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Renesas IDT71P71804S250BQ

Part No.:
IDT71P71804S250BQ
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
AetrixIDT71P71804S250BQ.pdf
Description:
IC SRAM 18MBIT PAR 165CABGA
Quantity:
Payment:
Payment
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Shipping

Inventory:4,096

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Product details

Overview

IDT71P71804S250BQ from Integrated Device Technology is a 1M × 18-bit, 18 Mb pipelined DDR II SRAM with burst-of-2 operation, 250 MHz clock frequency (4 ns K,K cycle time), HSTL-compatible 1.5 V I/O interface (VDDQ), and 1.8 V core supply (VDD). It delivers double-data-rate bandwidth via dual-edge-aligned echo clocks (CQ/CQ) and supports scalable output impedance (35–70 Ω) for signal integrity in high-speed memory subsystems used in network packet buffers and baseband processors.

For engineers reviewing the IDT71P71804S250BQ datasheet, IDT71P71804S250BQ pinout, IDT71P71804S250BQ application, or IDT71P71804S250BQ equivalent, key selection criteria include its 1M×18 organization, 165-ball fBGA package, programmable ZQ impedance calibration, DLL-enabled tight data-to-clock alignment, and support for SA0-controlled burst reversal in x18 mode.

Technical Context

The IDT71P71804S250BQ implements a synchronous, pipelined DDR II architecture with two independent clock domains: K/K for address/control/data capture and C/C for read data output timing. Its internal DLL aligns DQ outputs to C/C edges with sub-0.5 ns jitter tolerance, enabling reliable 250 MHz operation (tKHKH = 4.0 ns min).

It features multiplexed address inputs, common read/write data port (DQ[17:0]), dual echo clocks (CQ/CQ), and byte write control (BW0/BW1) for selective 9-bit word updates. The device uses HSTL Class I inputs with VREF reference and supports voltage scaling from 1.4 V to 1.9 V on VDDQ while maintaining 1.8 V core logic.

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 18 Mb total, configured as 1,048,576 × 18 bits - enables compact, high-bandwidth storage for 18-bit datapaths without external depth expansion.
Clock Frequency 250 MHz (tKHKH = 4.0 ns min) - supports 500 MT/s effective data rate per DQ line with burst-of-2 transfers.
Supply Voltages VDD = 1.7–1.9 V (core), VDDQ = 1.4–1.9 V (I/O), VREF = VDDQ/2 - allows interoperability with 1.5 V HSTL, 1.8 V TTL, or custom interface levels.
Output Impedance Programmable 35–70 Ω via ZQ pin and external RQ resistor - enables precise PCB trace termination matching to reduce reflections and EMI.
Data Interface DDR bidirectional DQ[17:0] with echo clocks CQ/CQ - provides source-synchronous timing for deterministic setup/hold margins in point-to-point or multi-drop topologies.
Package 165-ball fine-pitch BGA (13 mm × 15 mm, 1.0 mm pitch) - optimized for high-density routing and thermal dissipation in telecom and networking modules.
Temperature Range Commercial grade (0 °C to +70 °C ambient) - validated for stable operation in non-extended-environment embedded systems.

Pinout & Package

Package: 165-ball fBGA (13 mm × 15 mm, 1.0 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Data I/O (bidirectional) Synchronous DDR data bus; sampled on K/K rising edges during writes, driven aligned to C/C rising edges during reads; high-Z when deselected.
BW0, BW1 Byte Write Enable (active low) Selects which 9-bit half-word (DQ[8:0] or DQ[17:9]) is updated during write bursts; enables partial-word writes without read-modify-write overhead.
SA0 Burst Address Bit Controls linear vs. reversed burst order (a,b = 0,1 or 1,0) for x18 configuration - critical for cache-line or descriptor-aligned access patterns.
K, K Primary Input Clock Pair Latches address, control (LD, R/W), and write data; drives internal logic and output register when C/C are disabled (single-clock mode).
C, C Output Clock Pair Drives read data timing; generates echo clocks CQ/CQ; optional use with DLL for sub-cycle data alignment - essential for timing closure at 250 MHz.
CQ, CQ Output Echo Clocks Source-synchronous strobes tightly aligned to DQ outputs (tCQHQV ≤ 0.30 ns); remain active even when DQ is high-Z - used as data-valid indicators by controllers.
ZQ Impedance Calibration Input Connects to external RQ (175–350 Ω) to ground; sets output driver impedance to 0.2 × RQ - enables dynamic compensation for voltage/temperature drift every 1024 cycles.
VDDQ I/O Power Supply Independent 1.4–1.9 V rail for DQ/CQ drivers - decouples interface voltage from core logic, allowing mixed-voltage system integration.
VREF HSTL Reference Voltage Static input set to VDDQ/2; defines switching threshold for all HSTL inputs (K, C, LD, R/W, SA) - ensures noise-immune signal detection across voltage range.
Doff DLL Disable Control Pulling low disables internal delay-locked loop; increases propagation delay but simplifies timing analysis when DLL calibration is unnecessary or unstable.

