Renesas IDT6116LA35SO
- Part No.:
- IDT6116LA35SO
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
IDT6116LA35SO.pdf
- Description:
- IC SRAM 16KBIT PARALLEL 24SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,139
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Product details
Overview
IDT6116LA35SO from Integrated Device Technology is a 16K-bit (2K × 8) low-power CMOS static RAM with 35 ns access time, TTL-compatible I/O, and battery-backed data retention at 2 V. It operates across industrial temperature range (–45°C to +85°C), supports asynchronous read/write cycles without clocks or refresh, and is packaged in 24-pin SOIC for high-density PCB layouts in embedded controllers and instrumentation systems.
For engineers reviewing the IDT6116LA35SO datasheet, IDT6116LA35SO pinout, IDT6116LA35SO application, or IDT6116LA35SO equivalent, key selection criteria include standby current (25 µA TTL-level, 0.1 µA CMOS-level), data retention capability (2 V min), 24-pin SOIC footprint compatibility, and industrial-grade reliability per MIL-STD-883 Class B compliance.
Technical Context
The IDT6116LA35SO implements fully static asynchronous operation using advanced CMOS technology, eliminating need for clocks or refresh cycles. Its control logic uses independent Chip Select (CS), Output Enable (OE), and Write Enable (WE) signals to manage read, write, and standby modes - with automatic transition to low-power standby when CS is HIGH.
It features dual standby modes: TTL-level standby (ISB = 25 µA max) and full CMOS-level standby (ISB1 = 0.1 µA max), plus battery backup data retention down to 2 V (ICCDR ≤ 20 µA). All inputs and outputs meet TTL voltage thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V) and drive ±4 mA/±8 mA loads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 16,384 bits (2K × 8 organization) |
| Access Time | 35 ns max - defines minimum read cycle time in high-speed microcontroller interfaces |
| Supply Voltage | 5.0 V ±10% - compatible with standard TTL/CMOS logic rails |
| Data Retention Voltage | 2.0 V min - enables long-term memory hold during main power loss using coin-cell backup |
| Standby Current | 0.1 µA (CMOS-level) - enables ultra-low-power sleep mode in battery-operated systems |
| Operating Temperature | –45°C to +85°C - qualified for industrial environments including factory automation and telecom infrastructure |
| I/O Compatibility | TTL input thresholds and output drive - direct interface with legacy 5 V microcontrollers and FPGAs without level shifters |
Pinout & Package
Package: 24-pin Small Outline Integrated Circuit (SOIC), gull-wing lead form, 300 mil body width (SO24-2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Inputs | 11-bit address bus for selecting one of 2,048 memory locations |
| I/O0–I/O7 | Bi-directional Data Bus | 8-bit parallel interface for reading from or writing to selected location |
| CS | Chip Select | Active-low enable; drives device into standby (high-Z I/O) when HIGH |
| WE | Write Enable | Active-low control for write operations; latches data on falling edge when CS and OE are asserted |
| OE | Output Enable | Active-low control for read operations; enables output drivers only when CS is LOW |
| VCC | Power Supply | +5 V supply pin; must be decoupled locally to suppress switching noise |
| GND | Ground Reference | Signal and power return path; requires low-inductance connection to minimize ground bounce |
Key Features
| Feature | Design Value |
|---|---|
| Battery-backed data retention | Operates at 2 V with ≤20 µA retention current - enables non-volatile memory behavior without external EEPROM |
| Dual standby power modes | 0.1 µA (CMOS-level) and 25 µA (TTL-level) - selectable via CS and input voltage levels for flexible power management |
| No clock or refresh required | Fully static architecture - simplifies system timing design and eliminates refresh overhead in microcontroller-based systems |
| TTL-compatible I/O | Direct interface with 5 V logic families - avoids level-shifting components and reduces BOM cost |
| MIL-STD-883 Class B compliance | Qualified for high-reliability industrial applications - ensures robustness against thermal cycling and mechanical stress |
Applications
| Industrial PLC Memory Buffer | Medical Instrument Data Log |
|---|---|
Use Scenario: Stores real-time sensor readings and configuration parameters in programmable logic controllers during power interruptions. IC Role / Device Role / Timing Role: Non-volatile buffer memory providing 2K × 8-bit storage with battery-backed retention at 2 V. Use Value: Maintains critical operational state for >10 years on coin-cell backup, eliminating need for external NVSRAM or FRAM. | Use Scenario: Captures patient vital signs in portable ECG monitors between host processor wake cycles. IC Role / Device Role / Timing Role: Low-power static RAM acting as temporary data staging buffer before flash storage transfer. Use Value: Draws only 0.1 µA in full standby mode, extending battery life by >30% versus standard SRAM alternatives. |
| Avionics Control Panel Cache | Test Equipment Configuration Store |
Use Scenario: Holds display refresh data and user preference settings in cockpit display units exposed to –45°C to +85°C ambient. IC Role / Device Role / Timing Role: Industrial-temperature-rated SRAM with 35 ns access for real-time UI updates. Use Value: Guaranteed timing performance across full industrial range eliminates derating concerns in safety-critical avionics subsystems. | Use Scenario: Stores calibration coefficients and test sequence definitions in automated bench instruments. IC Role / Device Role / Timing Role: Pin-compatible memory used in FPGA-based controller subsystems requiring fast random-access reads/writes. Use Value: TTL-compatible I/O allows direct connection to Xilinx Spartan-3 FPGA banks without level translation, reducing layout complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-45ZSXI | 512K × 16-bit, 45 ns access, 3.3 V supply, 32-pin TSOP | Higher density and lower voltage; not pin-compatible or drop-in replaceable | Choose for new 3.3 V designs needing larger memory footprint and modern packaging |
| AS6C1008-35PCN | 128K × 8-bit, 35 ns access, 5 V supply, 28-pin SOIC | Same speed and voltage but different pin count and address depth; requires PCB redesign | Consider only if 128K capacity is required and board layout can accommodate 28-pin SOIC |
Compared with IDT6116LA35SO, CY62167EV30LL-45ZSXI offers higher density and lower voltage operation but demands full system requalification, while AS6C1008-35PCN provides identical speed and voltage but requires layout changes due to 28-pin SOIC packaging and extended address bus.
