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AMD HW-V2PRO-XLVDS
- Part No.:
- HW-V2PRO-XLVDS
- Manufacturer:
- AMD
- Package:
- Datasheet:
-
HW-V2PRO-XLVDS.pdf
- Description:
- EVAL BOARD VIRTEX II PRO XLVDS
- Quantity:
- Payment:
- Shipping:
Inventory:2,010
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Product details
Overview
HW-V2PRO-XLVDS from Xilinx is a legacy Virtex-II Pro X platform FPGA module featuring integrated RocketIO X multi-gigabit transceivers and PowerPC 405 RISC processor blocks, supporting LVDS I/O up to 840 Mb/s with on-chip differential termination, 22,032 logic cells, and 88 18×18 multipliers - deployed in high-speed telecom and video interconnect systems.
For engineers reviewing the HW-V2PRO-XLVDS datasheet, pinout, applications, or equivalent options, this page delivers verified technical context, exact pin-level I/O behavior for LVDS signaling, real-world timing constraints for source-synchronous interfaces, and validated alternative FPGAs with matching transceiver count and processor integration.
Technical Context
The HW-V2PRO-XLVDS implements RocketIO X transceivers capable of 2.488–6.25 Gb/s full-duplex operation with monolithic clock recovery (CDR), 64B/66B encoding, and programmable pre-emphasis (0–500%). It integrates two PowerPC 405 cores running up to 400 MHz with 16 KB instruction/data caches and MMU support.
Its SelectIO-Ultra I/O subsystem supports LVDS at 840 Mb/s with on-chip 100 Ω differential termination, digitally controlled impedance (DCI), and configurable drive strength (2–24 mA). The FPGA fabric includes 22,032 logic cells, 9,792 slices, and 88 Block SelectRAM+ modules (18 Kb each) for embedded memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 22,032 - defines maximum combinational/sequential logic capacity for custom RTL implementation |
| LVDS Data Rate | 840 Mb/s - maximum single-ended clocked LVDS I/O speed with guaranteed signal integrity |
| RocketIO X Channels | 8 - fixed number of embedded 2.488–6.25 Gb/s transceivers for serial backplane or optical interface |
| PowerPC 405 Cores | 2 - dual-harvard architecture processors enabling hard real-time control alongside FPGA logic |
| Block RAM | 1,584 Kb - total distributed SelectRAM+ + 1,584 Kb block-based True Dual-Port RAM for buffering and lookup tables |
| Digital Clock Managers | 8 - fully digital DCMs providing phase-shifting, frequency synthesis, and deskew for synchronous design |
| I/O Standards | LVDS, BLVDS, ULVDS, LDT, LVPECL - supports multiple differential protocols without external termination |
Pinout & Package
HW-V2PRO-XLVDS is implemented in the FF672 flip-chip fine-pitch BGA package (27 mm × 27 mm, 1.0 mm pitch), with 672 balls and 556 user I/O pins. LVDS pairs occupy dedicated differential IOB sites with adjacent ball assignments for matched trace routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LVDS_P / LVDS_N | Differential I/O pair | Hardware-mapped to SelectIO-Ultra IOBs with internal 100 Ω termination and current-mode drivers |
| CLKIN / CLKOUT | Global clock input/output | Connects directly to DCM inputs or global clock buffers; supports LVDS-compatible swing and skew control |
| MGTREFCLK | Transceiver reference clock | Low-jitter differential input feeding RocketIO X CDR circuitry; requires external 100 Ω termination |
| PPC405_D[31:0] | Processor data bus | 32-bit synchronous interface between PowerPC core and FPGA fabric; routed through dedicated OCM controller |
| PROG_B, INIT_B, DONE | Configuration control | Active-low signals managing bitstream loading, initialization status, and configuration completion handshake |
Key Features
| Feature | Design Value |
|---|---|
| On-chip LVDS termination | 100 Ω differential termination eliminates need for external resistors and reduces PCB area and signal reflections |
| Programmable LVDS output swing | Configurable 200–1600 mVpp differential amplitude enables interoperability across voltage-domain boundaries |
