Analog Devices Inc. HMC-MDB218
- Part No.:
- HMC-MDB218
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC-MDB218.pdf
- Description:
- IC MMIC IQ MIXER DIE
- Quantity:
- Payment:

- Shipping:

Inventory:3,556
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Product details
Overview
HMC-MDB218 from Analog Devices is a GaAs MMIC sub-harmonically pumped image-reject mixer (IRM) operating at 54–64 GHz RF, 27–32 GHz LO, and DC–3 GHz IF, with 14 dB typical conversion loss, 30 dB image rejection, and no DC bias required-used in millimeter-wave SATCOM and radar front-ends.
For engineers reviewing the HMC-MDB218 datasheet, HMC-MDB218 pinout, HMC-MDB218 application, or HMC-MDB218 equivalent, key selection criteria include RF/LO frequency alignment, passive operation, die-level integration for hybrid MCMs, and quadrature hybrid–based image suppression in downconversion architectures.
Technical Context
The HMC-MDB218 implements a passive x2 sub-harmonic pumping architecture using GaAs HBT Schottky diode technology, enabling image rejection without active biasing. It requires an external 90° hybrid on the IF ports to select the desired sideband and achieve 30 dB measured image rejection.
Its RF and LO ports are DC-coupled and 50 Ω matched; IF1/IF2 ports are also DC-coupled and symmetric. All bond pads and backside metallization are Ti/Au, with fully passivated Schottky devices for reliability in hermetic hybrid assemblies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 54–64 GHz: Supports E-band short-haul radio and military radar bands. |
| LO Frequency Range | 27–32 GHz: Enables x2 sub-harmonic drive, halving LO source requirements. |
| IF Bandwidth | DC–3 GHz: Allows baseband-to-3 GHz signal processing without IF filtering constraints. |
| Conversion Loss | 14 dB typical: Defines RF-to-IF signal attenuation under +10 dBm LO drive at 1 GHz IF. |
| Image Rejection | 30 dB: Achieved with external 90° hybrid; enables single-sideband downconversion. |
| 1 dB Compression (Input) | –2 dBm: Sets maximum linear input power before gain compression in receiver chains. |
| IP3 (Input) | +7 dBm: Indicates third-order intermodulation performance in multi-tone environments. |
Pinout & Package
Package: Bare die, 1.54 × 1.41 × 0.1 mm, Ti/Au metallized bond pads and grounded backside; compatible with eutectic (AuSn) or conductive epoxy die attach and thermosonic wire bonding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3 | IF1, IF2 | DC-coupled differential IF outputs requiring external 90° hybrid for image rejection. |
| 2 | RF | DC-coupled 50 Ω matched RF input/output port; primary signal path in up/downconversion. |
| 4 | LO | DC-coupled 50 Ω matched LO input port; accepts sub-harmonic drive at half RF frequency. |
Key Features
| Feature | Design Value |
|---|---|
| Passive Operation | No DC bias required-eliminates bias network complexity and leakage paths in mmWave layouts. |
| Sub-Harmonic Pumping (x2) | LO frequency is half RF band-reduces LO synthesis burden and phase noise impact at RF. |
| High Image Rejection | 30 dB achieved with standard 90° hybrid-enables clean SSB downconversion without image filter. |
| Millimeter-Wave Die Integration | 1.54 × 1.41 mm GaAs die with gold bond pads-optimized for MCM, hybrid, and waveguide-integrated front-ends. |
Applications
| Short-Haul Radios | SATCOM Terminals |
|---|---|
Use Scenario: High-capacity point-to-point wireless links in E-band (60 GHz unlicensed). IC Role / Device Role / Timing Role: Sub-harmonic IRM downconverter translating 57–64 GHz air interface to 0–3 GHz IF for digitization. Use Value: 30 dB image rejection enables full 7 GHz channel bandwidth without image filter insertion loss. | Use Scenario: Mobile satellite communication terminals requiring low-SWaP mmWave front-ends. IC Role / Device Role / Timing Role: Passive IRM in transmit/receive duplexed SATCOM transceivers operating at 54–64 GHz. Use Value: No DC bias simplifies power management; small die size supports compact phased-array antenna modules. |
| Military Radar Receivers | Test & Measurement Systems |
Use Scenario: EW/ECM systems detecting and characterizing hostile radar emissions in 54–64 GHz band. IC Role / Device Role / Timing Role: Image-reject front-end mixer in wideband digital IF receivers. Use Value: DC–3 GHz IF bandwidth supports real-time spectrum analysis of pulsed and chirped threats. | Use Scenario: Vector network analyzers and signal analyzers requiring calibrated mmWave mixing. IC Role / Device Role / Timing Role: Probed-die mixer for on-wafer characterization and calibration reference. Use Value: Measured performance referenced to 50 Ω environment ensures traceable S-parameter modeling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sub-harmonic image-reject mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC-MDB219 | Same die family; optimized for 60–70 GHz RF band (LO 30–35 GHz); 0.2 dB higher conversion loss. | Targeted at higher-frequency 60 GHz+ test equipment and next-gen radar; not interchangeable without LO redesign. | Select HMC-MDB219 only when extending coverage beyond 64 GHz. |
| HMC215MS8G | Active double-balanced mixer (GaAs pHEMT); requires +5 V bias; 5–12 GHz RF range; no sub-harmonic operation. | Used in lower-frequency IF/RF stages; incompatible LO architecture and frequency plan. | Consider only for non-sub-harmonic, bias-enabled designs below 12 GHz. |
Compared with HMC-MDB218, HMC-MDB219 extends upper RF frequency but increases LO demand, while HMC215MS8G offers active gain at lower frequencies but eliminates sub-harmonic advantage and adds bias complexity.
