Renesas HN58V66AP10E
- Part No.:
- HN58V66AP10E
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
HN58V66AP10E.pdf
- Description:
- 64 K EEPROM (8-KWORD X 8-BIT)
- Quantity:
- Payment:

- Shipping:

Inventory:288
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Product details
Overview
HN58V66AP10E from Renesas Technology is a 64-kbit (8-kword × 8-bit) parallel EEPROM with Ready/Busy and RES reset protection functions, operating across 2.7–5.5 V supply and supporting −40°C to +85°C industrial temperature range. It features 100 ns max access time at 2.7–4.5 V, 64-byte page write capability (10 ms max), and software data protection - deployed in embedded control modules requiring nonvolatile parameter storage with power-cycle resilience.
For engineers reviewing the HN58V66AP10E datasheet, HN58V66AP10E pinout, HN58V66AP10E application, or HN58V66AP10E equivalent, key selection considerations include RES-enabled hardware write inhibit, JEDEC-compliant byte-wide interface timing, RDY/Busy status signaling for asynchronous write completion detection, and compatibility with legacy 28-pin DIP-based microcontroller bus architectures.
Technical Context
The HN58V66AP10E implements a CMOS/MNOS hybrid memory architecture enabling 105 erase/write cycles in page mode and 10-year data retention. Its control logic supports dual write initiation methods (WE- or CE-controlled), automatic address/data latching on falling edges, and internal high-voltage generation for programming without external VPP.
It integrates on-chip address/data/CE/OE/WE latches, data polling via I/O7 inversion, toggle-bit verification on I/O6, and noise-immune control pin filtering (<15 ns rejection). The RES pin provides hardware-level write/read inhibition during power transitions - a feature exclusive to the HN58V66A series and absent in HN58V65A variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 64 kbit (8,192 × 8-bit), directly addressable via A0–A12 with no external decoding required |
| Supply voltage | 2.7–5.5 V - enables direct interfacing with 3.3 V and 5 V microcontrollers without level-shifting |
| Access time | 100 ns max (2.7–4.5 V), 70 ns max (4.5–5.5 V) - meets timing budgets of 10 MHz CPU buses |
| Write cycle time | 10 ms max per byte or 64-byte page - deterministic latency for firmware update routines |
| Endurance & retention | 100,000 page-program cycles; >10 years data retention - suitable for field-upgradable calibration tables |
| Operating temperature | −40°C to +85°C - qualified for industrial control, instrumentation, and telecom infrastructure |
| Package | 600-mil 28-pin plastic DIP (DP-28V), lead-free - compatible with through-hole assembly and legacy test fixtures |
Pinout & Package
HN58V66AP10E uses a 28-pin dual in-line package (DP-28V) with 0.6-inch width, 2.54 mm pitch, and lead-free finish. Pin 1 is located at bottom-left corner when notch faces up.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VCC | Power supply | Primary 2.7–5.5 V supply input; decoupling capacitor placement critical for write stability |
| 2 WE | Write enable | Falling-edge-triggered latch for address/data; initiates byte or page programming sequence |
| 3 RES | Reset input | Active-low hardware write/read inhibit; must be held low during VCC ramp-up/down to prevent corruption |
| 4–11 A8–A0 | Address inputs | Lower 9 address bits; A0–A12 fully decode 8K words - A8–A11 mapped to pins 4–7 per datasheet top view |
| 12 A11 | Address input | MSB of page address (A6–A12 latched on first WE/CE fall); enables 64-byte boundary alignment |
| 13 OE | Output enable | Controls output buffer tri-state; used with CE/WE to implement read gating in shared bus systems |
| 14 A10 | Address input | Part of 13-bit address bus; A10–A12 define page boundaries for accelerated multi-byte writes |
| 15 CE | Chip enable | Falling-edge latch alternative to WE; allows CE-controlled write initiation for simplified timing |
| 16–23 I/O7–I/O0 | Data I/O | Bidirectional 8-bit data bus; supports data polling (I/O7) and toggle-bit verification (I/O6) |