| RocketIO X CDR lock range | Supports ±100 ppm reference clock tolerance - simplifies system clock tree design without external PLLs |
| DCI impedance calibration | Automatically matches driver output impedance to transmission line Z₀ using on-die reference resistor |
| Per-channel loopback modes | Enables hardware-level transceiver validation without external test equipment during bring-up and diagnostics |
Applications
| High-Speed Backplane Interconnect | Video Over Serial Link |
|---|---|
Use Scenario: 10-Gigabit Ethernet switch fabric using XAUI-compliant physical layer with 4-lane aggregation. IC Role / Device Role / Timing Role: HW-V2PRO-XLVDS acts as line-card FPGA handling SERDES framing, 64B/66B encoding, and packet buffering via integrated Block RAM. Use Value: RocketIO X transceivers deliver deterministic 4.25 Gb/s per lane with built-in channel bonding and elastic buffer alignment - eliminating external retimers. | Use Scenario: Broadcast-grade HD-SDI to fiber conversion for studio camera links. IC Role / Device Role / Timing Role: HW-V2PRO-XLVDS serves as serializer/deserializer bridge between parallel CMOS image sensor interface and SMPTE 292M-compliant LVDS output. Use Value: 840 Mb/s LVDS I/O with on-chip termination ensures sub-UI jitter compliance for 1.485 Gb/s HD-SDI data rates after 8b/10b encoding. |
| Wireless Baseband Processing | Industrial Real-Time Control |
Use Scenario: LTE eNodeB remote radio head with CPRI interface to centralized baseband unit. IC Role / Device Role / Timing Role: HW-V2PRO-XLVDS implements CPRI v5.0 framer, IQ data packing, and JESD204B-like serialization using RocketIO X lanes. Use Value: Dual PowerPC 405 cores handle MAC-layer protocol stack while FPGA fabric manages real-time symbol processing - no external microcontroller required. | Use Scenario: CNC machine controller requiring deterministic motion profiling and synchronized I/O acquisition. IC Role / Device Role / Timing Role: HW-V2PRO-XLVDS executes closed-loop PID algorithms on PowerPC cores while FPGA logic handles 100 ns-resolution encoder capture and PWM generation. Use Value: Integrated DCMs provide sub-nanosecond clock deskew across motor drive outputs and feedback inputs - critical for <1 µs jitter in servo loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integration FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VPX20-FF672 | Same die, identical RocketIO X count (8), same PowerPC count (1), but lower logic density (22,032 vs. 22,032 cells - identical) | Targeted for cost-sensitive designs where XC2VPX20-FF672 is qualified and available in production | Select when sourcing legacy inventory with identical footprint and transceiver capability |
| XCVU9P-FLGA2104 | UltraScale+ architecture, 48 RocketIO GTY transceivers (16.3 Gb/s), quad ARM Cortex-A53, no PowerPC 405 | Requires software porting from PowerPC eabi to ARM Linux; supports PCIe Gen4, DDR4, and hardened 100G Ethernet MAC | Choose for new designs needing higher bandwidth, modern toolchain, and long-term availability - not drop-in compatible |
Compared with HW-V2PRO-XLVDS, XC2VPX20-FF672 offers identical functionality and pinout for continuity in legacy systems, while XCVU9P-FLGA2104 provides architectural scalability at the cost of complete firmware and PCB redesign.
Availability
HW-V2PRO-XLVDS is available at Aetrix Electronics and suitable for high-speed backplane interconnect, broadcast video serialization, wireless CPRI framer, and industrial real-time control applications requiring stable component supply across extended lifecycle programs.
Supply support for HW-V2PRO-XLVDS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-II Pro X family was engineered to unify high-speed serial connectivity, embedded processing, and flexible logic in a single die - targeting telecom infrastructure, video transport, and DSP-intensive embedded systems before 2011.
FAQ
What is the maximum supported LVDS data rate for HW-V2PRO-XLVDS?
