Nexperia USA Inc. HPZR-C47X

Overview

HPZR-C47X from Nexperia is a high-power Zener voltage regulator diode in CFP3 (SOD123W) package, designed for precision DC voltage clamping and regulation at 47 V nominal working voltage with ±5 % tolerance. It delivers 4.1 W total power dissipation at T_sp = 75 °C, supports 800 W non-repetitive peak power (t_p ≤ 100 µs), and features 30 kV ESD rating per IEC 61000-4-2 (contact discharge), suitable for industrial power supply rail protection.

For engineers reviewing the HPZR-C47X datasheet, HPZR-C47X pinout, HPZR-C47X application, or HPZR-C47X equivalent, key selection criteria include its 47 V Zener voltage at I_Z = 1 mA, 0.1 µA max reverse current, 40 Ω differential resistance at I_Z = 20 mA, 1 V forward voltage at 100 mA, and thermal resistance of 18 K/W junction-to-solder-point - all critical for overvoltage clamp stability and PCB thermal design.

Technical Context

This device operates as a two-terminal, silicon planar Zener diode optimized for stable voltage reference and transient suppression in DC power rails. Its electrical behavior is defined by sharp reverse breakdown at V_Z = 44.4–49.1 V (min/max), low dynamic impedance (R_Z = 40 Ω typ at 20 mA), and controlled forward conduction (V_F ≤ 1 V @ 100 mA).

Thermally, it leverages the CFP3 package's low-profile copper cathode tab to achieve R_th(j-sp) = 18 K/W, enabling high-power dissipation without external heatsinking when soldered to ≥1 cm² cathode pad on FR4. ESD robustness (30 kV contact) is integrated via process-level protection, not external circuitry.

Key Specifications

Pinout & Package

HPZR-C47X uses the CFP3 (SOD123W) surface-mount plastic package: 2.6 mm × 1.7 mm × 1.0 mm body, flat lead profile, cathode marked by bar on top surface. Thermal performance relies on soldering the cathode tab to a ≥1 cm² copper pad on FR4 PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener voltage regulation applications.

Compared with BZX84-C47 and 1N4737A, HPZR-C47X uniquely combines 47 V Zener voltage, 4.1 W power handling, and SMD CFP3 packaging - making it the sole option for high-density, high-reliability 48 V rail clamping without thermal derating penalties.

Availability

HPZR-C47X is available at Aetrix Electronics and suitable for industrial power supplies, automated test equipment, telecom line cards, and motor drive gate driver circuits requiring stable component supply with guaranteed long-term continuity.

Supply support for HPZR-C47X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability standard logic, analog, and discrete components, headquartered in Nijmegen, Netherlands.

The HPZR series belongs to Nexperia's high-power Zener diode product line, engineered specifically for industrial and telecom applications demanding robust overvoltage protection in compact SMD packages with superior thermal performance.

FAQ

What is the maximum continuous power dissipation for HPZR-C47X at 75 °C solder point temperature?

HPZR-C47X delivers 4100 mW (4.1 W) total power dissipation at T_sp = 75 °C with zero lead length measurement condition. This value assumes the cathode terminal is soldered to a 1 cm² tin-plated copper pad on FR4 PCB, enabling full-rated power without external heatsinking.

How does the 30 kV ESD rating impact system-level design?

The 30 kV IEC 61000-4-2 contact discharge rating is built into the die structure and validated at the cathode solder point. This eliminates the need for discrete ESD protection devices on 48 V input rails, reducing BOM count and PCB area while maintaining compliance with industrial immunity standards.

Can HPZR-C47X be used in forward-bias configurations?

Yes - HPZR-C47X exhibits ≤ 1 V forward voltage at 100 mA (pulse-tested, t_p ≤ 300 µs, duty cycle ≤ 2 %). It is routinely used in polarity protection circuits and active clamp topologies where low forward drop and high surge current capability (50 A IFSM) are required.

What is the recommended PCB footprint for thermal reliability?

Nexperia specifies a 1.2 mm × 1.4 mm solder land with 1.1 mm × 1.1 mm stencil opening (0.1 mm thickness) for reflow. For thermal performance, the cathode pad must be ≥1 cm² copper area on outer layer, connected via multiple thermal vias to inner ground planes if ambient temperatures exceed 75 °C.