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Renesas IDT70T3319S133DD

Part No.:
IDT70T3319S133DD
Manufacturer:
Renesas
Category:
Memory
Package:
144-LQFP Exposed Pad
Datasheet:
AetrixIDT70T3319S133DD.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 144TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,085

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Product details

Overview

IDT70T3319S133DD from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports 133MHz operation (7.5ns cycle time in pipelined mode), industrial temperature range (–40°C to +85°C), and features pipelined/flow-through output modes, dual chip enables, interrupt/collision flags, and JTAG IEEE 1149.1 compliance - deployed in real-time DSP inter-processor communication and FPGA-to-FPGA bridging systems.

For engineers reviewing the IDT70T3319S133DD datasheet, IDT70T3319S133DD pinout, IDT70T3319S133DD application, or IDT70T3319S133DD equivalent, key selection criteria include simultaneous left/right port access timing, VDDQ voltage configuration per port, sleep mode current (5–20mA), pipelined read latency (4.2ns max), and BGA package compatibility with depth expansion logic.

Technical Context

This device implements fully synchronous dual-port SRAM architecture with independent clock domains per port (CLKL/CLKR), register-controlled address/data/control inputs enabling tight setup/hold margins (1.5ns setup, 0.5ns hold). Each port supports configurable I/O voltage via dedicated OPTL/OPTR pins, allowing mixed-voltage system integration without level shifters.

It integrates on-chip address counter with ADS/CNTEN/REPEAT control, collision detection logic between ports, and dual-cycle deselect (DCD) for pipelined output mode. The memory array uses true dual-port cells enabling concurrent read/write to same location - critical for lock-free inter-processor data exchange in telecom baseband subsystems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256K × 18 bits (4.5 Mbit total); matches 16-bit data bus + parity or 18-bit wide FIFO buffer requirements
Max Clock Frequency133MHz (7.5ns cycle time in pipelined mode); enables 2.4 Gbps aggregate bandwidth per port
Core Supply2.5V ±100mV (VDD); fixed low-voltage core reduces dynamic power vs. 3.3V SRAMs
I/O Voltage OptionsSelectable 2.5V or 3.3V per port via OPTL/OPTR; eliminates external level translation in mixed-voltage SoC interfaces
Operating Temperature–40°C to +85°C (industrial grade); qualified for base station RF card and motor drive controller environments
Access Time4.2ns (max) clock-to-data-out in pipelined mode; meets sub-10ns deterministic latency needs in packet buffering
Power Consumption260–370mA dynamic current (both ports active); 5–20mA sleep mode current enables low-power idle states

Pinout & Package

Available in 256-pin Ball Grid Array (BGA) package, body size 17mm × 17mm × 1.4mm, 1.0mm ball pitch. All VDD pins require 2.5V connection; VDDQ pins must be set to 2.5V or 3.3V depending on OPT pin state per port.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-specific clock inputSynchronous edge-triggered timing reference for all port operations; independent domains enable asynchronous inter-port handshaking
CE0L/CE1L, CE0R/CE1RDual chip enable inputs per portEnable depth expansion without external logic; CE0/CE1 decode allows 2:1 chip select granularity
R/WL / R/WRRead/write direction controlActive-high write enable; supports byte-level writes via UBL/LBL without masking overhead
UBL / LBL, UBR / LBRUpper/lower byte enableIndependent 9-bit upper (I/O9–I/O17) and 9-bit lower (I/O0–I/O8) byte control per port for partial-word access
INTL / INTR, COLL / COLRInterrupt and collision flagsOpen-drain outputs signaling inter-port conflict or completion; used for hardware semaphore arbitration in multi-CPU systems
ZZL / ZZRSleep mode controlAsynchronous shutdown of dynamic inputs (except JTAG); reduces standby current to ≤20mA while preserving JTAG debug capability
OPTL / OPTRI/O voltage option selectDC input setting VDDQX operating level: VDD = 2.5V → 3.3V I/O; VSS = 0V → 2.5V I/O
PL/FTL / PL/FTRPipeline/flow-through mode selectConfigures output register behavior: VIH = pipelined (1-cycle latency), VIL = flow-through (0-cycle latency)

Key Features

FeatureDesign Value
True dual-port memory cellsEnables simultaneous read/write to identical address locations - essential for zero-latency inter-processor mailboxing
Self-timed write architectureEliminates external write pulse generation; internal timing ensures reliable write completion within 5ns cycle
Dual Cycle Deselect (DCD)Prevents metastability during pipelined output mode transitions by requiring two consecutive deselect cycles
Separate byte controls (UBL/LBL)Supports multiplexed bus protocols and legacy 8-bit peripheral interfacing without glue logic
JTAG IEEE 1149.1 complianceEnables boundary-scan testing and in-system programming without dedicated test pads or probes

Applications

Telecom Baseband ProcessingFPGA-to-FPGA Bridging

Use Scenario: Real-time frame buffering between two DSP cores handling LTE uplink/downlink channel processing.

IC Role / Device Role / Timing Role: Shared memory buffer with simultaneous access; pipelined mode provides deterministic 4.2ns read latency for symbol-level pipeline alignment.

Use Value: Eliminates software mutex overhead and enables lock-free data exchange at 133MHz sustained throughput.

Use Scenario: High-bandwidth data transfer between Xilinx and Intel FPGAs in reconfigurable radar signal processing chassis.

IC Role / Device Role / Timing Role: Asynchronous bridge memory with independent clock domains (CLKL/CLKR) and collision detection for handshake-free flow control.

Use Value: Sustains 2.4 Gbps per port with no clock domain crossing logic, reducing FPGA resource usage by >15%.