Key Features

Feature Design Value
Burst-of-2 DDR Data Transfer Delivers two 18-bit words per clock cycle on DQ[17:0], doubling effective bandwidth versus single-data-rate SRAMs at same clock frequency.
Programmable Output Impedance Adjustable 35–70 Ω drive strength via ZQ pin and external resistor - eliminates need for discrete series termination resistors and reduces board area/cost.
DLL-Based Data-to-Clock Alignment Internal delay-locked loop aligns DQ outputs to C/C edges within ±0.30 ns (tCQHQV/tCQHQX), enabling robust timing margin at 250 MHz operation.
HSTL Interface Scalability Supports VDDQ from 1.4 V to 1.9 V with fixed VREF = VDDQ/2 - allows seamless interfacing with 1.5 V HSTL, 1.8 V LVTTL, or custom logic families.
SA0-Controlled Burst Reversal SA0 input selects burst sequence (0→1 or 1→0) for 18-bit words - enables flexible addressing of descriptors, headers, or interleaved data structures in packet processing.

Applications

Network Packet Buffering Baseband Signal Processing

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in telecom line cards where latency and throughput must meet strict SLA requirements.

IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer between MAC layer and traffic manager; operates as burst-of-2 DDR slave with controller-driven C/C timing.

Use Value: 500 MT/s effective bandwidth and sub-4 ns cycle time enable full-line-rate buffering for 10 Gbps interfaces without pipeline stalls or external FIFOs.

Use Scenario: Holding intermediate FFT coefficients or channel estimation results in 4G/LTE baseband units requiring deterministic read/write timing.

IC Role / Device Role / Timing Role: Synchronous memory co-processor interfaced to DSP or FPGA fabric; uses SA0 to reverse burst order for natural coefficient ordering in butterfly operations.

Use Value: DLL-aligned CQ/CQ outputs eliminate external deskew circuitry, reducing BOM count and improving phase margin across temperature for real-time signal chain stability.

High-Performance Computing Cache Industrial Motion Controller Memory

Use Scenario: Serving as L2 tag RAM or instruction scratchpad in multi-core SoCs where memory access predictability impacts thread scheduling efficiency.

IC Role / Device Role / Timing Role: Pipelined SRAM with common read/write port and burst-of-2 access - minimizes arbitration overhead and supports back-to-back request streams.

Use Value: 1.8 V core + 1.5 V I/O separation reduces dynamic power by ~25% versus 3.3 V SRAMs, while HSTL signaling lowers switching noise in dense compute clusters.

Use Scenario: Storing motion profile tables and encoder feedback history in servo drives requiring deterministic jitter-free memory access under EMI-heavy factory conditions.

IC Role / Device Role / Timing Role: Deterministic latency memory with programmable ZQ termination - maintains signal integrity on long PCB traces between FPGA and motor control ASIC.

Use Value: Adjustable 35–70 Ω output impedance compensates for trace impedance variations across production batches, eliminating field failures due to signal reflection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress CY7C1551KV18 Same 1M×18 DDR II architecture, 250 MHz rating, and 165-ball fBGA; differs in JTAG pin assignment (TMS/TDI swapped) and absence of SA0 burst reversal. Lacks SA0-controlled burst reversal - unsuitable for applications requiring dynamic burst-order adaptation like adaptive filtering or variable-length descriptor handling. Select IDT71P71804S250BQ when SA0 functionality or tighter DLL jitter specs (±0.30 ns vs. ±0.45 ns) are required for timing-critical signal processing.
Micron MT46V16M18 1M×18 DDR SDRAM (not SRAM); requires refresh, has longer latency (CAS latency ≥3), and uses different command protocol (ACTIVATE/PRECHARGE). Not pin-compatible; incompatible timing model and control interface - cannot substitute without FPGA/controller firmware redesign. Choose IDT71P71804S250BQ for zero-refresh, deterministic latency, and simplified controller logic in real-time embedded systems where DDR SDRAM unpredictability is unacceptable.

