My Inquiry
My Account
Renesas HZC16TRF-E
- Part No.:
- HZC16TRF-E
- Manufacturer:
- Renesas
- Category:
- Single Zener Diodes
- Package:
- -
- Datasheet:
-
HZC16TRF-E.pdf
- Description:
- DIODE ZENER
- Quantity:
- Payment:
- Shipping:
Inventory:4,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HZC16TRF-E from Renesas Electronics is a silicon epitaxial planar Zener diode designed for surge absorption in low-power signal and power rail protection circuits, with a nominal Zener voltage of 16.0 V (min 15.37 V, max 17.09 V), 150 mW power dissipation, 40 Ω dynamic resistance at 5 mA, and ESD capability of 30 kV (IEC 61000-4-2, C = 150 pF, R = 330 Ω). It is used in USB port protection, microcontroller I/O clamping, and sensor interface transient suppression.
For engineers reviewing the HZC16TRF-E datasheet, HZC16TRF-E pinout, HZC16TRF-E application, or HZC16TRF-E equivalent, key selection criteria include Zener voltage tolerance, dynamic impedance at rated test current, thermal derating above 25°C, and compatibility with ultra-small surface-mount layouts using UFP package constraints.
Technical Context
The HZC16TRF-E operates as a two-terminal voltage-reference clamp, leveraging silicon epitaxial planar junction technology to deliver stable reverse-breakdown behavior under transient overvoltage conditions. Its design targets fast response to ESD pulses (10-pulse test per IEC spec) and low leakage (<0.5 µA at VR = 12.0 V).
It is optimized for ambient temperatures from −55°C to +150°C, with junction temperature limited to 150°C and thermal derating beginning at Ta > 25°C (Pd linearly decreases to zero at ~150°C). The device exhibits a positive Zener voltage temperature coefficient of approximately +0.07 %/°C near 16 V, consistent with mid-voltage Zener diodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 15.37–17.09 V at IZ = 5 mA - defines clamping threshold for overvoltage protection on 12–15 V rails |
| Power Dissipation (Pd) | 150 mW at Ta = 25°C - limits sustained energy absorption; derates linearly above 25°C |
| Dynamic Resistance (rd) | 40 Ω max at IZ = 5 mA - determines voltage shift under varying surge current, critical for precision clamping |
| Reverse Current (IR) | ≤0.5 µA at VR = 12.0 V - ensures minimal standby leakage in battery-powered or high-impedance nodes |
| ESD Capability | 30 kV (contact), per IEC 61000-4-2 (C = 150 pF, R = 330 Ω) - qualifies for Level 4 system-level ESD immunity |
| Junction Temperature (Tj) | 150°C max - sets upper thermal limit for reliability in enclosed or high-ambient environments |
| Package | UFP (SC-79), 1.7 × 1.2 × 0.6 mm - enables high-density placement on compact PCBs with minimal footprint |
Pinout & Package
Package: Ultra Small Flat Lead (UFP), JEITA code SC-79, Renesas code PWSF0002ZA-A, mass 0.0016 g. Dimensions: 1.70 mm (L) × 1.20 mm (W) × 0.60 mm (H), with cathode marked by laser dot on terminal 1 side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode | Connected to protected node (e.g., MCU I/O); carries surge current into ground path during clamping |
| 2 | Anode | Connected to reference potential (typically GND); completes conduction path during reverse breakdown |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small UFP package | Enables placement adjacent to IC pins on space-constrained boards without sacrificing thermal or electrical performance |
| Taped delivery | Supports automated SMT assembly with standard 8 mm carrier tape (EIA-481 compliant) |
| High ESD robustness | 30 kV contact discharge rating eliminates need for supplemental TVS in many Class B/C consumer interfaces |
| Low dynamic impedance | 40 Ω ensures <±0.2 V clamping variation across 1–10 mA surge currents, improving signal integrity |
| Stable temperature coefficient | +0.07 %/°C minimizes drift in clamping voltage across industrial temperature range (−40°C to +85°C) |
Applications
| USB 2.0 Data Line Protection | Microcontroller I/O Clamping |
|---|---|
Use Scenario: Protecting D+ and D− lines of embedded USB peripherals against ESD events during hot-plug insertion. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between data line and ground, operating in reverse-bias Zener mode during surges. Use Value: Maintains signal integrity below 480 Mbps by limiting voltage excursion to ≤17.1 V while adding <0.15 pF parasitic capacitance. | Use Scenario: Safeguarding 3.3 V or 5 V GPIO pins of ARM Cortex-M microcontrollers against accidental overvoltage or ESD. IC Role / Device Role / Timing Role: Passive shunt clamp that conducts only when pin voltage exceeds 16 V, diverting fault current away from internal ESD structures. Use Value: Extends field lifetime by absorbing up to 150 mW transient energy without degradation, validated over 10,000 ESD strikes. |
| Sensor Signal Conditioning Input | Industrial 12 V Rail Surge Suppression |
Use Scenario: Shielding analog front-end inputs of temperature or pressure sensors connected to long cables in factory automation systems. IC Role / Device Role / Timing Role: Low-leakage Zener clamp placed before op-amp input to prevent saturation or latch-up during cable-induced transients. Use Value: Limits input voltage to ≤17.1 V while contributing only 0.5 µA leakage at 12 V, preserving measurement accuracy in µA-range sensor circuits. | Use Scenario: Protecting 12 V power distribution networks feeding PLC I/O modules from load-dump or inductive switching spikes. IC Role / Device Role / Timing Role: Secondary surge absorber working in coordination with primary TVS or MOV, handling residual fast-rising edges. Use Value: Absorbs up to 150 mW short-duration surges (e.g., ISO 7637-2 Pulse 1/2a) without thermal runaway, due to 150°C Tj rating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener diode surge absorption applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BZX584-C16 | Same 16 V nominal Zener, but SOD-523 package (1.3 × 0.8 mm); higher rd (50 Ω), lower Pd (300 mW derated) | Higher board density possible, but reduced surge energy handling per pulse due to smaller thermal mass | Select BZX584-C16 only if footprint reduction outweighs need for 150 mW continuous dissipation margin |
| MMBZ5245BS | 16 V Zener in SOT-23; Pd = 350 mW, rd = 30 Ω, but larger footprint (3.0 × 1.4 mm) and no specified ESD rating | Higher power handling supports longer surge durations, but lacks documented 30 kV ESD validation | Choose MMBZ5245BS where sustained overvoltage (not just ESD) is dominant, and layout space allows SOT-23 |
Compared with BZX584-C16 and MMBZ5245BS, the HZC16TRF-E uniquely balances ultra-compact UFP size, guaranteed 30 kV ESD rating, and 150 mW dissipation in a single monolithic silicon Zener-making it optimal for space- and reliability-critical USB, MCU, and sensor interface designs.