Availability
IDT6116LA35SO is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, avionics control panels, and test equipment requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for IDT6116LA35SO includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT) is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.
IDT6116LA35SO belongs to IDT's legacy high-reliability CMOS SRAM product line, designed specifically for industrial and military applications demanding low-power operation, battery backup, and extended temperature tolerance without refresh circuitry.
FAQ
What is the maximum operating temperature range for IDT6116LA35SO?
IDT6116LA35SO is rated for industrial temperature operation from –45°C to +85°C. This specification is guaranteed per the manufacturer's datasheet and validated under MIL-STD-883 Class B test conditions. The device maintains full functionality-including 35 ns access time and 0.1 µA standby current-across this entire range. No derating is required for timing or power parameters within these limits.
Does IDT6116LA35SO require an external clock or refresh signal?
No, IDT6116LA35SO does not require any external clock or refresh signal. It is a fully static RAM built with CMOS technology that retains data indefinitely as long as power is applied. The IDT6116LA35SO uses asynchronous control lines (CS, OE, WE) only, making it ideal for simple microcontroller interfaces where timing predictability and minimal external components are critical.
What is the minimum supply voltage required for data retention in IDT6116LA35SO?
IDT6116LA35SO supports data retention down to 2.0 V, a feature exclusive to the LA (low-power) version. At this voltage, the device consumes ≤20 µA (typical 1–4 µA), enabling long-term memory hold using small backup batteries or supercapacitors. This capability is confirmed in the datasheet's Data Retention Characteristics table and applies only when CS is HIGH and no active read/write cycles occur.
Is IDT6116LA35SO pin-compatible with other 24-pin SRAMs like the HM6116 or IS61LV256AL?
IDT6116LA35SO shares the same 24-pin SOIC package and 2K × 8 organization as HM6116, but differs in pin function mapping: HM6116 uses separate CE and OE pins, whereas IDT6116LA35SO combines chip select and output enable logic differently. IS61LV256AL is a 32K × 8 device in 28-pin SOIC and is not pin-compatible. Therefore, IDT6116LA35SO is not a drop-in replacement for either part without schematic and layout revision.
What are the two standby current modes supported by IDT6116LA35SO?
IDT6116LA35SO supports two distinct standby modes: TTL-level standby (ISB = 25 µA max) activated when CS > VIH, and full CMOS-level standby (ISB1 = 0.1 µA max) triggered when CS > VHC and all inputs are held at valid logic levels (VIN < VLC or VIN > VHC). The latter enables ultra-low-power operation in battery-critical applications, and both modes are specified across the full industrial temperature range.
IDT6116LA35SO Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Kbit
- Memory Organization:
- 2K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
IDT6116LA35SO FAQ
1.How can I place an order for IDT6116LA35SO through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT6116LA35SO on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT6116LA35SO reliable?
The price and inventory of IDT6116LA35SO are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT6116LA35SO is usually 5 days.
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IDT6116LA35SO orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDT6116LA35SO order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDT6116LA35SO?
For technical support, including IDT6116LA35SO datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT6116LA35SO requirements.
6.How does Aetrix verify that IDT6116LA35SO is sourced from the original manufacturer or authorized distributors?
All IDT6116LA35SO products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT6116LA35SO meets industry standards.
7.What is the process for return or replacement of IDT6116LA35SO?
All IDT6116LA35SO units undergo pre-shipment inspection (PSI). If there is an issue with IDT6116LA35SO, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT6116LA35SO part is unused and in its original packaging.
Return procedure for IDT6116LA35SO:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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