Renesas IDT71P73604S200BQ8
- Part No.:
- IDT71P73604S200BQ8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
IDT71P73604S200BQ8.pdf
- Description:
- IC SRAM 18MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IDT71P73604S200BQ8 from Integrated Device Technology is a 18 Mb (512K × 36-bit) pipelined DDR-II SRAM with double-data-rate burst-of-4 operation, HSTL-compatible 1.5 V I/O interface (VDDQ), and 1.8 V core supply (VDD). It features dual echo clocks (CQ/CQ), programmable output impedance (35–70 Ω), and JTAG support. Designed for high-bandwidth packet buffering in network switches and routers.
For engineers reviewing the IDT71P73604S200BQ8 datasheet, IDT71P73604S200BQ8 pinout, IDT71P73604S200BQ8 application, or IDT71P73604S200BQ8 equivalent, this page delivers verified specifications, validated pin functions, confirmed x36 burst architecture, HSTL timing compliance at 200 MHz, and real-world substitution guidance - all grounded in the official IDT DSC-6431/00 datasheet.
Technical Context
The IDT71P73604S200BQ8 implements a synchronous, pipelined DDR-II architecture with two independent clock domains: K/K for address/control/data capture and C/C for data readout and echo clock generation. Its burst-of-4 operation delivers four 36-bit words per two clock cycles, achieving effective 400 MT/s on the DQ bus at 200 MHz K-clock frequency.
It supports SA0/SA1-controlled linear burst sequencing, scalable output drive via external ZQ resistor (175–350 Ω), and DLL-enabled tight data-to-clock alignment (tCHQV ≤ 0.45 ns). All inputs and outputs comply with HSTL Class I (1.5 V) with voltage scaling up to 1.9 V, and feature separate VDDQ and VREF for interface flexibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 18 Mb total, organized as 512K × 36-bit - enables single-chip wide-data storage for 36-bit parallel buses without depth expansion. |
| Max Clock Frequency | 200 MHz K-clock (tKHKH = 5.00 ns min) - defines maximum sustained access rate for burst reads/writes. |
| Data Rate | 400 MT/s effective (DDR) - delivers 14.4 Gb/s aggregate bandwidth on 36-bit DQ bus at 200 MHz. |
| Supply Voltages | VDD = 1.7–1.9 V (core), VDDQ = 1.4–1.9 V (I/O), VREF = VDDQ/2 ± 0.1 V - allows interface compatibility with 1.5 V HSTL or scaled 1.8 V systems. |
| Output Impedance | Programmable 35–70 Ω via ZQ pin and external RQ (175–350 Ω) - enables precise transmission-line matching for signal integrity on high-speed PCBs. |
| Timing Reference | tCHQV ≤ 0.45 ns (C/C HIGH to DQ valid) - guarantees sub-nanosecond data launch alignment critical for source-synchronous interfaces. |
| Package | 165-ball fBGA, 1.0 mm pitch, 13 mm × 15 mm - industry-standard footprint for high-pin-count memory with thermal and routing advantages. |
Pinout & Package
Package: 165-ball fine-pitch Ball Grid Array (fBGA), 1.0 mm pitch, 13 mm × 15 mm body size, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data I/O | 36-bit DDR data bus sampled on rising edges of K/K during writes; driven aligned to C/C (or K/K in single-clock mode) during reads. |
| BW0–BW3 | Synchronous byte write enable (active LOW) | Four independent controls for DQ[8:0], [17:9], [26:18], [35:27] - enables partial-word writes without read-modify-write overhead. |
| SA0, SA1 | Burst sequence address bits | Select linear burst order (a→b→c→d) per Table 22; only present on x18/x36 devices like IDT71P73604S200BQ8. |
| K, K | Primary input clocks | Rising edges latch addresses, R/W, LD, BWx, and first/third (K) or second/fourth (K) burst words - fundamental timing reference. |
| C, C | Output clock inputs | Drive DLL-aligned read data and generate echo clocks CQ/CQ; may be disabled (tied HIGH) to use K/K exclusively. |
| CQ, CQ | Synchronous echo clock outputs | Free-running, tightly aligned to DQ outputs (tCQHQV ≤ 0.35 ns); used as data-valid strobes in source-synchronous systems. |
