and complexity.

Use Scenario: Vector network analyzer (VNA) and spectrum analyzer front-ends needing broadband millimeter-wave signal analysis.

IC Role / Device Role / Timing Role: RF-to-IF translation element in receiver chains covering 35–45 GHz with calibrated IF output.

Use Value: Delivers stable 35 dB LO-to-RF isolation and 17 dBm input IP3, minimizing measurement distortion and crosstalk.

SATCOM TerminalsRadar Systems

Use Scenario: Mobile satellite communication terminals operating in Ka/E-band uplink/downlink with stringent size and thermal constraints.

IC Role / Device Role / Timing Role: Image-reject mixer in LNB-style downconverters, rejecting adjacent channel interference in congested orbital bands.

Use Value: Achieves 25 dB image rejection and 1.5 × 2.0 mm footprint, enabling compact multi-channel phased-array front-ends.

Use Scenario: Automotive and defense radar receivers requiring high-frequency, low-noise signal acquisition in 35–45 GHz bands.

IC Role / Device Role / Timing Role: Core downconversion stage in FMCW radar transceivers, converting chirped RF echoes to baseband I/Q signals.

Use Value: Supports DC–5 GHz IF bandwidth and passive operation, eliminating bias-induced drift in temperature-varying environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar I/Q mixer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
HMC-MDB170Same die family, but rated for 24–34 GHz RF/LO range; 22 dB image rejectionLower-frequency E-band alternatives; not suitable for 35–45 GHz systemsSelect only when operating below 34 GHz and lower image rejection is acceptable
HMC1040LP4E40–60 GHz active I/Q mixer with integrated LO buffer; requires +5 V bias; 20 dB image rejectionHigher-frequency coverage but adds power, noise, and layout complexityChoose when wider RF band (up to 60 GHz) and active gain are needed despite higher power and cost

Compared with HMC-MDB170 and HMC1040LP4E, the HMC-MDB171 uniquely balances 35–45 GHz operation, passive simplicity, and 25 dB image rejection in a 1.5 × 2.0 mm die-making it optimal for size-constrained, bias-free E-band downconverters where thermal stability and LO leakage control are critical.

Availability

HMC-MDB171 is available at Aetrix Electronics and suitable for point-to-point radios, SATCOM terminals, and radar systems requiring stable component supply across extended temperature ranges (–55 °C to +85 °C) and long-lifecycle production.

Supply support for HMC-MDB171 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and aerospace markets with precision signal processing solutions.

The HMC-MDB171 belongs to Analog Devices' Hittite Microwave MMIC mixer product line, engineered specifically for millimeter-wave wireless infrastructure and defense applications demanding high isolation, image rejection, and die-level integration.

FAQ

What is the recommended LO drive level for optimal performance of the HMC-MDB171?

The HMC-MDB171 is characterized at +16 dBm LO input power, which delivers specified conversion loss (11 dB typ), image rejection (25 dB typ), and IP3 (17 dBm). Operating below +14 dBm increases conversion loss and degrades linearity; exceeding +17 dBm risks compression and reliability concerns. Always maintain LO within ±0.5 dB tolerance for repeatable RF performance in production assemblies.

Does the HMC-MDB171 require DC bias or external power to operate?

No, the HMC-MDB171 is a fully passive GaAs MMIC I/Q mixer and requires no DC bias or external power supply. Its operation relies solely on RF and LO signal energy, eliminating bias networks, decoupling capacitors, and associated noise sources-making it ideal for ultra-low-power and thermally sensitive millimeter-wave modules.

How is image rejection achieved with the HMC-MDB171, and what external components are needed?

Image rejection in the HMC-MDB171 is achieved using an external 90° hybrid coupler connected to the IF1 and IF2 ports. The hybrid combines the I and Q outputs to cancel the image sideband. Without the hybrid, the device functions as a standard double-balanced mixer with no inherent image rejection-so the hybrid is mandatory for IRM mode and contributes +3 dB to measured conversion loss.

What are the handling and mounting requirements for the HMC-MDB171 die?

The HMC-MDB171 is an electrostatic-sensitive GaAs die requiring ESD-safe handling per MIL-STD-883 Method 2010. Mounting must use AuSn eutectic (255 °C work surface) or conductive epoxy; backside Ti/Au metallization serves as ground. Bond wires should be ≤0.31 mm long, and substrates must minimize die-to-line spacing to preserve 35–45 GHz impedance integrity.

Can the HMC-MDB171 be used for upconversion, and what configuration is required?

Yes, the HMC-MDB171 supports single-sideband upconversion by applying baseband I/Q signals to IF1 and IF2 while injecting the LO at port 3 and extracting the RF output at port 1. This configuration leverages the same passive I/Q architecture-no reconfiguration or external switching is needed, and performance matches downconversion specs when IF signals are properly balanced and phase-aligned.

HMC-MDB171 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
Die
Packaging:
Bulk
Product Status:
Active
RF Type:
Radar
Frequency:
35GHz ~ 45GHz
Number of Mixers:
2
Gain:
-
Noise Figure:
-
Secondary Attributes:
Up Converter
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

HMC-MDB171 FAQ

1.How can I place an order for HMC-MDB171 through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC-MDB171 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC-MDB171 reliable?

The price and inventory of HMC-MDB171 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC-MDB171 is usually 5 days.

3.What payment methods are accepted for HMC-MDB171?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC-MDB171 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC-MDB171?

HMC-MDB171 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC-MDB171 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC-MDB171?

For technical support, including HMC-MDB171 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC-MDB171 requirements.

6.How does Aetrix verify that HMC-MDB171 is sourced from the original manufacturer or authorized distributors?

All HMC-MDB171 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC-MDB171 meets industry standards.

7.What is the process for return or replacement of HMC-MDB171?

All HMC-MDB171 units undergo pre-shipment inspection (PSI). If there is an issue with HMC-MDB171, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC-MDB171 part is unused and in its original packaging.

Return procedure for HMC-MDB171:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

HMC-MDB171 Tags

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