Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Diodes > Zener > Single Zener Diodes

Renesas HZC30-1TRF-E

Name: HZC30-1TRF-E
Brand: Renesas
SKU: HZC30-1TRF-E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: HZC30-1TRF-E

Manufacturer:: Renesas

Category:: Single Zener Diodes

Package:: -

Datasheet:: HZC30-1TRF-E.pdf

Description:: DIODE ZENER

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:80,000

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

HZC30-1TRF-E from Renesas Electronics is a silicon epitaxial planar Zener diode optimized for surge absorption in low-power signal and power rail protection circuits, featuring a nominal Zener voltage of 30 V (28–32 V range), 2 mA test current, 80 Ω dynamic resistance, 150 mW power dissipation, and ESD capability of ±30 kV per IEC 61000-4-2 (C = 150 pF, R = 330 Ω). It is used in input-stage transient suppression for industrial sensors and USB interface protection.

For engineers reviewing the HZC30-1TRF-E datasheet, HZC30-1TRF-E pinout, HZC30-1TRF-E application, or HZC30-1TRF-E equivalent, key selection criteria include Zener voltage tolerance, dynamic impedance at 2 mA, thermal derating above 25°C, UFP package footprint compatibility, and ESD robustness in unidirectional clamping configurations.

Technical Context

This device operates as a unidirectional voltage clamp, conducting only in reverse bias when transient overvoltage exceeds its specified Zener breakdown range. Its ultra-small Flat Lead Package (UFP, JEITA code SC-79) enables high-density PCB layout with minimal parasitic inductance - critical for effective high-speed surge suppression.

The HZC30-1TRF-E exhibits a temperature coefficient of approximately +0.07 %/°C (≈ +21 mV/°C) near 30 V, requiring thermal-aware placement in ambient-sensitive applications. Its 150 mW rating derates linearly to zero at 150°C junction temperature, with 50% power reduction at 75°C ambient per Fig.2.

Key Specifications

Parameter	Value and Actual Design Meaning
Zener Voltage (V_Z)	28.0–32.0 V at I_Z = 2 mA - defines clamping threshold for overvoltage events on protected lines
Dynamic Resistance (r_d)	80 Ω max at I_Z = 2 mA - determines voltage rise under surge current; lower r_d improves clamping precision
Power Dissipation (P_d)	150 mW at T_a = 25°C - sets maximum continuous steady-state power; derates to 0 at T_j = 150°C
ESD Capability	±30 kV (IEC 61000-4-2, C = 150 pF, R = 330 Ω) - qualifies for Level 4 system-level ESD immunity without external series impedance
Junction Temperature (T_j)	−55 to +150°C - supports operation in extended industrial environments including automotive under-hood proximity
Package	UFP (SC-79), 1.7 × 1.2 × 0.6 mm - surface-mount compatible with 0603 footprint; cathode-marked top-side laser marking

Pinout & Package

Ultra-small Flat Lead Package (UFP), JEITA SC-79 standard, 2-terminal SMD package with 1.7 mm × 1.2 mm body and 0.6 mm max height. Cathode marked by laser dot adjacent to terminal 1.

Pin/Terminal	Circuit Role	Design Meaning
1	Cathode	Connected to protected line (e.g., V_IN, USB_VBUS); reverse-biased during clamping
2	Anode	Connected to ground or lower-potential reference; completes conduction path during overvoltage

Key Features

Feature	Design Value
Surge Absorption Optimization	Designed specifically for fast transient suppression (e.g., EFT, ESD) with low r_d and controlled V_Z tolerance
Surface-Mount Compatibility	UFP package enables automated placement and reflow soldering without lead bending or mechanical stress
Taped Delivery	Supplied in embossed carrier tape (EIA-481 compliant), enabling high-speed pick-and-place assembly
High ESD Robustness	±30 kV contact discharge rating eliminates need for additional TVS stages in cost-sensitive consumer interfaces