| 24 RDY/Busy | Status output | Open-drain active-low signal indicating internal write progress; replaces need for timeout polling |
| 25 A12 | Address input | Highest address bit; completes 13-bit addressing for full 8K-word space |
| 26–27 A7–A1 | Address inputs | Mid-range address bits; collectively define word location within selected 64-byte page |
| 28 VSS | Ground | Reference return path; requires low-impedance connection to minimize ground bounce during write |
Key Features
| Feature | Design Value |
|---|---|
| Hardware RES write protection | Prevents unintended reads/writes during power-on/off transients by disabling all I/O when RES = low |
| 64-byte page programming | Reduces firmware update time by 64× vs. byte-write - critical for rapid configuration loading in factory test |
| RDY/Busy status pin | Eliminates fixed-delay wait states; enables precise synchronization of host CPU with internal write completion |
| Software data protection | Three-byte unlock sequence (AA/55/A0) prevents accidental writes from noise or runaway code execution |
| JEDEC byte-wide compliance | Guarantees interoperability with standard 8-bit microprocessor buses (e.g., 8051, Z80, 68K derivatives) |
| MNOS memory cell technology | Delivers 105 endurance and 10-year retention without wear-leveling firmware overhead |
Applications
| Industrial PLC Configuration Storage | Medical Device Calibration Data |
|---|---|
|
Use Scenario: Storing user-adjusted setpoints, alarm thresholds, and sensor compensation coefficients in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile parameter register accessed via parallel bus during boot and runtime reconfiguration. Use Value: RES pin ensures zero risk of corruption during brown-out events common in factory floor power environments. |
Use Scenario: Retaining factory-calibrated ADC offset/gain values and patient-specific therapy parameters in infusion pumps. IC Role / Device Role / Timing Role: Secure, tamper-resistant memory mapped to microcontroller's external memory space. Use Value: 10-year data retention and 100,000-cycle endurance meet ISO 13485 requirements for life-critical device longevity. |
| Telecom Line Card Firmware Patch | Automotive Body Control Module Settings |
|
Use Scenario: Hosting hot-swappable firmware patches for DSLAM line cards without requiring full board reset. IC Role / Device Role / Timing Role: Parallel EEPROM acting as secondary boot image store, accessed during field upgrade. Use Value: 100 ns access time enables direct execution from bus without caching, reducing BOM count. |
Use Scenario: Saving driver preferences (seat position, mirror angle, climate presets) in automotive BCMs. IC Role / Device Role / Timing Role: Low-power standby memory retaining data during vehicle ignition-off periods. Use Value: 110 µW max standby current minimizes battery drain over months of parking duration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar EEPROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT28C64B-15PU | No RES pin; 150 ns access time; 5 V only (4.5–5.5 V); 104 endurance | Lacks hardware reset protection; unsuitable for mixed-voltage or noisy power-rail environments | Select only if system lacks RES signal routing and operates strictly at 5 V with relaxed timing |
| FM24CL64-G | I²C interface; 3.4 MHz clock; no parallel bus; 106 endurance; 10-year retention | Requires I²C master and software protocol stack; incompatible with legacy 8-bit parallel bus designs | Choose for new designs prioritizing pin count reduction and higher endurance, not drop-in replacement |
Compared with AT28C64B-15PU and FM24CL64-G, the HN58V66AP10E uniquely combines RES-based hardware write inhibit, JEDEC-compliant parallel timing, and industrial temperature support - making it irreplaceable in retrofitting legacy 28-pin DIP-based systems requiring robust power-cycle immunity.
Availability
HN58V66AP10E is available at Aetrix Electronics and suitable for industrial PLC configuration storage, medical device calibration data retention, and telecom line card firmware patching requiring stable component supply across extended product lifecycles.
