Texas Instruments HPA00126DGGR
- Part No.:
- HPA00126DGGR
- Manufacturer:
- Texas Instruments
- Package:
- -
- Datasheet:
-
HPA00126DGGR.pdf
- Description:
- IC PLL DDR CLOCK DRIVER 48TSSOP
- Quantity:
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Inventory:4,045
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Product details
Overview
HPA00126DGGR from Texas Instruments is a 2.5-V phase-locked-loop (PLL) clock driver IC designed for high-performance DDR memory clock distribution. It delivers 1-to-10 differential SSTL-2 clock outputs with 60–220 MHz operating frequency, ±35 ps cycle-to-cycle jitter, ±50 ps static phase offset, and low-power shutdown mode. It serves as a zero-delay fan-out buffer in DDR400/333/266/200 memory modules.
For engineers reviewing the HPA00126DGGR datasheet, HPA00126DGGR pinout, HPA00126DGGR application, or HPA00126DGGR equivalent, this page provides verified technical context, validated pin functions, confirmed DDR timing compliance (JESD82-1/JESD82-1A), real-world output skew (40 ps), and alternative options with documented functional alignment for memory subsystem clocking.
Technical Context
The HPA00126DGGR implements a PLL-based architecture to achieve zero-delay clock distribution with synchronized feedback path via dedicated FBIN/FBOUT terminals. Its analog PLL core operates from a 2.5-V AVDD supply and supports spread-spectrum clocking for EMI reduction.
It features dual power domains: VDDQ (2.5 V) for digital I/O and AVDD (2.5 V) for analog PLL operation, with AGND isolation. Power-down control (PWRDWN) disables all outputs to high-impedance and shuts down the PLL when asserted low or when input frequency drops below ~10 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Frequency | 60–220 MHz - supports PC1600 through PC3200 DDR memory clock rates |
| Jitter (Cycle-Cycle) | ±35 ps - ensures tight timing margin for DDR source-synchronous interfaces |
| Static Phase Offset | ±50 ps - minimizes deterministic skew between input and buffered outputs |
| Output Skew | 40 ps - guarantees matched propagation delay across all 10 Y/Y output pairs |
| Supply Voltages | VDDQ = 2.5 V, AVDD = 2.5 V - separate analog/digital rails prevent noise coupling into PLL |
| Package | TSSOP-48 (DGG) - surface-mount package with 0.5 mm pitch, JEDEC MO-153 compliant |
| Temperature Range | –40°C to +85°C - qualified for industrial-grade memory module deployment |
Pinout & Package
The HPA00126DGGR is housed in a 48-pin TSSOP (DGG) package with 0.5 mm pitch, 12.6 mm × 6.2 mm body size, and 1.2 mm max height per JEDEC MO-153.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK, CLK | Differential clock input | Accepts LVDS/SSTL-2 reference clock; requires 120 Ω termination for optimal jitter performance |
| FBIN, FBIN | Differential feedback input | Connects to FBOUT to close PLL loop; enables zero-delay operation in DDR systems |
| FBOUT, FBOUT | Differential feedback output | Provides phase-aligned copy of CLK for external feedback path; routed back to FBIN |
| Y0–Y9, Y0–Y9 | Differential clock outputs | 10 fully buffered SSTL-2 output pairs; each pair drives one DDR SDRAM DQS or CK/CK# line |
| PWRDWN | Power-down control input | Active-low signal that places all outputs in high-Z and disables PLL; used for dynamic power gating |
| VDDQ, AVDD, GND, AGND | Power and ground terminals | VDDQ powers digital I/O; AVDD powers analog PLL; AGND isolates PLL ground from noisy digital return paths |
Key Features
| Feature | Design Value |
|---|---|
| Spread-spectrum clock compatibility | Enables EMI reduction in dense PCB layouts without requiring system-level clock modulation changes |
| External feedback path (FBIN/FBOUT) | Allows precise loop compensation and board trace delay compensation for true zero-delay operation |
| Low-power shutdown mode | Reduces quiescent current to <100 µA when PWRDWN is low or input clock stops, extending system standby time |
| JEDEC DDR compliance | Fully meets JESD82-1 (DDR200/266/333) and exceeds proposed JESD82-1A (DDR400) specifications |
| Dual 2.5-V supply operation | Separates analog PLL (AVDD) and digital I/O (VDDQ) domains to suppress supply-induced jitter and crosstalk |
Applications
| DDR Memory Modules | Server Memory Subsystems |
|---|---|
Use Scenario: Distributing synchronized clock signals to multiple DDR SDRAM chips on a UDIMM or RDIMM module. IC Role / Device Role / Timing Role: Zero-delay fan-out buffer generating 10 matched SSTL-2 clock pairs (CK/CK#) from a single reference clock. Use Value: Maintains <40 ps inter-output skew and ±50 ps static phase offset to meet DDR400 tAC and tDQSCK timing budgets. | Use Scenario: Clock distribution in multi-rank server DIMMs where trace length matching and jitter accumulation are critical. IC Role / Device Role / Timing Role: PLL-based clock repeater with external feedback to compensate for PCB propagation delays across long traces. Use Value: Enables reliable operation at 200 MHz (PC3200) with ±35 ps cycle-to-cycle jitter, meeting JEDEC JESD82-1A requirements. |
| Industrial Control Memory Interfaces | Networking Equipment Memory Buffers |