Applications

Industrial Sensor Input Protection	USB 2.0 Data Line Clamp
Use Scenario: Protecting 4–20 mA analog sensor inputs from induced surges in factory-floor wiring harnesses. IC Role / Device Role / Timing Role: Unidirectional Zener clamp placed between signal line and ground, absorbing transients up to 150 mW without latch-up. Use Value: Maintains signal integrity below 32 V while limiting peak clamped voltage to ≤34 V at 200 mA surge (per r_d and V_Z slope).	Use Scenario: Safeguarding D+ and D− lines against ESD events during hot-plug insertion of USB peripherals. IC Role / Device Role / Timing Role: Low-capacitance (<1.5 pF typical) Zener diode used in parallel with data lines to shunt ESD energy before IC input structures. Use Value: Achieves ±30 kV IEC 61000-4-2 compliance without degrading signal rise/fall times due to sub-1 pF junction capacitance.
Low-Voltage DC Power Rail Clamp	Microcontroller GPIO Protection
Use Scenario: Clamping 3.3 V or 5 V supply rails against load-dump or inductive kickback in embedded control modules. IC Role / Device Role / Timing Role: Reverse-biased Zener connected between rail and ground, activated only during overvoltage excursions beyond nominal V_Z. Use Value: Limits rail overshoot to ≤32 V with <100 ns response, preventing brownout or latch-up in downstream LDOs and logic.	Use Scenario: Protecting 3.3 V microcontroller GPIO pins from accidental 12 V miswiring or electrostatic discharge during board handling. IC Role / Device Role / Timing Role: Standoff diode placed anode-to-GPIO, cathode-to-rail, providing bidirectional clamping via forward conduction and Zener breakdown. Use Value: Enables safe operation across −0.3 V to +32 V input range while maintaining <1 µA leakage at 3.3 V.

Industrial Sensor Input Protection

USB 2.0 Data Line Clamp

Use Scenario: Protecting 4–20 mA analog sensor inputs from induced surges in factory-floor wiring harnesses.

IC Role / Device Role / Timing Role: Unidirectional Zener clamp placed between signal line and ground, absorbing transients up to 150 mW without latch-up.

Use Value: Maintains signal integrity below 32 V while limiting peak clamped voltage to ≤34 V at 200 mA surge (per r_d and V_Z slope).

Use Scenario: Safeguarding D+ and D− lines against ESD events during hot-plug insertion of USB peripherals.

IC Role / Device Role / Timing Role: Low-capacitance (<1.5 pF typical) Zener diode used in parallel with data lines to shunt ESD energy before IC input structures.

Use Value: Achieves ±30 kV IEC 61000-4-2 compliance without degrading signal rise/fall times due to sub-1 pF junction capacitance.

Low-Voltage DC Power Rail Clamp

Microcontroller GPIO Protection

Use Scenario: Clamping 3.3 V or 5 V supply rails against load-dump or inductive kickback in embedded control modules.

IC Role / Device Role / Timing Role: Reverse-biased Zener connected between rail and ground, activated only during overvoltage excursions beyond nominal V_Z.

Use Value: Limits rail overshoot to ≤32 V with <100 ns response, preventing brownout or latch-up in downstream LDOs and logic.

Use Scenario: Protecting 3.3 V microcontroller GPIO pins from accidental 12 V miswiring or electrostatic discharge during board handling.

IC Role / Device Role / Timing Role: Standoff diode placed anode-to-GPIO, cathode-to-rail, providing bidirectional clamping via forward conduction and Zener breakdown.

Use Value: Enables safe operation across −0.3 V to +32 V input range while maintaining <1 µA leakage at 3.3 V.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode surge absorption applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MMBZ30VALT1G	Zener voltage 28.5–31.5 V; 100 mW P_d; SOT-23 package (2.9 × 1.3 × 1.0 mm)	Larger footprint and higher thermal resistance; requires PCB area reallocation	Select when existing design uses SOT-23 and board space permits larger package
BZX384-B30,115	Zener voltage 28.5–31.5 V; 300 mW P_d; SOD-323 package (1.7 × 1.3 × 0.9 mm)	Higher power rating but 2× higher r_d (120 Ω); less precise clamping under surge	Select when higher single-pulse energy handling is required and tighter voltage regulation is secondary

Compared with HZC30-1TRF-E, MMBZ30VALT1G offers identical V_Z tolerance but demands more PCB area and delivers lower surge power margin, while BZX384-B30 provides double the power rating at the cost of degraded dynamic impedance and looser voltage control - making HZC30-1TRF-E optimal for space-constrained, precision-clamping designs.