Supply support for HN58V66AP10E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Technology Corp. (now part of Renesas Electronics Corporation) is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and memory solutions for industrial and automotive markets.
The HN58V66AP10E belongs to Renesas' legacy parallel EEPROM product line, designed specifically for reliable nonvolatile storage in resource-constrained embedded systems with strict power sequencing and long-term data integrity requirements.
FAQ
What is the function of the RES pin on the HN58V66AP10E?
The RES pin on the HN58V66AP10E is an active-low hardware reset input that disables all read and write operations when pulled low. It ensures data integrity during power-on/off transitions by placing the device in an unprogrammable state - a feature exclusive to the HN58V66A series and not present in HN58V65A variants. For reliable operation, RES must be held low until VCC stabilizes, then driven high for ≥10 ms before initiating any access to the HN58V66AP10E.
Does the HN58V66AP10E support both byte and page write modes?
Yes, the HN58V66AP10E supports both byte and 64-byte page write modes. Byte writes complete in ≤10 ms, while page writes (1–64 bytes) also require ≤10 ms total - significantly accelerating bulk updates. Page writes require A6–A12 to remain stable during the sequence, and each subsequent byte must be loaded within 30 µs of the prior WE or CE falling edge. The HN58V66AP10E automatically detects page boundaries and executes internal programming upon CE or WE high hold (>100 µs).
How does the RDY/Busy pin operate on the HN58V66AP10E?
The RDY/Busy pin on the HN58V66AP10E is an open-drain output that goes low (VOL) at the start of any internal write operation and returns to high-impedance upon completion. It eliminates the need for fixed delay loops or data polling: host systems can wait for RDY/Busy to go high before issuing the next command. This behavior is electrically identical across all HN58V66A-series variants, including the HN58V66AP10E, and works independently of software data protection status.
Is the HN58V66AP10E pin-compatible with other members of the HN58V66A family?
Yes, the HN58V66AP10E is pin-compatible with all HN58V66A-series devices in the DP-28/DP-28V package, including HN58V66API-10 and HN58V66API-10E. All share identical pinout, electrical characteristics, and timing - differing only in lead-free compliance (E suffix) and minor packaging tolerances. However, it is not pin-compatible with HN58V65A-series parts due to NC vs. RES pin assignment at pin 3, nor with SOP or TSOP variants despite identical logic functionality.
What is the maximum operating frequency supported by the HN58V66AP10E interface?
The HN58V66AP10E does not specify a maximum clock frequency because it is an asynchronous parallel EEPROM - it has no internal clock input. Instead, its timing is governed by setup/hold requirements relative to CE, OE, and WE signals. At 5.5 V, it supports read cycles with tACC ≤ 70 ns, enabling reliable operation with 10–14 MHz microcontroller bus clocks when proper timing margins are observed. Write cycles are self-timed (≤10 ms) and do not depend on external clock rate.
HN58V66AP10E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
HN58V66AP10E FAQ
1.How can I place an order for HN58V66AP10E through Aetrix?
Please submit a Request for Quotation (RFQ) for HN58V66AP10E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HN58V66AP10E reliable?
The price and inventory of HN58V66AP10E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HN58V66AP10E is usually 5 days.
3.What payment methods are accepted for HN58V66AP10E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HN58V66AP10E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HN58V66AP10E?
HN58V66AP10E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HN58V66AP10E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HN58V66AP10E?
For technical support, including HN58V66AP10E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HN58V66AP10E requirements.
6.How does Aetrix verify that HN58V66AP10E is sourced from the original manufacturer or authorized distributors?
All HN58V66AP10E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HN58V66AP10E meets industry standards.
7.What is the process for return or replacement of HN58V66AP10E?
All HN58V66AP10E units undergo pre-shipment inspection (PSI). If there is an issue with HN58V66AP10E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HN58V66AP10E part is unused and in its original packaging.
Return procedure for HN58V66AP10E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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