Use Scenario: Providing robust clocking for DDR2 memory in programmable logic controllers (PLCs) operating in extended temperature environments. IC Role / Device Role / Timing Role: Industrial-temperature-rated clock driver supporting –40°C to +85°C operation with stable PLL lock. Use Value: Delivers guaranteed 60–220 MHz operation and low-power shutdown (IDDPD <100 µA) for energy-constrained embedded systems. | Use Scenario: Fan-out buffering for DDR memory in packet processing ASICs within telecom line cards. IC Role / Device Role / Timing Role: High-fanout clock repeater with spread-spectrum support to reduce radiated emissions in FCC/CE-compliant designs. Use Value: Meets EMI limits without sacrificing timing integrity-verified compatible with spread-spectrum clock generators per datasheet. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar clock distribution applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CDCVF2507DGG | 7-output version; identical PLL architecture, same 60–220 MHz range and jitter specs | Suitable for smaller memory modules or systems requiring fewer clock copies | Select when 7 outputs suffice and board space or BOM count optimization is prioritized |
| CDCLVD1208RGTT | LVDS output format (not SSTL-2); 8 outputs; no integrated PLL (uses external reference) | Used in non-DDR applications like FPGA clock trees or test equipment where LVDS signaling is preferred | Choose only if interface voltage standard differs and external PLL control is acceptable |
Compared with HPA00126DGGR, CDCVF2507DGG offers reduced fan-out but identical DDR timing compliance and footprint compatibility, while CDCLVD1208RGTT trades SSTL-2 DDR compatibility for LVDS flexibility and eliminates PLL lock time overhead at the cost of external loop design.
Availability
HPA00126DGGR is available at Aetrix Electronics and suitable for DDR memory modules, server DIMMs, industrial PLCs, and networking line cards requiring stable component supply across commercial and industrial temperature ranges.
Supply support for HPA00126DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and clock solutions with decades of DDR timing expertise.
The CDCVF857 product line-including HPA00126DGGR-is engineered specifically for high-speed DDR memory clock distribution, emphasizing low jitter, zero-delay operation, and JEDEC-compliant SSTL-2 signaling.
FAQ
What is the function of the AVDD and AGND pins on the HPA00126DGGR?
The AVDD and AGND pins supply and reference the analog PLL core of the HPA00126DGGR. AVDD must be a clean 2.5-V source decoupled with a 2200-pF capacitor near the pin, and AGND must be isolated from digital ground to minimize noise injection into the PLL. This separation ensures low-jitter performance and stable phase-lock acquisition.
Does the HPA00126DGGR support spread-spectrum clocking (SSC)?
Yes, the HPA00126DGGR explicitly supports spread-spectrum clocking as stated in its official TI datasheet. Its PLL architecture tracks modulated input clocks, reducing electromagnetic interference without compromising output jitter or phase accuracy-making it suitable for FCC/CE-compliant DDR systems.
What is the stabilization time required for the HPA00126DGGR PLL to achieve lock?
The HPA00126DGGR requires 10 µs to achieve PLL lock after power-up or re-enabling from power-down mode, as specified in the TI SCAS047F datasheet. This stabilization time applies only in PLL mode; bypass mode recovery takes just 30 ns. Timing-critical systems must account for this lock time before sampling valid outputs.
Can the HPA00126DGGR operate with a 2.6-V supply instead of 2.5 V?
Yes, the HPA00126DGGR is rated for dual 2.6-V or 2.5-V supplies per its datasheet. The recommended operating range for VDDQ and AVDD is 2.3 V to 2.7 V, so 2.6 V falls safely within specification and maintains full compliance with JESD82-1 DDR timing margins and output drive strength.
How does the PWRDWN pin affect the HPA00126DGGR's output state and power consumption?
When PWRDWN is driven low, the HPA00126DGGR disables all Y/Y and FBOUT/FBOUT outputs to high-impedance and shuts down the PLL, reducing total supply current to <100 µA. This low-power mode is automatically entered if the input clock frequency drops below ~10 MHz, enabling dynamic power management in idle memory subsystems.
HPA00126DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- -
- PLL:
- -
- Input:
- -
- Output:
- -
- Number of Circuits:
- -
- Ratio - Input:Output:
- -
- Differential - Input:Output:
- -
- Frequency - Max:
- -
- Divider/Multiplier:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Mounting Type:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- -
HPA00126DGGR FAQ
1.How can I place an order for HPA00126DGGR through Aetrix?
Please submit a Request for Quotation (RFQ) for HPA00126DGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that HPA00126DGGR is sourced from the original manufacturer or authorized distributors?
All HPA00126DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HPA00126DGGR meets industry standards.
7.What is the process for return or replacement of HPA00126DGGR?
All HPA00126DGGR units undergo pre-shipment inspection (PSI). If there is an issue with HPA00126DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HPA00126DGGR part is unused and in its original packaging.
Return procedure for HPA00126DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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