Availability

HZC30-1TRF-E is available at Aetrix Electronics and suitable for industrial sensor interfaces, USB peripheral protection, and low-voltage microcontroller I/O conditioning requiring stable component supply across production lifecycles.

Supply support for HZC30-1TRF-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The HZC Series belongs to Renesas' discrete protection portfolio, engineered specifically for compact, high-reliability surge suppression in space-constrained consumer and industrial electronics where low-profile SMD packaging and repeatable Zener characteristics are critical.

FAQ

What is the Zener voltage tolerance of HZC30-1TRF-E at 2 mA test current?

The HZC30-1TRF-E has a guaranteed Zener voltage range of 28.0 V to 32.0 V when tested at I_Z = 2 mA, corresponding to ±6.7% tolerance about the nominal 30 V rating. This specification is verified per Renesas REJ03G1204-0200 Rev.2.00 and applies across the full operating temperature range of −55°C to +150°C junction temperature.

Does HZC30-1TRF-E support bidirectional ESD protection?

No - HZC30-1TRF-E is a unidirectional Zener diode with cathode and anode terminals. For bidirectional protection, two HZC30-1TRF-E devices must be connected in series opposition (anode-to-anode), or a dedicated bidirectional TVS like the PESD5V0S1BA should be selected. The HZC30-1TRF-E itself conducts only in reverse bias above V_Z and forward bias above ~0.7 V.

What is the thermal derating behavior of HZC30-1TRF-E above 25°C ambient?

HZC30-1TRF-E follows linear thermal derating: its 150 mW power dissipation rating decreases by 1.2 mW/°C above 25°C ambient, reaching zero at 150°C junction temperature. This corresponds to a 50% power reduction at 75°C ambient, as confirmed in Fig.2 of the Renesas datasheet REJ03G1204-0200.

Is HZC30-1TRF-E RoHS-compliant and halogen-free?

Yes - HZC30-1TRF-E complies with EU RoHS Directive 2011/65/EU and is halogen-free per Renesas' environmental policy. Material declarations confirm lead-free terminations and absence of brominated flame retardants, antimony trioxide, or phosphorus-based flame retardants in the UFP package.

Can HZC30-1TRF-E replace a 33 V Zener diode in an existing circuit?

Not directly - HZC30-1TRF-E is rated for 28–32 V, whereas a 33 V Zener (e.g., HZC33) has a 31–35 V range. Substituting HZC30-1TRF-E may cause premature clamping and excessive power dissipation in circuits designed for 33 V standoff. Always verify V_Z margin, surge energy, and thermal design before cross-referencing within the HZC family.

HZC30-1TRF-E Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Voltage - Zener (Nom) (Vz):: -

Tolerance:: -

Power - Max:: -

Impedance (Max) (Zzt):: -

Current - Reverse Leakage @ Vr:: -

Voltage - Forward (Vf) (Max) @ If:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

HZC30-1TRF-E FAQ

1.How can I place an order for HZC30-1TRF-E through Aetrix?

Please submit a Request for Quotation (RFQ) for HZC30-1TRF-E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HZC30-1TRF-E reliable?

The price and inventory of HZC30-1TRF-E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HZC30-1TRF-E is usually 5 days.

3.What payment methods are accepted for HZC30-1TRF-E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HZC30-1TRF-E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HZC30-1TRF-E?

HZC30-1TRF-E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HZC30-1TRF-E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HZC30-1TRF-E?

For technical support, including HZC30-1TRF-E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HZC30-1TRF-E requirements.

6.How does Aetrix verify that HZC30-1TRF-E is sourced from the original manufacturer or authorized distributors?

All HZC30-1TRF-E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HZC30-1TRF-E meets industry standards.

7.What is the process for return or replacement of HZC30-1TRF-E?

All HZC30-1TRF-E units undergo pre-shipment inspection (PSI). If there is an issue with HZC30-1TRF-E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HZC30-1TRF-E part is unused and in its original packaging.

Return procedure for HZC30-1TRF-E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…