Renesas IDT6116LA35SOG8
- Part No.:
- IDT6116LA35SOG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
IDT6116LA35SOG8.pdf
- Description:
- IC SRAM 16KBIT PARALLEL 24SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,195
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Product details
Overview
IDT6116LA35SOG8 from Integrated Device Technology is a 16K-bit (2K × 8) low-power CMOS static RAM with 35 ns access time, TTL-compatible I/O, and battery-backed data retention at 2 V. It operates across industrial temperature range (–45°C to +85°C), supports asynchronous read/write cycles without clocks or refresh, and is used in embedded controllers, instrumentation, and legacy system memory expansion where power-constrained nonvolatile storage is required.
For engineers reviewing the IDT6116LA35SOG8 datasheet, IDT6116LA35SOG8 pinout, IDT6116LA35SOG8 application, or IDT6116LA35SOG8 equivalent, key selection considerations include standby current (25 µA TTL-level, 0.1 µA CMOS-level), data retention capability at 2 V, 24-pin SOIC package compatibility, and industrial-grade reliability under sustained bias conditions.
Technical Context
The IDT6116LA35SOG8 implements fully static asynchronous operation using high-reliability CMOS technology, eliminating need for clocks or refresh cycles. Its control logic responds to independent CS, OE, and WE signals to manage read, write, and high-impedance output states per the truth table - no internal state machines or timing dependencies beyond specified setup/hold windows.
It features dual standby modes: TTL-level standby (ISB = 25 µA max) triggered by CS > VIH, and ultra-low-power CMOS-level standby (ISB1 = 0.1 µA max) activated when CS > VHC and inputs held at valid logic levels. Data retention at VCC = 2.0 V is guaranteed across full industrial temperature range with ICCDR ≤ 1.5 µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2K × 8-bit (16,384 bits), byte-wide parallel interface |
| Access Time (tAA) | 35 ns max - determines minimum read latency in CPU or controller bus cycles |
| Supply Voltage | 5.0 V ±10% - compatible with standard TTL/CMOS logic rails |
| Standby Current (ISB) | 25 µA max (TTL-level) - enables low-power sleep in battery-backed systems |
| Data Retention Voltage | 2.0 V min - allows backup from coin cell or supercapacitor during main power loss |
| Operating Temperature | –45°C to +85°C - qualified for industrial environments without derating |
| Input/Output Compatibility | TTL-compatible - interfaces directly with 74LS, 74F, and microcontroller GPIO without level shifters |
Pinout & Package
Package: 24-pin Small Outline IC (SOIC), gull-wing lead form, 300 mil body width (SO24-2), RoHS-compliant lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Inputs | 11-bit address bus selecting one of 2,048 memory locations |
| I/O0–I/O7 | Bi-directional Data Bus | 8-bit parallel data path shared for read and write operations |
| CS | Chip Select | Active-low enable; drives device into ultra-low-power standby when HIGH |
| WE | Write Enable | Active-low signal controlling write cycle initiation and data latching |
| OE | Output Enable | Active-low control for output buffer; enables read data onto I/O lines |
| VCC | Power Supply | +5 V supply pin; must be decoupled locally to suppress switching noise |
| GND | Ground Reference | Signal and power return; requires low-impedance PCB connection |
Key Features
| Feature | Design Value |
|---|---|
| Battery backup data retention | Operates at 2.0 V with ≤1.5 µA retention current - enables years-long data hold on coin cell |
| Dual standby power modes | 25 µA (TTL-level) and 0.1 µA (CMOS-level) - selectable via input voltage thresholds |
| No clock or refresh required | Fully static architecture - eliminates timing-critical refresh overhead in microcontroller systems |
| TTL-compatible I/O | VIH = 2.2 V min, VOL = 0.4 V max - interoperable with legacy 5 V logic families without translators |
| MIL-STD-883 Class B compliance | Qualified for high-reliability industrial use - includes burn-in and environmental stress screening |
Applications
| Industrial PLC Memory Buffer | Medical Instrument Data Logger |
|---|---|
Use Scenario: Stores real-time sensor readings during mains power interruption in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile SRAM buffer holding last known state and configuration until power restoration. Use Value: 2 V data retention ensures >10-year data integrity on CR2032 backup without recharge circuitry. |
Use Scenario: Captures ECG waveform snapshots in portable diagnostic devices between host transfers. IC Role / Device Role / Timing Role: High-speed, low-power scratchpad memory interfacing directly with ADC and microcontroller bus. Use Value: 35 ns access time supports 28 MHz bus timing; 0.1 µA CMOS standby extends battery life by >30% vs standard SRAM. |
| Avionics Control Panel Cache | Legacy Industrial HMI Display Buffer |
Use Scenario: Holds UI state and calibration tables in cockpit display units exposed to wide thermal cycling. IC Role / Device Role / Timing Role: Radiation-hardened CMOS SRAM providing deterministic access under –55°C to +85°C operation. Use Value: MIL-STD-883 Class B qualification ensures zero soft errors from alpha particles in flight-critical systems. |
Use Scenario: Serves as frame buffer for monochrome LCDs in factory HMIs with infrequent firmware updates. IC Role / Device Role / Timing Role: Pin-compatible drop-in replacement for obsolete 6116-series SRAMs in aging designs. Use Value: Direct TTL interface and identical 24-pin SOIC footprint avoids PCB redesign while enabling lower power consumption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-45ZSXIT | 512K × 16-bit, 45 ns access, 3.3 V core, 5 V tolerant I/O | Higher density, lower voltage - requires level translation or redesigned power rail | Choose only if migrating to 3.3 V system architecture and needing >16K capacity |
| AS6C1008-35PCN | 128K × 8-bit, 35 ns access, 5 V only, 45 µA ISB (TTL) | Same speed and voltage but higher density and higher standby current | Acceptable for capacity upgrade paths where 25 µA standby is not critical |
Compared with IDT6116LA35SOG8, CY62167EV30LL-45ZSXIT offers greater density but mandates 3.3 V design changes, while AS6C1008-35PCN provides same-speed 128K capacity at higher standby draw - neither matches the unique 2 V data retention and 0.1 µA CMOS standby of IDT6116LA35SOG8.
