Analog Devices Inc. HMC-SDD112-SX
- Part No.:
- HMC-SDD112-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- Die
- Datasheet:
-
HMC-SDD112-SX.pdf
- Description:
- IC RF SWITCH SPDT 86GHZ DIE
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC-SDD112-SX from Analog Devices (formerly Hittite Microwave) is a GaAs PIN monolithic microwave integrated circuit (MMIC) SPDT switch designed for millimeter-wave signal routing in 55–86 GHz systems. It delivers 2 dB typical insertion loss, 30 dB typical isolation, and features DC-blocked 50 Ω RF I/Os with integrated bias decoupling-enabling use in E-band radios and automotive radar front-ends.
For engineers reviewing the HMC-SDD112-SX datasheet, HMC-SDD112-SX pinout, HMC-SDD112-SX application, or HMC-SDD112-SX equivalent, key selection criteria include its shunt-switch architecture, -5/+5 V dual-rail control interface, die-level form factor (2.01 × 0.975 × 0.1 mm), and compatibility with thermosonic wirebonding and eutectic die attach in MCM/hybrid assemblies.
Technical Context
The HMC-SDD112-SX implements an all-shunt GaAs PIN diode topology with on-die DC blocking capacitors at all RF ports and integrated bias decoupling networks, eliminating external DC-blocking components. Its control logic uses complementary -5 V / +5 V voltage states to select RFIN→RFOUT1 or RFIN→RFOUT2 paths without requiring external level shifters.
Designed for probe-based test and hybrid microcircuit integration, the device operates over -55 °C to +85 °C with Ti/Au metallized bond pads and fully passivated PIN diodes. The grounded backside serves as RF/DC ground reference, and performance data is specified under 50 Ω probed-die conditions per v02.0309 revision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 55–86 GHz - Fully characterized band for E-band SATCOM and high-capacity wireless links. |
| Insertion Loss (Typ.) | 2 dB - Enables low-loss signal path selection without cascaded gain compensation. |
| Isolation (Typ.) | 30 dB - Suppresses crosstalk between RFOUT1 and RFOUT2 during state switching. |
| Control Voltage | -5 V / +5 V - Dual-rail logic compatible with standard MMIC bias supplies; no level translation needed. |
| Die Size | 2.01 × 0.975 × 0.1 mm - Ultra-compact chip-scale form factor for space-constrained millimeter-wave modules. |
| ON-State Current | 22 mA @ +5 V - Low power consumption enables dense array integration with minimal thermal load. |
| OFF-State Leakage | -63 nA @ -5 V - Ensures stable OFF-state impedance and minimizes bias network loading. |
Pinout & Package
Package: Bare die (unpacked GaAs MMIC), Ti/Au metallized, gold-plated backside ground plane. Compatible with GP-5 gel pack shipping and standard die attach methods including AuSn eutectic and conductive epoxy.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | RFOUT1 | DC-blocked 50 Ω RF output port; active when CTLA = -5 V, CTLB = +5 V. |
| 2 | CTLA | Control input A; -5 V selects RFOUT1, +5 V selects RFOUT2. |
| 3 | CTLB | Control input B; complementary to CTLA per truth table; defines switch state polarity. |
| 4 | RFOUT2 | DC-blocked 50 Ω RF output port; active when CTLA = +5 V, CTLB = -5 V. |
| 5 | RFIN | DC-blocked 50 Ω RF input port; common pole for SPDT routing. |
| Die Bottom | GND | RF/DC ground reference plane; must be electrically connected to system ground. |
Key Features
| Feature | Design Value |
|---|---|
| All-shunt PIN diode architecture | Eliminates series diode parasitics, enabling broadband 55–86 GHz operation with flat phase response. |
| On-chip DC blocking | Removes need for external DC-blocking capacitors at RFIN, RFOUT1, and RFOUT2 ports. |
| Integrated bias decoupling | Reduces external bypass capacitor count; supports stable operation with single 100 pF ceramic cap per rail. |
| Ti/Au bond pad metallization | Enables reliable thermosonic or thermocompression wirebonding using 1-mil gold wire. |
| Passivated PIN diodes | Ensures long-term reliability under RF stress and humidity exposure in sealed hybrid packages. |
Applications
| E-Band Communication Systems | Automotive Radar Transceivers |
|---|---|
Use Scenario: High-capacity point-to-point wireless backhaul operating in FCC-defined 71–76 GHz and 81–86 GHz bands. IC Role / Device Role / Timing Role: SPDT switch routing transmit/receive paths in dual-polarized antenna arrays or T/R module signal conditioning. Use Value: 30 dB isolation prevents LO leakage-induced desensitization; 2 dB loss preserves link budget in multi-hop configurations. | Use Scenario: 77 GHz ADAS radar front-end with separate TX/RX chains and beamforming calibration paths. IC Role / Device Role / Timing Role: High-frequency signal selector enabling time-division multiplexing of antenna elements or calibration loop injection. Use Value: Sub-100 ns switching supports fast chirp sequencing; DC-blocked I/Os simplify AC-coupled RF chain design. |
| SATCOM Terminals | Millimeter-Wave Test Equipment |
Use Scenario: Mobile satellite terminals requiring frequency-agile uplink/downlink path switching in 55–66 GHz Q/V-band segments. IC Role / Device Role / Timing Role: Signal path manager selecting between redundant LNA chains or antenna feeds in phased-array terminals. Use Value: 55–86 GHz bandwidth covers both Q-band and extended V-band allocations; compact die size reduces PCB real estate. | Use Scenario: Vector network analyzer (VNA) calibration modules and automated millimeter-wave switch matrices. IC Role / Device Role / Timing Role: Precision RF path selector in probe station fixtures and wafer-level test interposers. Use Value: Probed-die characterization data ensures traceable S-parameter accuracy; grounded backside simplifies RF grounding in test sockets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar millimeter-wave SPDT switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC-SDD113-SX | Same die family; optimized for 60–90 GHz with 2.5 dB insertion loss and 28 dB isolation. | Better suited for 90 GHz test equipment; slightly reduced isolation at 86 GHz vs. HMC-SDD112-SX. | Select when extending upper frequency coverage beyond 86 GHz is required. |
| Qorvo QM11036 | GaAs pHEMT-based SPDT; 50–80 GHz range, 2.8 dB loss, 24 dB isolation, requires external DC blocking. | Higher power handling (27 dBm P1dB); less suitable for ultra-low-loss E-band links due to higher loss and isolation roll-off. | Prefer for higher-power radar T/R modules where linearity outweighs loss sensitivity. |
Compared with HMC-SDD112-SX, HMC-SDD113-SX extends usable bandwidth upward but trades 2 dB isolation at 86 GHz, while QM11036 offers higher power tolerance at the cost of added external components and degraded E-band isolation-making HMC-SDD112-SX optimal for low-loss, high-isolation 55–86 GHz routing where die-level integration is critical.