Compared with CY7C1551KV18 and MT46V16M18, the IDT71P71804S250BQ uniquely combines burst-order flexibility (SA0), sub-0.3 ns DLL alignment, and true SRAM simplicity-making it optimal for deterministic, low-jitter memory subsystems in telecom and industrial control.

Availability

IDT71P71804S250BQ is available at Aetrix Electronics and suitable for network packet buffering, baseband signal processing, high-performance computing cache, and industrial motion controller memory requiring stable component supply and long-term obsolescence management.

Supply support for IDT71P71804S250BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The IDT71P71804S250BQ belongs to IDT's QDR™ II SRAM family, engineered specifically for bandwidth-intensive, low-latency applications such as network switches, routers, and baseband processors where DDR II's burst-of-2 and echo-clock architecture maximizes data throughput without increasing clock frequency.

FAQ

What is the maximum operating frequency of the IDT71P71804S250BQ?

The IDT71P71804S250BQ is rated for 250 MHz operation, corresponding to a minimum K,K clock cycle time (tKHKH) of 4.0 ns. This enables a sustained 500 MT/s data rate on its 18-bit DDR bus. The device supports lower frequencies (200 MHz, 167 MHz) with relaxed timing margins, but 250 MHz represents its highest validated speed grade per the advance information datasheet.

Does the IDT71P71804S250BQ require an external termination resistor?

No, the IDT71P71804S250BQ does not require external series termination resistors on its DQ or CQ lines. Its programmable output impedance (35–70 Ω) is calibrated via the ZQ pin and an external RQ resistor (175–350 Ω to ground), allowing precise matching to PCB trace impedance and eliminating discrete components.

How does the SA0 pin affect memory access in the IDT71P71804S250BQ?

In the IDT71P71804S250BQ, the SA0 pin controls burst sequence order for 18-bit words: when SA0 = 0, the burst reads/writes words in linear order (a then b); when SA0 = 1, it reverses the order (b then a). This feature supports efficient handling of interleaved data structures like packet headers and payloads without software reordering.

Can the IDT71P71804S250BQ operate with only the K,K clocks, without C,C?

Yes, the IDT71P71804S250BQ supports single-clock mode: tying C and C high disables their function, causing K,K to control both input latching and output timing. In this mode, DQ outputs align to K,K edges instead of C,C, and echo clocks CQ/CQ are generated from K,K - simplifying clock distribution at the cost of reduced timing margin.

What is the purpose of the Doff pin on the IDT71P71804S250BQ?

The Doff pin disables the internal delay-locked loop (DLL) when pulled low. With DLL off, DQ output timing follows K,K or C,C propagation delay directly (no active deskew), increasing tCHQV/tCHQX by ~0.5 ns. This mode is useful for debug, low-power states, or systems where DLL lock instability occurs - but sacrifices the tight data-to-clock alignment critical for 250 MHz operation.

IDT71P71804S250BQ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.3 ns
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

IDT71P71804S250BQ FAQ

1.How can I place an order for IDT71P71804S250BQ through Aetrix?

Please submit a Request for Quotation (RFQ) for IDT71P71804S250BQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IDT71P71804S250BQ reliable?

The price and inventory of IDT71P71804S250BQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT71P71804S250BQ is usually 5 days.

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IDT71P71804S250BQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IDT71P71804S250BQ?

For technical support, including IDT71P71804S250BQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT71P71804S250BQ requirements.

6.How does Aetrix verify that IDT71P71804S250BQ is sourced from the original manufacturer or authorized distributors?

All IDT71P71804S250BQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT71P71804S250BQ meets industry standards.

7.What is the process for return or replacement of IDT71P71804S250BQ?

All IDT71P71804S250BQ units undergo pre-shipment inspection (PSI). If there is an issue with IDT71P71804S250BQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IDT71P71804S250BQ part is unused and in its original packaging.

Return procedure for IDT71P71804S250BQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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