Availability
HMC-MDB218 is available at Aetrix Electronics and suitable for short-haul radios, SATCOM terminals, and military radar receivers requiring stable component supply across extended temperature ranges (–55 °C to +85 °C) and high-reliability hybrid assembly.
Supply support for HMC-MDB218 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, defense, instrumentation, and industrial markets since 1965.
The HMC-MDB218 belongs to Analog Devices' Hittite Microwave MMIC mixer product line, designed specifically for millimeter-wave sub-harmonic image-reject applications in defense and SATCOM systems.
FAQ
What is the recommended LO drive level for optimal performance of the HMC-MDB218?
The HMC-MDB218 achieves specified conversion loss and image rejection with +10 dBm LO drive at 27–32 GHz. Drive levels below +8 dBm increase conversion loss; above +12 dBm risk compression or degradation. Absolute maximum LO is 16 dBm-exceeding this may cause permanent damage. Always verify LO spectral purity, as phase noise directly impacts downconverted signal integrity in the HMC-MDB218.
Does the HMC-MDB218 require DC bias or external power?
No, the HMC-MDB218 is a fully passive GaAs MMIC mixer and requires no DC bias or external power supply. Its Schottky diode-based architecture operates solely on RF and LO signal energy. This eliminates bias networks, reduces thermal load, and simplifies layout in sensitive mmWave circuits-making the HMC-MDB218 ideal for low-power and high-density hybrid microcircuits where the HMC-MDB218 is deployed.
How is image rejection achieved with the HMC-MDB218?
Image rejection in the HMC-MDB218 is achieved externally using a 90° hybrid coupler connected to the IF1 and IF2 ports. The HMC-MDB218 itself provides inherent phase/amplitude balance (1° phase, 0.3 dB amplitude), enabling ≥30 dB image rejection when combined with a high-quality hybrid. Without the hybrid, the HMC-MDB218 functions as a standard double-balanced mixer-not an image-reject configuration.
What packaging options are available for the HMC-MDB218?
The HMC-MDB218 is supplied as a bare die in Gel Pack (GP-2) format per MIL-STD-883 Method 2010, Condition B. Alternate packaging is available upon request from Analog Devices. The die features Ti/Au metallization on all bond pads and grounded backside, supporting eutectic (AuSn) or conductive epoxy die attach and thermosonic wire bonding-standard practice for integrating the HMC-MDB218 into multichip modules and custom RF assemblies.
Can the HMC-MDB218 be used for upconversion as well as downconversion?
Yes, the HMC-MDB218 is bidirectional and supports both upconversion and downconversion. In upconversion mode, it functions as a single-sideband (SSB) upconverter when driven with quadrature IF signals and a sub-harmonic LO. Performance metrics-including conversion loss, IP3, and isolation-are specified under probed-die conditions and apply equally to both modes, provided matching networks and hybrid topology are adapted accordingly for the HMC-MDB218's intended use case.
HMC-MDB218 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Active
- RF Type:
- Radar
- Frequency:
- 54GHz ~ 64GHz
- Number of Mixers:
- 2
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC-MDB218 FAQ
1.How can I place an order for HMC-MDB218 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC-MDB218 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC-MDB218 reliable?
The price and inventory of HMC-MDB218 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC-MDB218 is usually 5 days.
3.What payment methods are accepted for HMC-MDB218?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC-MDB218 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC-MDB218?
HMC-MDB218 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC-MDB218 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC-MDB218?
For technical support, including HMC-MDB218 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC-MDB218 requirements.
6.How does Aetrix verify that HMC-MDB218 is sourced from the original manufacturer or authorized distributors?
All HMC-MDB218 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC-MDB218 meets industry standards.
7.What is the process for return or replacement of HMC-MDB218?
All HMC-MDB218 units undergo pre-shipment inspection (PSI). If there is an issue with HMC-MDB218, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC-MDB218 part is unused and in its original packaging.
Return procedure for HMC-MDB218:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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