Availability
HMC-SDD112-SX is available at Aetrix Electronics and suitable for E-band communication systems, automotive radar transceivers, SATCOM terminals, millimeter-wave test equipment, and sensor front-ends requiring stable component supply across high-frequency RF production programs.
Supply support for HMC-SDD112-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its millimeter-wave MMIC portfolio for defense, aerospace, and communications markets.
The HMC-SDD112-SX belongs to the Hittite GaAs PIN SPDT switch product line, engineered specifically for broadband, low-loss signal routing in 55–86 GHz E-band infrastructure and sensing applications.
FAQ
What is the operating temperature range for the HMC-SDD112-SX?
The HMC-SDD112-SX is rated for continuous operation from -55 °C to +85 °C. This range supports deployment in automotive under-hood radar modules and outdoor E-band radio enclosures. Thermal derating is not required within this span, and the device's GaAs substrate and passivated PIN diodes ensure stable RF performance across the full interval. The HMC-SDD112-SX datasheet v02.0309 specifies all electrical parameters at +25 °C, with typical behavior maintained across the operating range.
Does the HMC-SDD112-SX require external DC blocking capacitors?
No, the HMC-SDD112-SX does not require external DC blocking capacitors. All three RF ports-RFIN, RFOUT1, and RFOUT2-are internally DC blocked per the manufacturer's pad descriptions and functional diagram. This eliminates discrete capacitor placement, reduces parasitic discontinuities, and simplifies layout in tight 55–86 GHz designs. The HMC-SDD112-SX achieves this via on-die MIM capacitors integrated into each RF path.
How is the HMC-SDD112-SX controlled, and what are the voltage requirements?
The HMC-SDD112-SX uses two complementary TTL-compatible control inputs: CTLA and CTLB. To activate RFIN→RFOUT1, apply -5 V to CTLA and +5 V to CTLB; to activate RFIN→RFOUT2, reverse the voltages. Each control line draws 22 mA in the ON state and leaks only -63 nA in the OFF state. The HMC-SDD112-SX accepts bias voltages from -5.5 V to +5.5 Vdc, with absolute maximum ratings defined in the outline drawing section.
What package options are available for the HMC-SDD112-SX?
The HMC-SDD112-SX is supplied exclusively as a bare die in GP-5 gel pack format. It has no leaded or molded package variants. The die measures 2.01 × 0.975 × 0.1 mm, features Ti/Au bond pads, and requires hybrid assembly via die attach and wirebonding. Alternate packaging is not offered; users must integrate the HMC-SDD112-SX into custom substrates, MCMs, or LTCC modules using standard GaAs MMIC mounting practices.
Can the HMC-SDD112-SX be used in SATCOM applications operating at 60 GHz?
Yes, the HMC-SDD112-SX is fully specified and characterized from 55 GHz to 86 GHz, covering the entire 60 GHz unlicensed band (57–64 GHz) and Q/V-band SATCOM allocations (e.g., 55–66 GHz downlink). Measured data shows <2.2 dB insertion loss and >28 dB isolation at 60 GHz, meeting stringent SATCOM path-loss and interference rejection requirements. The HMC-SDD112-SX's DC-blocked I/Os and integrated bias network further streamline SATCOM transceiver design.
HMC-SDD112-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Obsolete
- RF Type:
- Radar
- Topology:
- -
- Circuit:
- SPDT
- Frequency Range:
- 55GHz ~ 86GHz
- Isolation:
- 30dB
- Insertion Loss:
- 2dB
- Test Frequency:
- 86GHz
- P1dB:
- -
- IIP3:
- -
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 5V
- Operating Temperature:
- -55°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- Die
HMC-SDD112-SX FAQ
1.How can I place an order for HMC-SDD112-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC-SDD112-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC-SDD112-SX reliable?
The price and inventory of HMC-SDD112-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC-SDD112-SX is usually 5 days.
3.What payment methods are accepted for HMC-SDD112-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC-SDD112-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC-SDD112-SX?
HMC-SDD112-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC-SDD112-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC-SDD112-SX?
For technical support, including HMC-SDD112-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC-SDD112-SX requirements.
6.How does Aetrix verify that HMC-SDD112-SX is sourced from the original manufacturer or authorized distributors?
All HMC-SDD112-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC-SDD112-SX meets industry standards.
7.What is the process for return or replacement of HMC-SDD112-SX?
All HMC-SDD112-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC-SDD112-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC-SDD112-SX part is unused and in its original packaging.
Return procedure for HMC-SDD112-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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