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Renesas IDT70T3319S133DDI

Part No.:
IDT70T3319S133DDI
Manufacturer:
Renesas
Category:
Memory
Package:
144-LQFP Exposed Pad
Datasheet:
AetrixIDT70T3319S133DDI.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 144TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,056

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Product details

Overview

IDT70T3319S133DDI from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture, 2.5V core supply, selectable 2.5V/3.3V I/O interface per port, and industrial-grade operation up to 133MHz (4.2ns access time). It enables simultaneous read/write access to the same memory location from independent left and right ports-ideal for real-time inter-processor communication in telecom line cards and packet buffering systems.

For engineers reviewing the IDT70T3319S133DDI datasheet, IDT70T3319S133DDI pinout, IDT70T3319S133DDI application, or IDT70T3319S133DDI equivalent, key selection criteria include pipelined vs. flow-through output mode timing, dual chip enable depth expansion capability, JTAG-compliant boundary scan support, and independent port voltage configuration via OPTL/OPTR pins.

Technical Context

This device implements fully synchronous dual-port SRAM architecture with separate address, data, and control registers on both ports-enabling 1.5ns setup and 0.5ns hold times at 200MHz operation. Each port features independent clock (CLKL/CLKR), read/write (R/WL/R/WR), chip enables (CE0L/CE1L, CE0R/CE1R), byte enables (UBL/LBL, UBR/LBR), and pipeline/flow-through mode selection (PL/FTL/PL/FTR).

It integrates collision detection (COLL/COLR) and interrupt flags (INTL/INTR), address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat logic (REPEATL/REPEATR) for burst addressing. Sleep mode (ZZL/ZZR) reduces current to 5mA while preserving JTAG accessibility and static input functionality.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256K × 18 bits (4.5 Mbit total); supports 256K-word depth with 18-bit parallel I/O per port
Max Clock Frequency 133 MHz (7.5 ns cycle time in pipelined mode); validated for industrial temperature range (−40°C to +85°C)
Access Time 4.2 ns (max) in pipelined output mode; enables sub-8ns system-level data transfer latency
Supply Voltages VDD = 2.5 V ±100 mV (core); VDDQL/VDDQR = 2.5 V or 3.3 V ±150 mV (I/Os), selected independently per port via OPTL/OPTR
Operating Temperature Industrial grade: −40°C to +85°C; qualified per JEDEC JESD22-A108
Package 256-pin BGA (BC256), 17 mm × 17 mm body, 1.0 mm ball pitch; RoHS-compliant green package
Standby Current 140 mA (ISB1, both ports TTL standby @133MHz); 5 mA (ISB3, full CMOS standby); 5 mA (Izz, sleep mode)

Pinout & Package

Package: 256-ball BGA (BC256), 17 mm × 17 mm × 1.4 mm, 1.0 mm pitch. All VDD pins require 2.5 V; VDDQ pins must match OPT pin state (2.5 V if OPT = VSS, 3.3 V if OPT = VDD).

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock inputs Rising-edge-triggered timing reference for all registered inputs/outputs on respective port
CE0L/CE1L, CE0R/CE1R Dual chip enables per port Enable depth expansion without external logic; CE0=VIL & CE1=VIH activates port
R/WL / R/WR Read/write direction control Synchronous control of data flow direction; overrides OE state during write cycles
OEL / OER Asynchronous output enable Tri-states outputs immediately regardless of clock; critical for bus sharing
UBL/LBL, UBR/LBR Byte-wide data masking Enables independent 9-bit upper/lower byte writes; supports multiplexed bus compatibility
PL/FTL / PL/FTR Pipeline/flow-through mode select VDD = pipelined (tCD2 = 4.2 ns), VSS = flow-through (tCD1 = 15 ns); configures output latency behavior
ADSL / ADSR Address strobe enable Latches external address into internal counter; enables burst addressing without sequential A0–A17 toggling
INTL / INTR Interrupt flag outputs Active-high open-drain signals indicating memory event completion or collision detection
COLL / COLR Collision detection flags Asserted when simultaneous access to identical address occurs; used for arbitration in multi-master systems
ZZL / ZZR Sleep mode inputs Shuts down dynamic circuitry per port while retaining JTAG and static input functionality
TCK/TMS/TDI/TDO/TRST JTAG boundary scan interface Fully compliant with IEEE 1149.1; enables in-system test and debug without intrusive probing

