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Texas Instruments HPA00719RSVR
- Part No.:
- HPA00719RSVR
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
HPA00719RSVR.pdf
- Description:
- IC TXRX BUS DUAL SUPPLY 16UQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,710
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Product details
Overview
HPA00719RSVR from Texas Instruments is a 4-bit dual-supply noninverting bus transceiver enabling bidirectional voltage-level translation between 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V domains. It features independent VCCA (1.2–3.6V) and VCCB (1.2–3.6V) rails, 4.6V I/O tolerance, Ioff partial-power-down support, and up to 380Mbps data rate (1.8V→3.3V). It serves in mixed-voltage system interconnects such as processor-to-peripheral interfaces.
For engineers reviewing the HPA00719RSVR datasheet, HPA00719RSVR pinout, HPA00719RSVR application, or HPA00719RSVR equivalent, key selection criteria include dual-rail configurability, 16-pin UQFN (RSV) package footprint, direction-control per channel, 3-state output enable logic referenced to VCCA, and verified 100mA latch-up immunity per JESD78 Class II.
Technical Context
The HPA00719RSVR implements two independent 2-bit bidirectional channels, each with dedicated DIR and OE inputs referenced to VCCA. Its dual-rail architecture isolates A-port (VCCA-referenced) and B-port (VCCB-referenced) logic domains, enabling asynchronous translation without clocking or timing constraints.
Each channel supports configurable direction flow: low DIR enables B→A transmission; high DIR enables A→B transmission. OE high forces both ports into high-impedance state. The Ioff circuit disables outputs when either VCCA or VCCB = 0V, preventing backflow current during partial power-down.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA Range | 1.2V to 3.6V - powers A-port I/Os and all control inputs (DIR/OE), defining input threshold references. |
| VCCB Range | 1.2V to 3.6V - powers B-port I/Os only; independent of VCCA for true dual-voltage operation. |
| Max Data Rate | 380Mbps - achievable only for 1.8V→3.3V translation; drops to 100Mbps for 1.2V translation due to drive strength limits. |
| I/O Voltage Tolerance | 4.6V - allows safe interfacing with higher-voltage systems without external protection diodes. |
| Ioff Current | ±1μA max - ensures negligible leakage when either supply is off, critical for hot-swap and power-gating designs. |
| Latch-up Immunity | >100mA per JESD78 Class II - guarantees robustness against transient current injection in noisy industrial environments. |
| ESD Protection | 8kV HBM, 150V MM, 1kV CDM - meets stringent handling requirements for automated assembly and field-replaceable modules. |
Pinout & Package
The HPA00719RSVR uses the RSV package: 16-pin ultra-thin quad flat no-lead (UQFN), 2.6mm × 1.8mm body, 0.4mm pitch, thermal pad on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction-control input (per channel) | Referenced to VCCA; low = B→A data flow, high = A→B data flow - enables independent channel routing. |
| 1OE, 2OE | Output-enable input (per channel) | Referenced to VCCA; high = 3-state (Hi-Z) on respective port outputs - allows dynamic bus isolation. |
| 1A1, 1A2, 2A1, 2A2 | A-port I/O (VCCA-referenced) | Bi-directional data lines tied to VCCA domain; tolerate up to 4.6V regardless of VCCA setting. |
| 1B1, 1B2, 2B1, 2B2 | B-port I/O (VCCB-referenced) | Bi-directional data lines tied to VCCB domain; tolerate up to 4.6V regardless of VCCB setting. |
| VCCA | A-port supply | Powers A-side logic and all control inputs; sets VIH/VIL thresholds for DIR/OE pins. |
| VCCB | B-port supply | Powers B-side logic only; fully decoupled from VCCA for independent voltage domain management. |
| GND | Ground reference | Common return for both domains; required for stable noise margin and ESD path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent 2-bit channels | Enables concurrent A↔B and A↔B translation with separate DIR/OE control - eliminates need for two discrete transceivers. |
| VCCA-referenced control logic | DIR/OE thresholds track VCCA, ensuring reliable operation across 1.2V–3.6V supply range without level-shifting control signals. |
| VCC isolation behavior | If either VCCA or VCCB = GND, both ports enter Hi-Z - prevents backfeeding and protects unpowered subsystems. |
| 16-pin UQFN (RSV) package | 2.6mm × 1.8mm footprint with thermal pad - supports high-density PCB layouts and efficient heat dissipation in space-constrained applications. |
| Configurable 1.2V–3.6V translation | Valid for all combinations among 1.2V/1.5V/1.8V/2.5V/3.3V nodes - eliminates need for multiple fixed-ratio translators in multi-voltage SoC designs. |
Applications
| Processor-to-Peripheral Interconnect | Multi-Rail FPGA I/O Bridging |
|---|---|
Use Scenario: Connecting a 1.8V ARM Cortex-M7 microcontroller to a 3.3V UART transceiver and 1.2V sensor hub. IC Role / Device Role / Timing Role: Bidirectional level translator managing simultaneous voltage-domain crossings on shared data lines. Use Value: Eliminates discrete resistor-divider or MOSFET-based solutions, reducing BOM count and layout area while guaranteeing 380Mbps throughput on 1.8V→3.3V paths. | Use Scenario: Enabling communication between a 2.5V FPGA bank and 1.5V DDR3L memory interface plus 3.3V PMIC telemetry bus. IC Role / Device Role / Timing Role: Dual-channel voltage translator providing isolated direction control per bus segment under independent power domains. Use Value: Supports concurrent 2.5V↔1.5V and 2.5V↔3.3V translation with sub-3ns propagation delay, preserving signal integrity at >100MHz clock rates. |
| Hot-Swappable Module Interface | Industrial PLC Backplane Link |