Availability
IDT6116LA35SOG8 is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and avionics subsystems requiring stable component supply, long-lifecycle support, and proven reliability in extended temperature operation.
Supply support for IDT6116LA35SOG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT) was a U.S.-based semiconductor company specializing in timing, memory, and interface solutions before its acquisition by Renesas in 2019. It pioneered high-reliability CMOS SRAMs for military and industrial markets.
IDT6116LA35SOG8 belongs to the IDT6116SA/LA family of low-power static RAMs designed specifically for battery-backed, mission-critical embedded systems where data integrity during power loss is mandatory.
FAQ
What is the maximum operating temperature range for IDT6116LA35SOG8?
IDT6116LA35SOG8 is rated for industrial temperature operation from –45°C to +85°C. This range is explicitly defined in the ordering information and DC electrical characteristics tables, and it supports sustained bias conditions up to +85°C without derating. The device does not support commercial (0°C to +70°C) or military (–55°C to +125°C) grades - its marking and specification sheet confirm industrial-grade qualification only.
Does IDT6116LA35SOG8 require external refresh circuitry?
No, IDT6116LA35SOG8 is a fully static RAM and requires no clocks or refresh cycles. Its internal circuitry maintains data indefinitely as long as VCC remains within specification and CS is asserted appropriately. This eliminates timing-critical refresh overhead in microcontroller-based systems and simplifies PCB layout by removing associated timing constraints.
What is the data retention current of IDT6116LA35SOG8 at 2 V?
IDT6116LA35SOG8 draws ≤1.5 µA typical and ≤30 µA maximum (MIL grade) for data retention at VCC = 2.0 V across the full industrial temperature range. This value is specified in Table 10 (Data Retention Characteristics) and enables multi-year data hold using standard lithium coin cells without supplemental regulation or charging circuitry.
Can IDT6116LA35SOG8 be used with 3.3 V logic systems?
IDT6116LA35SOG8 is a 5 V-only device with TTL-compatible inputs (VIH ≥ 2.2 V) and outputs (VOH ≥ 2.4 V at IOH = –4 mA). While its inputs accept 3.3 V as valid HIGH, its outputs cannot drive 3.3 V logic reliably without level translation due to VOL = 0.4 V and VOH < 3.3 V. Direct interface is not recommended unless the receiving device has 5 V-tolerant inputs and accepts TTL voltage thresholds.
What package type does IDT6116LA35SOG8 use?
IDT6116LA35SOG8 uses a 24-pin Small Outline IC (SOIC) package with gull-wing leads and 300 mil body width (designated SO24-2 in IDT documentation). The "G8" suffix in the part number confirms this packaging variant, and the pin configuration diagram shows standard 24-pin DIP-compatible layout with pins 1–12 on one side and 13–24 on the other.
IDT6116LA35SOG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Kbit
- Memory Organization:
- 2K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
IDT6116LA35SOG8 FAQ
1.How can I place an order for IDT6116LA35SOG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT6116LA35SOG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT6116LA35SOG8 reliable?
The price and inventory of IDT6116LA35SOG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT6116LA35SOG8 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT6116LA35SOG8 transactions.
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4.How is shipping managed for IDT6116LA35SOG8?
IDT6116LA35SOG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDT6116LA35SOG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDT6116LA35SOG8?
For technical support, including IDT6116LA35SOG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT6116LA35SOG8 requirements.
6.How does Aetrix verify that IDT6116LA35SOG8 is sourced from the original manufacturer or authorized distributors?
All IDT6116LA35SOG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT6116LA35SOG8 meets industry standards.
7.What is the process for return or replacement of IDT6116LA35SOG8?
All IDT6116LA35SOG8 units undergo pre-shipment inspection (PSI). If there is an issue with IDT6116LA35SOG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT6116LA35SOG8 part is unused and in its original packaging.
Return procedure for IDT6116LA35SOG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IDT6116LA35SOG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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