Key Features

Feature Design Value
True dual-port memory cells Enables concurrent read/write access to identical memory locations-eliminates arbitration overhead in inter-processor communication
Selectable pipelined or flow-through output mode Reduces effective read latency by up to 65% (4.2 ns vs. 15 ns) when pipelined; configurable per port via PL/FT pins
Dual chip enables (CE0/CE1) Supports seamless depth expansion across multiple devices without additional decode logic or glue ICs
Independent port voltage selection OPTL/OPTR pins allow left/right ports to operate at 2.5 V or 3.3 V I/O levels simultaneously-simplifies mixed-voltage system integration
Integrated collision and interrupt logic COLL/COLR and INTL/INTR flags provide hardware-level synchronization between processors-reduces software polling overhead
JTAG boundary scan compliance IEEE 1149.1 support enables production testability and in-field diagnostics without physical probe access

Applications

Telecom Line Card Buffering Real-Time Industrial PLC Communication

Use Scenario: High-throughput packet buffering between ingress and egress ASICs in carrier-grade Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared FIFO buffer with simultaneous write (ingress) and read (egress) access at 133 MHz.

Use Value: 4.2 ns pipelined access enables deterministic <8 ns round-trip latency for 10G+ packet forwarding pipelines.

Use Scenario: Interlocking data exchange between motion controller and I/O processor in CNC machine tools.

IC Role / Device Role / Timing Role: Shared memory hub synchronizing position commands and sensor feedback across two real-time CPUs.

Use Value: Collision detection flags eliminate race conditions during concurrent register updates-ensuring deterministic motion control loop timing.

Avionics Data Concentrator Medical Imaging Frame Store

Use Scenario: Aggregating ARINC 429 and MIL-STD-1553B bus data in flight management systems.

IC Role / Device Role / Timing Role: Dual-port memory bridging legacy avionics buses to modern ARM-based processing units.

Use Value: Independent 2.5V/3.3V I/O per port allows direct interfacing to mixed-voltage legacy peripherals without level shifters.

Use Scenario: Storing uncompressed DICOM image frames during MRI acquisition before compression and transmission.

IC Role / Device Role / Timing Role: High-bandwidth frame buffer enabling parallel acquisition (port A) and display processing (port B).

Use Value: 14 Gbps aggregate bandwidth (2 × 133 MHz × 18-bit) sustains real-time 4K medical imaging workflows without frame drops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress CY7C1362BV33-133AXC 256K × 18, 3.3V core & I/O, no 2.5V option; 133 MHz max; 208-pin TQFP package Requires external level shifting for 2.5V SoCs; lacks JTAG and sleep mode; higher power in standby (25 mA) Choose when board space permits TQFP and system uses only 3.3V interfaces.
Renesas R1EX24016AS0C0I#U0 128K × 16, 2.5V core/I/O, 100 MHz max; 100-pin TQFP; no pipelined mode or collision detection Half density and bandwidth; no dual-chip-enable expansion; limited to simpler inter-processor handshaking Choose for cost-sensitive, lower-bandwidth embedded control where advanced features are unnecessary.

Compared with CY7C1362BV33-133AXC and R1EX24016AS0C0I#U0, IDT70T3319S133DDI delivers unique value through per-port voltage flexibility, hardware collision arbitration, IEEE 1149.1 testability, and sub-5ns pipelined access-making it optimal for high-reliability, mixed-voltage, real-time systems.

