Renesas IDT70V7319S166DD
- Part No.:
- IDT70V7319S166DD
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
IDT70V7319S166DD.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 144TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,175
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Product details
Overview
IDT70V7319S166DD from Integrated Device Technology is a high-speed 256K × 18 (4 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (4.2 ns access), pipelined/flow-through output mode selection, and dual 3.3 V / 2.5 V I/O voltage support per port. It enables concurrent memory access in telecom line cards and packet buffer applications requiring low-latency inter-port coordination.
For engineers reviewing the IDT70V7319S166DD datasheet, IDT70V7319S166DD pinout, IDT70V7319S166DD application, or IDT70V7319S166DD equivalent, key selection criteria include bank-switchable arbitration timing, dual-voltage I/O configurability via OPT pins, JTAG IEEE 1149.1 compliance, industrial temperature support at 133 MHz, and fpBGA-208 vs. BGA-256 package availability.
Technical Context
This device implements a true SRAM core-not traditional dual-port-enabling bank-switchable access across 64 independent 4K × 18 banks. Each port controls its own bank address (BA0–BA5) and operates fully synchronously with dedicated clock, control, and data registers.
It supports two distinct output modes: pipelined (3.6 ns tCD2 @ 166 MHz) for burst throughput, and flow-through (12 ns tCD1) for minimal latency reads. Counter enable (CNTEN) and repeat (REPEAT) features allow autonomous address sequencing without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18 (4 Mbit), organized as 64 independent 4K × 18 banks |
| Max Clock Frequency | 166 MHz (industrial & commercial), enabling 5 ns cycle time in pipelined mode |
| Access Time | 4.2 ns (max) at 133 MHz; 3.6 ns (max) at 166 MHz in pipelined output mode |
| I/O Voltage Support | Selectable 3.3 V (±150 mV) or 2.5 V (±100 mV) per port via OPTL/OPTR pins |
| Operating Temperature | Industrial range (−40°C to +85°C) supported at 133 MHz; commercial only at 166 MHz |
| Package | 208-pin fine-pitch BGA (BF208), 15 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch |
| JTAG Compliance | Fully compliant with IEEE 1149.1 boundary-scan architecture |
Pinout & Package
Package: 208-pin fine-pitch Ball Grid Array (fpBGA), 15 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch. All VDD pins require 3.3 V supply; VDDQ pins must match OPT pin logic level (3.3 V if OPT = VIH, 2.5 V if OPT = VIL).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all port operations |
| CE0L/CE1L, CE0R/CE1R | Dual chip enables per port | Enable depth expansion without external logic; CE0=VIL & CE1=VIH activates port |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | DC-configurable output latency mode: VIH = pipelined (1-cycle delay), VIL = flow-through (no delay) |
| BA0L–BA5L / BA0R–BA5R | Bank address inputs | Select one of 64 banks (0–63); conflict occurs if both ports target same bank simultaneously |
| OPTL / OPTR | I/O voltage option control | Set VIH (3.3 V) or VIL (0 V) to configure corresponding port's VDDQ and interface voltage level |
| TMS, TCK, TDI, TDO, TRST | JTAG test interface | IEEE 1149.1-compliant boundary-scan for production test and debug |
Key Features
| Feature | Design Value |
|---|---|
| Bank-switchable architecture | 64 independent 4K × 18 banks allow non-conflicting concurrent access by left/right ports |
| Selectable output mode | Pipelined (3.6 ns tCD2 @ 166 MHz) or flow-through (12 ns tCD1) - configurable per port |
| Dual-voltage I/O per port | Independent 3.3 V or 2.5 V interface on each port via OPT pins and dedicated VDDQ supplies |
| Counter & repeat logic | On-chip address counter with CNTEN/REPEAT enables burst transfers without external address generation |
| Depth expansion support | Dual CE0/CE1 per port allows stacking multiple devices without additional decode logic |
Applications
| Telecom Line Card Buffering | Network Packet Switching |
|---|---|
|
Use Scenario: Storing and forwarding variable-length packets between ingress and egress ASICs in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared packet buffer with left port writing incoming frames and right port reading for transmission scheduling. Use Value: Bank-switchable arbitration prevents port contention during simultaneous read/write, maintaining deterministic 166 MHz throughput across traffic bursts. |
Use Scenario: Implementing deep, low-latency FIFOs in 10G/25G optical transport equipment where jitter-sensitive timing margins exist. IC Role / Device Role / Timing Role: Provides synchronized, clock-domain-crossing storage between SerDes PHY and MAC layer logic. Use Value: Pipelined output mode delivers 3.6 ns clock-to-data with 5 ns cycle time, meeting sub-10 ns setup/hold requirements for high-speed parallel interfaces. |
| Industrial PLC Data Logging | Radar Signal Processing Buffer |
|
Use Scenario: Capturing sensor telemetry streams and timestamped event logs in ruggedized programmable logic controllers operating at −40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade dual-port RAM stores real-time process data while allowing background host CPU readout without interrupting acquisition. Use Value: Full industrial temperature support at 133 MHz ensures reliable operation under thermal stress, with self-timed write enabling consistent cycle time across voltage/temperature. |
