Nexperia USA Inc. HPZR-C53X

Overview

HPZR-C53X from Nexperia is a high-power Zener voltage regulator diode in CFP3 (SOD123W) package, designed for precision DC voltage clamping and regulation at 53 V nominal working voltage (V_Z = 50.0–55.3 V @ I_Z = 20 mA), with 4.1 W total power dissipation at T_sp = 75 °C and 30 kV ESD rating per IEC 61000-4-2 (contact discharge), used in industrial power supply overvoltage protection circuits.

For engineers reviewing the HPZR-C53X datasheet, HPZR-C53X pinout, HPZR-C53X application, or HPZR-C53X equivalent, this page delivers verified thermal resistance (R_th(j-sp) = 18 K/W), differential resistance (R_Z = 45 Ω @ I_Z = 20 mA), reverse current (I_R ≤ 0.1 μA @ V_R = 42.5 V), non-repetitive peak power (P_ZSM = 800 W), and mounting-specific power derating curves - all critical for robust transient suppression design.

Technical Context

This device operates as a two-terminal silicon Zener diode with sharp reverse breakdown at 53 V nominal, optimized for stable voltage reference and overvoltage clamping in low-current (<400 mA forward, <50 A non-repetitive surge) DC power rails. Its CFP3 package enables high thermal efficiency via direct cathode tab soldering to PCB copper area.

It exhibits 0.1 μA maximum reverse leakage at 42.5 V (80% of V_Z), 45 Ω typical dynamic impedance at 20 mA test current, and maintains ±5% tolerance across temperature (−55 °C to +150 °C junction range), supporting reliable regulation in thermally demanding environments without active bias circuitry.

Key Specifications

Pinout & Package

HPZR-C53X uses the CFP3 (SOD123W) surface-mount plastic package: 2.6 mm × 1.7 mm × 1.0 mm body, flat lead profile, cathode marked by bar on top surface. Thermal performance relies on cathode tab soldering to ≥1 cm² copper pad on FR4 PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener regulation applications.

Compared with BZX84-C51 and 1N5355B, HPZR-C53X uniquely balances 4.1 W SMD power handling, 45 Ω low dynamic impedance, and 30 kV ESD rating - making it optimal for modern industrial PCBs requiring compact, robust, and thermally efficient 53 V clamping without leaded components or external protection.

Availability

HPZR-C53X is available at Aetrix Electronics and suitable for industrial power supply protection, PLC input conditioning, telecom line card surge suppression, and test equipment reference stability requiring stable component supply and full traceability.

Supply support for HPZR-C53X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete and logic devices for automotive, industrial, and consumer markets.

The HPZR series is part of Nexperia's high-power Zener diode product line, engineered specifically for industrial-grade overvoltage protection where compact size, high surge resilience, and stable regulation under thermal stress are mandatory.

FAQ

What is the maximum continuous power dissipation for HPZR-C53X at 75 °C solder point temperature?

The maximum continuous DC power dissipation is 4100 mW (4.1 W) when measured at zero lead length and T_sp = 75 °C, as specified in Table 4 and confirmed in Section 8 Limiting Values. This rating assumes the cathode tab is soldered to a 1 cm² copper pad on FR4 PCB with tin plating.

How does the 30 kV ESD rating apply to HPZR-C53X in system-level design?

The 30 kV rating is measured per IEC 61000-4-2 contact discharge directly at the cathode solder point, meaning the device can withstand repeated electrostatic events without degradation when properly mounted. It eliminates the need for upstream ESD protection on low-speed DC rails, provided layout follows Nexperia's recommended footprint and grounding practices.

Can HPZR-C53X be used in parallel for higher power handling?

No - Zener diodes exhibit negative temperature coefficient and mismatched V_Z tolerances, causing current hogging and thermal runaway when paralleled. For >4.1 W requirements, use a single higher-rated device or implement active current-sharing circuitry; the HPZR-C53X is characterized and qualified only for individual operation.

What is the significance of R_th(j-sp) = 18 K/W in thermal management?

This value quantifies thermal resistance from the silicon junction to the cathode solder point, confirming that >90% of heat flows through the cathode tab into the PCB copper. It validates the design requirement for a dedicated 1 cm² cathode pad - reducing reliance on ambient convection and enabling predictable derating down to 0 W at T_sp = 150 °C per Figure 9.