Availability

IDT70T3319S133DDI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics data concentrators, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for IDT70T3319S133DDI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance silicon solutions for communications, computing, and industrial markets.

IDT70T3319S133DDI belongs to the 70T33xx family of high-speed synchronous dual-port SRAMs designed specifically for low-latency, deterministic inter-processor communication in mission-critical embedded systems.

FAQ

What is the maximum operating frequency of the IDT70T3319S133DDI?

The IDT70T3319S133DDI is rated for 133 MHz operation in industrial temperature range (−40°C to +85°C), delivering a 7.5 ns clock cycle time in pipelined mode. Its AC specifications guarantee 4.2 ns clock-to-data valid (tCD2) and 1.5 ns address setup time (tSA) under these conditions. The device supports higher speeds (up to 200 MHz) in commercial grade variants, but IDT70T3319S133DDI is specifically qualified for 133 MHz industrial use.

Does the IDT70T3319S133DDI support independent voltage configuration on each port?

Yes, the IDT70T3319S133DDI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5 V) configures the left port for 3.3 V I/O levels with VDDQL = 3.3 V, while OPTR = VSS (0 V) sets the right port to 2.5 V I/O with VDDQR = 2.5 V. This allows seamless interfacing with mixed-voltage SoCs and legacy peripherals without external level shifters.

How does the collision detection feature work in the IDT70T3319S133DDI?

The IDT70T3319S133DDI asserts COLL (left port) or COLR (right port) when both ports attempt simultaneous access to the same memory address. These open-drain flags are synchronized to the respective port's clock and can trigger external arbitration logic or CPU interrupts. The tCOLS parameter guarantees detection within 4.2 ns of the violating access, enabling deterministic resolution in real-time systems.

What package type is used for the IDT70T3319S133DDI?

IDT70T3319S133DDI uses a 256-ball BGA package (package code BC256), measuring 17 mm × 17 mm × 1.4 mm with 1.0 mm ball pitch. It is RoHS-compliant and designated as a "green" part. Pin assignments follow the standard 70T33xx layout, with NC pins including A18L, A18R, and several reserved balls per the datasheet pinout diagram.

Can the IDT70T3319S133DDI operate in sleep mode while maintaining JTAG functionality?

Yes, asserting ZZL and/or ZZR places the corresponding port into sleep mode, reducing dynamic current to 5 mA (Izz), while preserving JTAG functionality (TCK, TMS, TDI, TDO, TRST remain active). Static inputs-including PL/FTx, OPTx, and the ZZ pins themselves-are unaffected. Boundary scan operations are recommended outside sleep mode per datasheet guidance, but JTAG pins remain electrically accessible.

IDT70T3319S133DDI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
144-LQFP Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (20x20)

IDT70T3319S133DDI FAQ

1.How can I place an order for IDT70T3319S133DDI through Aetrix?

Please submit a Request for Quotation (RFQ) for IDT70T3319S133DDI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IDT70T3319S133DDI reliable?

The price and inventory of IDT70T3319S133DDI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT70T3319S133DDI is usually 5 days.

3.What payment methods are accepted for IDT70T3319S133DDI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT70T3319S133DDI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IDT70T3319S133DDI?

IDT70T3319S133DDI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IDT70T3319S133DDI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IDT70T3319S133DDI?

For technical support, including IDT70T3319S133DDI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT70T3319S133DDI requirements.

6.How does Aetrix verify that IDT70T3319S133DDI is sourced from the original manufacturer or authorized distributors?

All IDT70T3319S133DDI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT70T3319S133DDI meets industry standards.

7.What is the process for return or replacement of IDT70T3319S133DDI?

All IDT70T3319S133DDI units undergo pre-shipment inspection (PSI). If there is an issue with IDT70T3319S133DDI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IDT70T3319S133DDI part is unused and in its original packaging.

Return procedure for IDT70T3319S133DDI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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