Use Scenario: Interfacing a powered 3.3V main controller board with an unpowered 1.2V daughter card during insertion. IC Role / Device Role / Timing Role: Ioff-enabled translator that blocks back-current when VCCB = 0V, preventing damage to live circuitry. Use Value: Enables safe hot-plug operation without auxiliary power sequencing logic or external blocking FETs. | Use Scenario: Isolating 24V-powered I/O modules (3.3V logic) from a 1.8V real-time Ethernet controller in a DIN-rail mounted PLC. IC Role / Device Role / Timing Role: Robust bidirectional translator with 100mA latch-up immunity and 8kV HBM ESD rating for harsh factory-floor environments. Use Value: Maintains data integrity across noisy 24V backplanes while surviving repeated electrostatic discharge events common in industrial maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AVC4T245RGER | Same die, 16-pin WQFN (RGY) package (4mm × 3.5mm); higher thermal resistance (RθJA = 68.8°C/W vs 146.9°C/W for RSV). | Preferred where board space allows larger footprint and thermal performance is prioritized over miniaturization. | Select RGER for higher-power or thermally constrained designs; RSV (HPA00719RSVR) is optimal for ultra-compact portable or wearable electronics. |
| SN74LVC4T245PWR | Lower max data rate (240Mbps), no Ioff, 1.65–3.6V VCC range only - lacks 1.2V/1.5V support and partial-power-down capability. | Suitable only for 1.8V+ systems without hot-swap or deep-sleep requirements. | Choose PWR only if cost is primary constraint and 1.2V/1.5V compatibility or Ioff is not required. |
Compared with SN74AVC4T245RGER and SN74LVC4T245PWR, HPA00719RSVR uniquely combines 1.2V operation, Ioff, 4.6V tolerance, and the smallest UQFN package - making it the sole option for miniaturized, multi-rail, and power-gated embedded systems requiring full voltage flexibility.
Availability
HPA00719RSVR is available at Aetrix Electronics and suitable for industrial automation, portable medical devices, and automotive infotainment head units requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for HPA00719RSVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with core expertise in precision analog, power management, and high-speed interface ICs.
The SN74AVC4T245 family - including HPA00719RSVR - was designed specifically for low-voltage, multi-rail system interconnects in space-constrained, power-sensitive applications such as handheld computing, IoT edge nodes, and modular industrial controllers.
FAQ
What is the minimum operating voltage for HPA00719RSVR on VCCA and VCCB?
HPA00719RSVR supports 1.2V minimum on both VCCA and VCCB, enabling direct interfacing with 1.2V logic families such as LPDDR4 I/O and ultra-low-power microcontrollers. Operation below 1.2V is not characterized or guaranteed, and VIH/VIL thresholds scale linearly with VCCA down to this limit.
Can HPA00719RSVR translate between 1.2V and 3.3V in both directions simultaneously?
Yes - HPA00719RSVR supports bidirectional translation between 1.2V and 3.3V domains. One channel (e.g., 1A↔1B) can translate 1.2V→3.3V while the other (2A↔2B) handles 3.3V→1.2V, provided VCCA = 1.2V and VCCB = 3.3V (or vice versa), with DIR set accordingly per channel.
Does HPA00719RSVR require external pull-up resistors on DIR or OE pins?
No - HPA00719RSVR has no internal pull-ups on DIR or OE. To ensure defined logic states during power-up, external pull-up resistors to VCCA are recommended for OE pins; DIR may be driven directly by a controller GPIO. TI recommends ≥10kΩ pull-ups for OE to minimize current draw while ensuring fast Hi-Z entry.
What is the thermal pad connection requirement for the RSV package of HPA00719RSVR?
The thermal pad on the underside of the HPA00719RSVR RSV package must be soldered to a solid copper pour connected to GND. This provides both thermal relief (reducing RθJA by ~15°C/W) and ESD current shunting. Omitting the thermal pad connection degrades reliability and violates JEDEC MO-220 packaging standards.
Is HPA00719RSVR compatible with 1.5V DDR2 memory interfaces?
Yes - HPA00719RSVR is fully specified for 1.5V operation on both VCCA and VCCB, meeting DDR2 SSTL_15 input thresholds and drive strength requirements. Its 150Mbps max data rate at 1.5V translation aligns with DDR2-400 (200MT/s) signaling, and its 4.6V I/O tolerance safeguards against overshoot in unterminated stubs.
HPA00719RSVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- -
- Channel Type:
- -
- Number of Circuits:
- -
- Channels per Circuit:
- -
- Voltage - VCCA:
- -
- Voltage - VCCB:
- -
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- -
- Data Rate:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
HPA00719RSVR FAQ
1.How can I place an order for HPA00719RSVR through Aetrix?
Please submit a Request for Quotation (RFQ) for HPA00719RSVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HPA00719RSVR reliable?
The price and inventory of HPA00719RSVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HPA00719RSVR is usually 5 days.
3.What payment methods are accepted for HPA00719RSVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HPA00719RSVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HPA00719RSVR?
HPA00719RSVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HPA00719RSVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HPA00719RSVR?
For technical support, including HPA00719RSVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HPA00719RSVR requirements.
6.How does Aetrix verify that HPA00719RSVR is sourced from the original manufacturer or authorized distributors?
All HPA00719RSVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HPA00719RSVR meets industry standards.
7.What is the process for return or replacement of HPA00719RSVR?
All HPA00719RSVR units undergo pre-shipment inspection (PSI). If there is an issue with HPA00719RSVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HPA00719RSVR part is unused and in its original packaging.
Return procedure for HPA00719RSVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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