Monolithic Power Systems Inc. HR1001CGS-P
- Part No.:
- HR1001CGS-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Power Supply Controllers, Monitors
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
HR1001CGS-P.pdf
- Description:
- IC ENHANCED LLC CONTROLLR 16SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HR1001CGS-P from Monolithic Power Systems is an enhanced LLC resonant half-bridge controller IC featuring adaptive dead-time adjustment (ADTA), capacitive mode protection (CMP), two-level over-current protection (OCP), programmable burst mode, and 600 kHz max switching frequency. It drives high-side and low-side MOSFETs in isolated AC/DC power supplies, delivers 50% duty cycle control, integrates a 600V high-side gate driver with bootstrap diode, and operates across –40°C to +125°C junction temperature.
For engineers reviewing the HR1001CGS-P datasheet, HR1001CGS-P pinout, HR1001CGS-P application, or HR1001CGS-P equivalent, this controller supports robust design of high-efficiency resonant converters for TVs, telecom SMPS, and open-frame adapters - with focus on surge resilience, ZVS assurance, light-load efficiency, and capacitive-mode fault prevention.
Technical Context
The HR1001CGS-P implements a variable-frequency, 50% duty-cycle control architecture optimized for LLC topology, using CT-based oscillator programming with FSET-referenced current sources to set min/max frequencies (60–600 kHz). Its ADTA logic senses dV/dt at SW via HBVS to dynamically adjust dead time between HG and LG outputs - maintaining zero-voltage switching across load and line variations.
Capacitive mode protection operates by comparing CS voltage against polarity thresholds (VCSPR = 50–131 mV, VCSNR = –131 to –50 mV) after each gate turn-off, enforcing a 52 µs blanking window before action. Two-level OCP combines frequency-shift regulation (VCS-OCR = 0.71–0.85 V) and latched shutdown (VCS-OCP = 1.41–1.59 V), with programmable timer delay and auto-recovery disabled only upon latch activation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max switching frequency | 600 kHz - enables compact magnetics and high-power density in resonant converters |
| Adaptive dead-time range | 180–1000 ns - ensures ZVS across load/light-load transitions while preventing shoot-through |
| OCP threshold accuracy | VCS-OCP = 1.41–1.59 V - provides precise primary-side current limiting with ±6% tolerance |
| Capacitive mode detection | VCSPR/VCSNR = ±50–131 mV - detects current polarity reversal to block gate drive during destructive capacitive operation |
| Gate drive capability | HG/LG peak source/sink = 0.74/0.87 A - directly drives 1–2 nC gate charge MOSFETs without external buffers |
| Operating junction temp | –40°C to +125°C - supports industrial and telecom-grade thermal environments without derating |
| Package | SOIC-16 - industry-standard footprint with creepage-enhancing NC pin and integrated bootstrap diode |
Pinout & Package
HR1001CGS-P is housed in a 16-pin SOIC package with creepage-enhancing NC pin (Pin 13), internal bootstrap diode, and high-voltage isolation between BST/SW and GND domains. Pin functions are validated per MPS HR1001C Rev.1.0 datasheet (Feb 2017).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 SS | Soft-start timing node | Controls startup frequency ramp via external R-C; discharges internally during faults to force high-frequency soft recovery |
| 2 TIMER | OCP duration timer | Charges during over-current; triggers latched shutdown at VTIMER-SD = 3.2–3.7 V and restarts at VTIMER-R = 0.21–0.35 V |
| 3 CT | Oscillator timing capacitor | Charged/discharged by FSET-programmed current to generate variable-frequency clock (60–600 kHz) |
| 4 FSET | Frequency set reference | 2.0 V ±3% internal reference; sets min/max fSW via resistor network to GND and optocoupler feedback |
| 5 BURST | Burst mode enable | Enters low-quiescent-current idle state when VBURST < 1.23 V; resumes switching at VBURST + 30–100 mV hysteresis |
| 6 CS | Primary current sense input | Detects OCP, CMP, and frequency-shift events; accepts resistive or capacitive sensing with 2 µA bias current |
| 7 BO | Line voltage monitor | Enables IC at VBO-On = 2.30–2.40 V; disables at VBO-Off = 1.72–1.81 V; clamps at 5.1–5.9 V |
| 8 LATCH | External shutdown input | Latches off IC when VLATCH > 1.85 V; reset only by cycling VCC below UVLO (VCCL = 7.5–8.9 V) |
| 9 HBVS | dV/dt sensing node | Connects to SW via 5 pF capacitor; enables ADTA by detecting slope polarity and magnitude (dvmin/dt = 180 V/µs) |
| 10 GND | Signal/power return | Common reference for LG, CS, BO, BURST, SS, TIMER, CT, FSET; requires separate pulsed-current return path |
| 11 LG | Low-side gate driver | 0.87 A sink / 0.75 A source peak; referenced to GND; pulls low during UVLO |
| 12 VCC | IC supply input | 13–15.5 V operating range; 11 V turn-on / 8.2 V turn-off thresholds; powers bias and LG driver |
| 13 NC | No-connect spacer | Electrically unconnected; increases creepage between SW (Pin 14) and adjacent pins for safety compliance |