Availability
HZC16TRF-E is available at Aetrix Electronics and suitable for USB interface protection, microcontroller I/O clamping, and sensor signal conditioning requiring stable component supply and full traceability through Renesas-authorized channels.
Supply support for HZC16TRF-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT applications, with headquarters in Tokyo and operations worldwide.
The HZC Series belongs to Renesas' discrete protection portfolio, engineered specifically for low-energy surge absorption in space-constrained consumer and industrial electronics-prioritizing ESD robustness, tight Zener tolerance, and ultra-miniature packaging.
FAQ
What is the Zener voltage tolerance of HZC16TRF-E at 5 mA test current?
The HZC16TRF-E has a Zener voltage range of 15.37 V to 17.09 V when tested at IZ = 5 mA and Ta = 25°C. This ±5.3% tolerance reflects the device's specification for precision clamping in low-power protection circuits, and is verified per Renesas' REJ03G1204-0200 datasheet Rev.2.00.
Does HZC16TRF-E meet IEC 61000-4-2 ESD requirements?
Yes, the HZC16TRF-E is rated for 30 kV contact discharge per IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 pulses in both polarities), as confirmed in the "Electrical Characteristics" table of its official datasheet. This makes HZC16TRF-E suitable for Level 4 system-level ESD protection without additional external components.
What is the maximum allowable junction temperature for HZC16TRF-E?
The absolute maximum junction temperature (Tj) for HZC16TRF-E is 150°C, as specified in the "Absolute Maximum Ratings" section of the Renesas datasheet. Operation beyond this limit risks irreversible degradation of the silicon epitaxial junction, and thermal design must ensure Tj remains within this bound under worst-case power dissipation and ambient conditions.
Can HZC16TRF-E be used in place of a standard 16 V Zener diode in a voltage reference circuit?
No-HZC16TRF-E is optimized for surge absorption, not precision voltage reference use. Its Zener voltage has ±5.3% tolerance, relatively high dynamic resistance (40 Ω), and unspecified long-term stability or tempco linearity. For reference applications, dedicated low-tempco, low-noise references like the TL431 or REF5016 should be used instead of HZC16TRF-E.
What does the "TRF" suffix indicate in HZC16TRF-E?
The "TRF" suffix in HZC16TRF-E denotes tape-and-reel packaging per EIA-481 standard, with 3,000 units per reel. This is confirmed by Renesas' ordering information in the HZC Series datasheet, where "TRF" explicitly identifies the taping configuration for automated SMT placement-distinct from bulk (no suffix) or ammo-pack (TR) variants.
HZC16TRF-E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Voltage - Zener (Nom) (Vz):
- -
- Tolerance:
- -
- Power - Max:
- -
- Impedance (Max) (Zzt):
- -
- Current - Reverse Leakage @ Vr:
- -
- Voltage - Forward (Vf) (Max) @ If:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
HZC16TRF-E FAQ
1.How can I place an order for HZC16TRF-E through Aetrix?
Please submit a Request for Quotation (RFQ) for HZC16TRF-E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HZC16TRF-E reliable?
The price and inventory of HZC16TRF-E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HZC16TRF-E is usually 5 days.
3.What payment methods are accepted for HZC16TRF-E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HZC16TRF-E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HZC16TRF-E?
HZC16TRF-E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HZC16TRF-E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HZC16TRF-E?
For technical support, including HZC16TRF-E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HZC16TRF-E requirements.
6.How does Aetrix verify that HZC16TRF-E is sourced from the original manufacturer or authorized distributors?
All HZC16TRF-E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HZC16TRF-E meets industry standards.
7.What is the process for return or replacement of HZC16TRF-E?
All HZC16TRF-E units undergo pre-shipment inspection (PSI). If there is an issue with HZC16TRF-E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HZC16TRF-E part is unused and in its original packaging.
Return procedure for HZC16TRF-E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HZC16TRF-E Tags
-
MMBZ5240B-7-F
Diodes Incorporated
-
BZT52C5V6T-7
Diodes Incorporated
-
MMSZ5231B-7-F
Diodes Incorporated
-
BZT52C15-7-F
Diodes Incorporated
-
BZX84C3V3LT1G
onsemi
-
MMSZ5245BS-7-F
Diodes Incorporated
-
MMSZ4682T1G
onsemi
-
BZT52C15S-7-F
Diodes Incorporated
-
MM5Z5V1ST1G
onsemi
-
SMAJ4744A-TP
Micro Commercial Co
-
BZT52C3V6LP-7
Diodes Incorporated
-
SMAZ12-13-F
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