| ZQ | Output impedance calibration input | Connected to external RQ (250 Ω typical) to set nominal 50 Ω drive strength; tying to VDDQ forces minimum impedance mode. |
| VDDQ, VREF | I/O power and reference | VDDQ powers DQ/CQ/BWx outputs; VREF sets HSTL switching threshold at VDDQ/2 - decoupled from 1.8 V core (VDD). |
Key Features
| Feature | Design Value |
|---|---|
| DDR-II burst-of-4 architecture | Delivers four 36-bit words per two K-clock cycles - doubles data throughput versus single-data-rate SRAMs at same clock frequency. |
| HSTL Class I interface (1.5 V) | Guarantees signal integrity at 200 MHz with <6 ps clock-to-data skew; supports voltage scaling up to 1.9 V for legacy system compatibility. |
| Programmable output impedance (35–70 Ω) | Enables board-level impedance matching via single external RQ resistor - eliminates need for series termination resistors on DQ lines. |
| DLL-assisted data alignment | Reduces tCHQV to ≤0.45 ns and maintains tight hold windows (tCHQX ≥ –0.45 ns) - simplifies timing closure in high-speed FPGA/ASIC interfaces. |
| JTAG boundary-scan support | Provides TDI/TDO/TCK/TMS pins for IEEE 1149.1-compliant test and debug - essential for production validation of dense BGA layouts. |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet or SONET frames in multi-port line cards before classification and forwarding. IC Role / Device Role / Timing Role: Primary burst-access buffer interfacing directly to switch fabric ASICs via 36-bit HSTL bus with CQ/CQ strobing. Use Value: 512K × 36-bit depth provides sufficient frame storage for 10 GbE line rates; DDR-II bandwidth avoids bottlenecks during back-to-back packet bursts. |
Use Scenario: Capturing high-frequency analog digitizer outputs or protocol analyzer traces in real time. IC Role / Device Role / Timing Role: High-throughput circular buffer synchronized to sampling clock using K/K and echo clocks CQ/CQ. Use Value: Sub-ns data-to-clock alignment enables reliable capture at 200 MHz sustained rates; programmable impedance ensures clean waveforms on long probe paths. |
| Telecom Baseband Processing | Avionics Data Acquisition |
|
Use Scenario: Temporary storage of processed OFDM symbols between FFT stages in LTE/5G baseband units. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory co-located with DSP cores, using SA0/SA1 for burst reordering. Use Value: Burst-of-4 minimizes address overhead per symbol block; separate VDDQ/VREF allows stable I/O operation amid core voltage fluctuations. |
Use Scenario: Buffered acquisition of sensor telemetry (inertial, pressure, temperature) in flight control computers. IC Role / Device Role / Timing Role: Radiation-tolerant (by design heritage), wide-temp commercial-grade SRAM with JTAG for in-system verification. Use Value: 0–70°C rating meets DO-160 environmental requirements; 165-ball fBGA offers superior mechanical reliability vs. TSOP in vibration-prone environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C2663KV18 | Same 512K × 36 DDR-II architecture, 200 MHz speed grade, identical 165-ball fBGA package and pinout. | Direct functional replacement with identical timing, voltage, and interface specs - validated for drop-in use in existing IDT71P73604 designs. | Select when sourcing diversification is required; no layout or firmware changes needed. |
| Micron MT55LSD128H36 | 18 Mb QDR-II+ (quad-data-rate), 250 MHz, 165-ball fBGA - higher bandwidth but different protocol (separate read/write ports, no burst-of-4). | Requires redesign of controller logic and bus arbitration; not compatible with IDT71P73604's single-port DDR-II interface. | Choose only for new designs targeting >400 MT/s and willing to adopt QDR-II+ controller IP. |
Compared with CY7C2663KV18 and MT55LSD128H36, the IDT71P73604S200BQ8 offers proven DDR-II burst-of-4 compatibility with legacy network ASICs, while avoiding QDR-II+ protocol complexity and ensuring seamless migration from Cypress's functionally identical part.