| 14 SW | High-side switch source | Return path for HG drive current; rated to 600 V; layout-critical node for EMI and dV/dt integrity |
| 15 HG | High-side floating gate driver | 0.87 A sink / 0.74 A source peak; referenced to SW; includes internal pull-down during UVLO |
| 16 BST | Bootstrap supply | Charged via internal diode from LG; supplies HG driver; requires external BST–SW capacitor (e.g., 100 nF) |
Key Features
| Feature | Design Value |
|---|---|
| Adaptive dead-time adjustment (ADTA) | Automatically inserts 180–1000 ns dead time based on SW dV/dt sensing - eliminates manual tuning and ensures ZVS across line/load |
| Capacitive mode protection (CMP) | Blocks HG/LG turn-on for 52 µs after polarity reversal detected on CS - prevents MOSFET destruction under short-circuit or overload |
| Two-level over-current protection | Frequency-shift regulation (VCS-OCR = 0.78 V typ.) followed by latched shutdown (VCS-OCP = 1.5 V typ.) - avoids nuisance tripping during surges |
| Programmable burst mode | Reduces quiescent current to 1.2–1.8 mA at light load via BURST pin threshold (1.23 V) - improves no-load efficiency to <150 mW |
| Non-linear soft start | Exponential frequency ramp via SS–FSET R-C network - limits inrush current while enabling monotonic VOUT rise |
| 600V high-side gate driver | Integrated bootstrap diode and 0.74/0.87 A HG drive - eliminates external diode and reduces BOM count in high-voltage half-bridge designs |
Applications
| TV Power Supplies | Telecom Rectifiers |
|---|---|
Use Scenario: 24V/100W LLC resonant converter powering LCD/PDP TV main board and backlight inverters. IC Role / Device Role / Timing Role: Primary-side LLC controller managing variable-frequency ZVS operation, adaptive dead time, and capacitive-mode fault blocking. Use Value: Enables >94% efficiency at full load and <150 mW no-load consumption while surviving 10 kV ESD and 6 kV surge events per IEC 61000-4-5. | Use Scenario: 48V/300W telecom SMPS with wide-input (90–264 VAC) and hold-up time >15 ms. IC Role / Device Role / Timing Role: Resonant half-bridge controller delivering regulated 48V output with burst-mode efficiency optimization and brown-in/out protection. Use Value: Achieves 92% efficiency at 20% load via programmable burst threshold and maintains stable regulation during 100 ms brown-out events using BO pin hysteresis. |
| Open-Frame Adapters | Electronic Lighting Ballasts |
Use Scenario: 12V/60W open-frame adapter for industrial computing equipment with Class II isolation. IC Role / Device Role / Timing Role: LLC controller implementing ADTA-driven ZVS, two-level OCP, and non-linear soft start for safe cold-start into capacitive loads. Use Value: Reduces EMI emissions by 8 dBμV through adaptive dead-time control and meets EN 55022 Class B without added filtering. | Use Scenario: 300W electronic ballast driving multiple HID lamps with dimming interface and lamp-strike protection. IC Role / Device Role / Timing Role: Resonant controller managing frequency sweep during lamp ignition and steady-state ZVS operation with CMP-enabled short-circuit survival. Use Value: Sustains lamp operation during filament open-circuit faults and recovers automatically after 500 ms via TIMER-based soft restart. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LLC controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UCC256301DR | Fixed 150 ns dead time; no ADTA; integrated X-cap discharge; lower max fSW (800 kHz but typically limited to 500 kHz) | Lacks dynamic dV/dt-based dead-time adaptation - requires careful Lm selection to avoid hard switching at light load | Prefer UCC256301DR only if X-cap discharge and TI ecosystem support outweigh need for adaptive ZVS assurance. |
| ICE2HS01G | No CMP; single-level OCP; no burst mode; 100–500 kHz fSW range; requires external bootstrap diode | Higher risk of MOSFET failure under output short due to missing capacitive-mode blocking logic | Select ICE2HS01G only for cost-sensitive, non-safety-critical applications where surge immunity and fault robustness are secondary. |
Compared with UCC256301DR and ICE2HS01G, HR1001CGS-P uniquely delivers adaptive dead-time control, capacitive mode protection, and programmable burst mode in a single SOIC-16 package - enabling higher reliability, lower EMI, and better light-load efficiency without external components or firmware.
Availability
HR1001CGS-P is available at Aetrix Electronics and suitable for LCD/PDP TV power supplies, telecom rectifiers, and open-frame AC/DC adapters requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for HR1001CGS-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with design centers in the US, China, and Taiwan, and global distribution through authorized partners.
The HR1001C product line targets high-efficiency, high-reliability resonant power conversion - specifically engineered for LLC half-bridge topologies in consumer, telecom, and industrial power supplies where ZVS assurance and fault robustness are critical.