Motor Drive Controller BufferingIndustrial PLC Data Exchange

Use Scenario: Storing position/velocity feedback data between servo motion controller and safety monitoring MCU.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as fault-tolerant shared register bank; interrupt flags (INTL/INTR) trigger immediate safety response on data update.

Use Value: Meets SIL-3 functional safety timing constraints with <7ns interrupt assertion delay and –40°C to +85°C operation.

Use Scenario: Coordinating I/O scan data between redundant PLC CPUs in distributed control systems.

IC Role / Device Role / Timing Role: Inter-CPU mailbox with collision detection (COLL/COLR) preventing inconsistent state updates during failover.

Use Value: Guarantees atomic write-read sequences across CPUs without software arbitration, reducing scan cycle jitter by 3.2µs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133AXC3.3V core (not 2.5V); no OPT-selectable I/O voltage; 208-pin TQFP packageLacks mixed-voltage I/O support and industrial temp grade; requires level shifters in 2.5V system designsChoose only if legacy 3.3V-only board layout exists and thermal margin permits higher IDD
AS7C33256A-133BINSingle-port architecture; no dual-clock domains or collision detection; 100-pin TQFPCannot support true simultaneous access; requires external arbitration logic for multi-CPU useAcceptable only for cost-sensitive non-real-time buffering where latency and concurrency are not critical

Compared with CY7C1362BV33-133AXC and AS7C33256A-133BIN, the IDT70T3319S133DD uniquely delivers 2.5V core + selectable I/O voltage, industrial temperature rating, and hardware collision detection - making it the only viable option for deterministic, low-power, mixed-voltage dual-processor interconnects.

Availability

IDT70T3319S133DD is available at Aetrix Electronics and suitable for telecom baseband processing, FPGA-to-FPGA bridging, motor drive controller buffering, and industrial PLC data exchange requiring stable component supply across extended product lifecycles.

Supply support for IDT70T3319S133DD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF power solutions for communications and computing infrastructure.

The IDT70T33xx family was designed specifically for high-reliability, low-latency inter-processor communication in telecom, industrial automation, and defense electronics - emphasizing deterministic timing, mixed-voltage interoperability, and hardware-assisted concurrency control.

FAQ

What is the maximum operating frequency of the IDT70T3319S133DD in pipelined mode?

The IDT70T3319S133DD supports up to 133MHz operation in pipelined output mode, corresponding to a 7.5ns clock cycle time (tCYC2). This is validated for both commercial and industrial temperature ranges, with guaranteed tCD2 (clock-to-data valid) of 4.2ns maximum. The device achieves this performance using self-timed write and registered control paths, enabling reliable high-speed burst transfers in real-time systems.

Does the IDT70T3319S133DD support mixed-voltage operation between its left and right ports?

Yes, the IDT70T3319S133DD supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V, while OPTR held at VSS (0V) sets the right port to 2.5V I/O with VDDQR = 2.5V. This eliminates external level shifters in heterogeneous SoC interconnects, and is explicitly confirmed in the DC Operating Conditions tables for both 2.5V and 3.3V VDDQ configurations.

What is the function of the ZZL and ZZR pins on the IDT70T3319S133DD?

The ZZL and ZZR pins are asynchronous sleep mode controls for the left and right ports respectively. When asserted high (VIH), they disable dynamic inputs (except JTAG signals), reducing current consumption to 5–20mA depending on temperature grade. Static inputs like PL/FTx and OPTx remain functional during sleep, and JTAG remains accessible for debugging. Sleep mode recovery requires three clock cycles (tZZRC), and the feature is validated in the AC Electrical Characteristics table under tZZSC/tZZRC parameters.

How does collision detection work between ports on the IDT70T3319S133DD?

The IDT70T3319S133DD implements hardware collision detection that asserts COLL (left port) or COLR (right port) when both ports attempt to access the same memory location simultaneously. Detection occurs within 4.2ns (tCOLS), and flags remain asserted until cleared by subsequent non-conflicting access. Collision logic operates independently of OE/CE states and is synchronized to each port's clock domain, enabling lock-free arbitration in multi-CPU systems without software polling overhead.

What package type is used for the IDT70T3319S133DD, and what are its mechanical dimensions?

The IDT70T3319S133DD is packaged in a 256-pin Ball Grid Array (BGA) with part code BC256, measuring approximately 17mm × 17mm × 1.4mm with 1.0mm ball pitch. This package is distinct from the 208-pin fpBGA variant (BF208) used in other speed grades. Pin configuration data, including NC assignments (e.g., A18L and A18R are no-connect for IDT70T3319), is fully documented in the official pinout diagram and confirmed in the "Pin Configuration" section of the datasheet.

IDT70T3319S133DD Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
144-LQFP Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (20x20)

IDT70T3319S133DD FAQ

1.How can I place an order for IDT70T3319S133DD through Aetrix?

Please submit a Request for Quotation (RFQ) for IDT70T3319S133DD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IDT70T3319S133DD reliable?

The price and inventory of IDT70T3319S133DD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT70T3319S133DD is usually 5 days.

3.What payment methods are accepted for IDT70T3319S133DD?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT70T3319S133DD transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IDT70T3319S133DD?

IDT70T3319S133DD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IDT70T3319S133DD order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IDT70T3319S133DD?

For technical support, including IDT70T3319S133DD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT70T3319S133DD requirements.

6.How does Aetrix verify that IDT70T3319S133DD is sourced from the original manufacturer or authorized distributors?

All IDT70T3319S133DD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT70T3319S133DD meets industry standards.

7.What is the process for return or replacement of IDT70T3319S133DD?

All IDT70T3319S133DD units undergo pre-shipment inspection (PSI). If there is an issue with IDT70T3319S133DD, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IDT70T3319S133DD part is unused and in its original packaging.

Return procedure for IDT70T3319S133DD:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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