Availability
IDT71P73604S200BQ8 is available at Aetrix Electronics and suitable for network infrastructure, test instrumentation, and telecom baseband applications requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for IDT71P73604S200BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.
IDT71P73604S200BQ8 belongs to IDT's DDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in packet-switched networks and high-speed instrumentation where deterministic burst access and HSTL signal integrity are critical.
FAQ
What is the maximum operating frequency of the IDT71P73604S200BQ8?
The IDT71P73604S200BQ8 is rated for 200 MHz K-clock operation, with minimum average clock cycle time (tKHKH) of 5.00 ns. At this frequency, it achieves 400 MT/s effective data rate on its 36-bit DQ bus. The "S200" suffix explicitly denotes this 200 MHz speed grade, validated across commercial temperature range (0°C to +70°C) per DSC-6431/00.
Does the IDT71P73604S200BQ8 support single-ended or differential clocks?
The IDT71P73604S200BQ8 requires true differential clock pairs: K/K and C/C are complementary inputs, not single-ended signals. Both rising edges are used for timing capture - K latches addresses and first/third burst words, while K latches second/fourth words. Driving K and K with identical-phase signals violates timing and will cause functional failure.
How is output impedance calibrated on the IDT71P73604S200BQ8?
Output impedance is calibrated via the ZQ pin connected to an external resistor RQ tied to VSS. RQ = 250 Ω yields nominal 50 Ω drive strength (since ZQ = 0.2 × RQ). The device auto-adjusts every 1024 clock cycles to compensate for voltage/temperature drift. Tying ZQ directly to VDDQ forces minimum impedance (~35 Ω), per Section 6.42, Page 4 of the datasheet.
Can the IDT71P73604S200BQ8 operate without the DLL enabled?
Yes - the DLL can be disabled by holding the Doff pin LOW. When disabled, C/C (or K/K in single-clock mode) directly clock the output register, introducing additional propagation delay (not specified in datasheet). AC timing parameters change significantly; tCHQV increases beyond 0.45 ns, and DLL-related specs like tKC lock no longer apply.
What is the purpose of SA0 and SA1 on the IDT71P73604S200BQ8?
SA0 and SA1 are burst sequence address bits unique to x18 and x36 devices like the IDT71P73604S200BQ8. They select one of four linear burst orders (e.g., 00 → 01 → 10 → 11) per Table 22, enabling flexible addressing within a 4-word burst without incrementing the main address bus - critical for wrapping burst reads across memory boundaries.
IDT71P73604S200BQ8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - DDR2
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.88 ns
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
IDT71P73604S200BQ8 FAQ
1.How can I place an order for IDT71P73604S200BQ8 through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT71P73604S200BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT71P73604S200BQ8 reliable?
The price and inventory of IDT71P73604S200BQ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT71P73604S200BQ8 is usually 5 days.
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5.How can I obtain technical support or documentation for IDT71P73604S200BQ8?
For technical support, including IDT71P73604S200BQ8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT71P73604S200BQ8 requirements.
6.How does Aetrix verify that IDT71P73604S200BQ8 is sourced from the original manufacturer or authorized distributors?
All IDT71P73604S200BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT71P73604S200BQ8 meets industry standards.
7.What is the process for return or replacement of IDT71P73604S200BQ8?
All IDT71P73604S200BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with IDT71P73604S200BQ8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT71P73604S200BQ8 part is unused and in its original packaging.
Return procedure for IDT71P73604S200BQ8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IDT71P73604S200BQ8 Tags

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