Analog Devices Inc. HMC-MDB172

Overview

HMC-MDB172 from Analog Devices is a GaAs MMIC I/Q mixer die designed for millimeter-wave downconversion and single-sideband upconversion in 19–33 GHz RF/LO and DC–5 GHz IF systems, delivering 25 dB typical image rejection, 35 dB LO-to-RF isolation, and 11 dB typical conversion loss with external quadrature hybrid - deployed in point-to-point radios and SATCOM transceivers.

For engineers reviewing the HMC-MDB172 datasheet, HMC-MDB172 pinout, HMC-MDB172 application, or HMC-MDB172 equivalent, key selection criteria include its passive operation (no DC bias), 2.2 × 2.0 mm die size, 17 dBm input IP3, -55 °C to +85 °C operating temperature range, and compatibility with thermosonic wire bonding and eutectic die attach in MCM/hybrid microcircuit assemblies.

Technical Context

The HMC-MDB172 implements a passive monolithic I/Q architecture using GaAs HBT Schottky diode technology, requiring an external 90° hybrid for image-reject downconversion or SSB upconversion. Its four-terminal interface (RF, LO, IF1, IF2) supports differential IF output with DC-coupled, 50 Ω-matched ports.

All RF performance metrics - including 20–25 dB image rejection and 30–35 dB LO-to-RF isolation - are measured on probed die in 50 Ω environment at TA = 25 °C, IF = 3 GHz, and LO = +16 dBm, with absolute maximum ratings specifying -65 °C to +150 °C storage and ESD-sensitive handling per MIL-STD-883 Method 2010, condition B.

Key Specifications

Pinout & Package

Package: Bare die in Gel Pack (GP-1), Ti/Au metallized bond pads, gold backside ground plane, 2.2 mm × 2.0 mm × 0.1 mm thickness, MIL-STD-883 inspected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar I/Q mixer applications.

Compared with HMC-MDB172, HMC1048LP4E trades frequency reach for ease of assembly and bias flexibility, while HMC558LC3 extends upper band edge at the cost of image rejection and conversion efficiency - making HMC-MDB172 optimal for balanced E-band performance in space-constrained hybrid assemblies.

Availability

HMC-MDB172 is available at Aetrix Electronics and suitable for point-to-point radios, SATCOM terminals, and military radar receivers requiring stable component supply across extended production lifecycles.

Supply support for HMC-MDB172 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, headquartered in Wilmington, MA, serving communications, defense, instrumentation, and industrial markets.

The HMC-MDB172 belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for millimeter-wave system integrators needing bare-die I/Q mixers with proven hybrid-compatible performance in 19–33 GHz infrastructure and defense platforms.

FAQ

What is the recommended LO drive level for HMC-MDB172?

The HMC-MDB172 is characterized at +16 dBm LO input power, which delivers optimal conversion loss (8–11 dB), image rejection (20–25 dB), and isolation (30–35 dB). Operating below +14 dBm increases conversion loss; above +18 dBm risks compression or degradation. The HMC-MDB172 does not require DC bias, so LO drive is the sole active control parameter for linear operation.

Does HMC-MDB172 require an external 90° hybrid for image rejection?

Yes - the HMC-MDB172 is a passive I/Q core and requires an external 90° hybrid on the IF outputs (IF1/IF2) to achieve image rejection. Without the hybrid, it functions as a standard double-balanced mixer. Application Circuit 2 in the HMC-MDB172 datasheet shows this configuration, and all image rejection specs (20–25 dB) assume ideal hybrid performance.

What is the thermal and mechanical mounting guidance for HMC-MDB172?

HMC-MDB172 uses a gold backside ground plane and is qualified for eutectic (AuSn) or conductive epoxy die attach. Recommended eutectic process: 255 °C work surface, 265 °C tool tip, ≤320 °C for <20 s. Substrate spacing should be 0.076–0.152 mm; for 10-mil alumina, use a 6-mil molybdenum heat spreader to maintain coplanarity. All handling must follow ESD precautions per MIL-STD-883.

Can HMC-MDB172 be used for upconversion?

Yes - the HMC-MDB172 operates bidirectionally and can function as a single-sideband upconverter when IF signals are applied to IF1/IF2 and the desired sideband is selected via the external 90° hybrid. Its passive architecture and symmetric port design support both downconversion and upconversion modes without modification; RF and LO ports are interchangeable per application circuit guidelines.

What are the ESD sensitivity and handling requirements for HMC-MDB172?

HMC-MDB172 is an electrostatic sensitive device (ESD) rated per MIL-STD-883 Method 2010, condition B. It must be stored in nitrogen-filled ESD bags after opening, handled only by edges with vacuum collets or bent tweezers, and never touched on the air-bridge surface. Bond wires must be <0.31 mm long; RF bonds use 0.003"×0.0005" ribbon, DC bonds use 0.025 mm wire, all thermosonically bonded at ~150 °C stage temperature.