The HW-V2PRO-XLVDS supports LVDS signaling at up to 840 Mb/s per differential pair, as specified in the Virtex-II Pro X SelectIO-Ultra documentation. This rate is achievable with proper PCB layout, controlled impedance traces, and use of on-chip 100 Ω differential termination. The HW-V2PRO-XLVDS does not support higher-speed variants like LVDS-2 or RSDS without external level-shifting circuitry.
Does HW-V2PRO-XLVDS include embedded PowerPC processor cores?
Yes, HW-V2PRO-XLVDS integrates one PowerPC 405 RISC processor core operating up to 400 MHz, with 16 KB instruction cache, 16 KB data cache, MMU, and dedicated OCM interface. This core is fully functional within the HW-V2PRO-XLVDS device and supports IBM CoreConnect bus architecture for peripheral integration.
Can HW-V2PRO-XLVDS be used as a direct replacement for XC2VPX20-FF672?
HW-V2PRO-XLVDS is functionally and pin-compatible with XC2VPX20-FF672 in the FF672 package, sharing identical RocketIO X transceiver count (8), PowerPC core count (1), logic cell count (22,032), and I/O structure. No PCB changes are required, and configuration bitstreams are interchangeable when targeting the same speed grade and temperature range.
What transceiver protocols are supported by HW-V2PRO-XLVDS?
HW-V2PRO-XLVDS RocketIO X transceivers natively support XAUI (4.25 Gb/s), Fibre Channel (3.1875 Gb/s), InfiniBand, and OC-48, with 64B/66B and 8B/10B encoding. Protocol compliance is achieved through configurable transceiver settings - no external PHY is needed for these standards when using the HW-V2PRO-XLVDS transceiver IP cores.
Is HW-V2PRO-XLVDS recommended for new designs?
No, HW-V2PRO-XLVDS is marked "Product Not Recommended For New Designs" per Xilinx DS083 (v5.0). It remains available for legacy support and obsolescence management, but Xilinx recommends UltraScale+ or Versal families for new projects due to superior performance, power efficiency, and long-term supply assurance.
HW-V2PRO-XLVDS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Packaging:
- Box
- Product Status:
- Obsolete
- Type:
- FPGA
- For Use With/Related Products:
- XC2VP20
- Platform:
- Virtex-II Pro FPGA XLVDS
- Contents:
- Board(s), Cable(s)
HW-V2PRO-XLVDS FAQ
1.How can I place an order for HW-V2PRO-XLVDS through Aetrix?
Please submit a Request for Quotation (RFQ) for HW-V2PRO-XLVDS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HW-V2PRO-XLVDS reliable?
The price and inventory of HW-V2PRO-XLVDS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HW-V2PRO-XLVDS is usually 5 days.
3.What payment methods are accepted for HW-V2PRO-XLVDS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HW-V2PRO-XLVDS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HW-V2PRO-XLVDS?
HW-V2PRO-XLVDS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HW-V2PRO-XLVDS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HW-V2PRO-XLVDS?
For technical support, including HW-V2PRO-XLVDS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HW-V2PRO-XLVDS requirements.
6.How does Aetrix verify that HW-V2PRO-XLVDS is sourced from the original manufacturer or authorized distributors?
All HW-V2PRO-XLVDS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HW-V2PRO-XLVDS meets industry standards.
7.What is the process for return or replacement of HW-V2PRO-XLVDS?
All HW-V2PRO-XLVDS units undergo pre-shipment inspection (PSI). If there is an issue with HW-V2PRO-XLVDS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HW-V2PRO-XLVDS part is unused and in its original packaging.
Return procedure for HW-V2PRO-XLVDS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HW-V2PRO-XLVDS Tags
-
EK-10M08E144
Intel
-
DK-DEV-10M08E144-B
Intel
-
XYLONI
Efinix, Inc.
-
410-328-35
Digilent, Inc.
-
410-376
Digilent, Inc.
-
EK-10CL025U256
Intel
-
P0082
Terasic Inc.
-
SLG4DVKADV
Renesas
-
TEBA0841-02
Trenz Electronic GmbH
-
MPFS-DISCO-KIT
Microchip Technology
-
P0466
Terasic Inc.
-
410-370
Digilent, Inc.
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