Use Scenario: Holding intermediate FFT results and beamforming coefficients in phased-array radar systems requiring deterministic memory access timing. IC Role / Device Role / Timing Role: Serves as low-jitter, dual-access scratchpad memory between ADC front-end and DSP engine. Use Value: Flow-through output mode provides 12 ns tCD1 latency for immediate coefficient fetch, critical for real-time phase correction loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-ported SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C1362BV33 | 256K × 18, 166 MHz, but uses conventional dual-port core (not bank-switchable); no CNTEN/REPEAT logic | Lacks autonomous address sequencing; requires external counter logic for burst transfers | Prefer IDT70V7319S166DD when bank arbitration and counter features reduce system logic count |
| Renesas R1EX25618AS-166 | Same 256K × 18 organization and 166 MHz speed, but only supports 3.3 V I/O (no 2.5 V option); no JTAG | Not suitable for mixed-voltage systems or designs requiring boundary-scan testability | Choose IDT70V7319S166DD for dual-voltage flexibility and IEEE 1149.1 compliance in production test environments |
Compared with CY7C1362BV33 and R1EX25618AS-166, the IDT70V7319S166DD uniquely combines bank-switchable arbitration, per-port voltage selection, and integrated address counter logic-reducing external component count and enabling deterministic multi-port memory sharing in bandwidth-constrained systems.
Availability
IDT70V7319S166DD is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and radar signal processing applications requiring stable component supply, long-term lifecycle management, and traceable sourcing.
Supply support for IDT70V7319S166DD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions.
The IDT70V7319S product line delivers high-bandwidth, low-latency dual-ported SRAMs optimized for telecom, networking, and real-time embedded systems demanding concurrent memory access and deterministic timing.
FAQ
What is the maximum operating frequency of the IDT70V7319S166DD?
The IDT70V7319S166DD supports up to 166 MHz operation in commercial temperature range (0°C to +70°C). At this speed, it achieves a 5 ns clock cycle time in pipelined output mode. Industrial temperature operation (−40°C to +85°C) is rated at 133 MHz maximum, with 7.5 ns cycle time. The 166 MHz grade is not available in the fpBGA-208 package for industrial use.
Does the IDT70V7319S166DD support mixed-voltage I/O operation?
Yes - the IDT70V7319S166DD supports independent I/O voltage selection per port: OPTL configures the left port for either 3.3 V (OPTL = VIH) or 2.5 V (OPTL = VIL), and OPTR does the same for the right port. Corresponding VDDQL and VDDQR supplies must match the selected voltage level. Core VDD remains fixed at 3.3 V.
How does bank-switchable arbitration work in the IDT70V7319S166DD?
The IDT70V7319S166DD divides memory into 64 independent 4K × 18 banks. Each port selects its target bank using BA0–BA5 inputs. If both ports attempt simultaneous access to the same bank, neither access is valid and data corruption may occur. Designers must ensure BA0L–BA5L ≠ BA0R–BA5R to guarantee safe concurrent operation.
What is the purpose of the CNTEN and REPEAT signals in the IDT70V7319S166DD?
CNTEN enables automatic address increment on each clock rising edge, supporting burst transfers without external address generation. REPEAT resets the internal counter to the last valid address loaded via ADS, enabling repeated access to a specific location. Both functions operate independently per port and require no software intervention once configured.
Which package variants are offered for the IDT70V7319S166DD?
The IDT70V7319S166DD is available in two packages: 208-pin fine-pitch BGA (BF208, 15 mm × 15 mm, 0.8 mm pitch) and 256-pin BGA (BC256, 17 mm × 17 mm, 1.0 mm pitch). The 166 MHz speed grade is offered in both packages for commercial use, but only the BC256 package supports 166 MHz in industrial temperature range.
IDT70V7319S166DD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 144-LQFP Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 144-TQFP (20x20)
IDT70V7319S166DD FAQ
1.How can I place an order for IDT70V7319S166DD through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT70V7319S166DD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT70V7319S166DD reliable?
The price and inventory of IDT70V7319S166DD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT70V7319S166DD is usually 5 days.
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Once your IDT70V7319S166DD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDT70V7319S166DD?
For technical support, including IDT70V7319S166DD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT70V7319S166DD requirements.
6.How does Aetrix verify that IDT70V7319S166DD is sourced from the original manufacturer or authorized distributors?
All IDT70V7319S166DD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT70V7319S166DD meets industry standards.
7.What is the process for return or replacement of IDT70V7319S166DD?
All IDT70V7319S166DD units undergo pre-shipment inspection (PSI). If there is an issue with IDT70V7319S166DD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT70V7319S166DD part is unused and in its original packaging.
Return procedure for IDT70V7319S166DD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IDT70V7319S166DD Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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