FAQ
What is the purpose of the HBVS pin and how is it used in circuit design?
The HBVS pin senses dV/dt at the SW node via an external capacitor (typically 5 pF) to enable adaptive dead-time adjustment. When SW transitions, current through CHBVS pulls HBVS voltage down; the IC uses this signal to detect slope polarity and magnitude, then dynamically adjusts dead time between HG and LG to ensure zero-voltage switching. Proper CHBVS selection - constrained by Equation (8) to keep dV/dt current below 65 mA - is essential for reliable ADTA operation and MOSFET protection.
How does the two-level over-current protection (OCP) function differ from standard OCP implementations?
HR1001CGS-P's two-level OCP first responds to over-current with frequency shift (triggered at VCS-OCR = 0.78 V), increasing switching frequency to limit delivered power. If current persists, it escalates to latched shutdown at VCS-OCP = 1.5 V, disabling all gate outputs until VCC cycles below UVLO. This staged response prevents false triggering during surge events while ensuring definitive protection during sustained faults - unlike single-threshold OCP that may latch prematurely or fail to respond to marginal overloads.
Can the HR1001CGS-P operate without connecting the HBVS pin, and what is the impact?
Yes, HR1001CGS-P can operate with HBVS left unconnected, but ADTA is disabled and dead time defaults to a fixed 350 ns. This eliminates automatic ZVS optimization across load conditions, increasing risk of hard switching at light load or with large magnetizing inductance. While functional for basic LLC operation, omitting HBVS forfeits key efficiency and reliability benefits - especially in designs requiring consistent ZVS over wide line/load ranges or high-power-density requirements.
What is the role of the TIMER pin and how is its timing behavior configured?
The TIMER pin implements a programmable delay between over-current detection and latched shutdown. An internal 80–180 µA current source charges an external capacitor when CS exceeds VCS-OCR; shutdown occurs when TIMER voltage reaches VTIMER-SD = 3.5 V. A parallel resistor discharges the capacitor slowly, setting restart delay. This allows adjustable fault-hold duration (e.g., 10–100 ms) and controlled burst-mode recovery - critical for surviving transient surges without system interruption.
How does the burst mode operation reduce no-load power consumption?
Burst mode reduces no-load power by disabling gate drive and entering ultra-low-quiescent-current state (1.2–1.8 mA) when feedback voltage at BURST falls below 1.23 V. In this state, the IC stops switching, halts oscillator activity, and maintains only essential bias circuits. It resumes normal operation only when BURST rises above 1.23 V + hysteresis (30–100 mV), eliminating continuous switching losses and enabling total system no-load consumption below 150 mW - meeting stringent Energy Star and EU CoC Tier 2 requirements.
Is the HR1001CGS-P compatible with synchronous rectification controllers?
HR1001CGS-P is not a synchronous rectification controller and does not provide SR gate drive signals. However, it is fully compatible with external SR controllers (e.g., MP6908, NCP4306) via its well-regulated output and stable timing - the FSET pin's 2.0 V reference and clean CT waveform allow precise feedback loop integration. Designers commonly pair HR1001CGS-P with dedicated SR ICs in high-efficiency LLC designs to achieve >95% overall efficiency.
What thermal protection mechanisms are built into the HR1001CGS-P?
HR1001CGS-P includes a thermal shutdown circuit that activates at TJ = 150°C (±5°C) and recovers at TJ = 120°C (±5°C). During shutdown, gate drivers disable, oscillator halts, and quiescent current drops to ~350 µA. The IC remains latched off until junction temperature falls below recovery threshold - preventing thermal runaway and enabling safe cooldown. Thermal parameters are characterized per JEDEC JESD51-7 on 4-layer PCB, with ΘJA = 80°C/W in SOIC-16 package.
HR1001CGS-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- -
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Applications:
- Flyback, Forward Converters, LLC
- Voltage - Input:
- -0.3V ~ 6V
- Voltage - Supply:
- 13V ~ 15.5V
- Current - Supply:
- 3 mA
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
HR1001CGS-P FAQ
1.How can I place an order for HR1001CGS-P through Aetrix?
Please submit a Request for Quotation (RFQ) for HR1001CGS-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HR1001CGS-P reliable?
The price and inventory of HR1001CGS-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HR1001CGS-P is usually 5 days.
3.What payment methods are accepted for HR1001CGS-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HR1001CGS-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HR1001CGS-P?
HR1001CGS-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HR1001CGS-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HR1001CGS-P?
For technical support, including HR1001CGS-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HR1001CGS-P requirements.
6.How does Aetrix verify that HR1001CGS-P is sourced from the original manufacturer or authorized distributors?
All HR1001CGS-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HR1001CGS-P meets industry standards.
7.What is the process for return or replacement of HR1001CGS-P?
All HR1001CGS-P units undergo pre-shipment inspection (PSI). If there is an issue with HR1001CGS-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HR1001CGS-P part is unused and in its original packaging.
Return procedure for HR1001CGS-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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