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Renesas IDT71T016SA12BFI
- Part No.:
- IDT71T016SA12BFI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-LFBGA
- Datasheet:
-
IDT71T016SA12BFI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 48CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,777
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Product details
Overview
IDT71T016SA12BFI from Integrated Device Technology, Inc. is a 64K × 16-bit (1 Mbit), high-speed asynchronous CMOS static RAM operating from a single 2.5 V supply, with 12 ns access time and industrial temperature range (–40°C to +85°C), packaged in a 48-ball FBGA (7 mm × 7 mm). It supports byte-wide and word-wide read/write operations via dedicated BHE/BLE pins and features LVTTL-compatible I/Os for seamless integration into legacy 2.5 V memory buses.
For engineers reviewing the IDT71T016SA12BFI datasheet, IDT71T016SA12BFI pinout, IDT71T016SA12BFI application, or IDT71T016SA12BFI equivalent, key selection criteria include its 12 ns tAA/tRC timing, industrial-grade reliability, 2.5 V single-supply operation, byte-select capability, and FBGA packaging for space-constrained embedded controllers and telecom line cards.
Technical Context
The IDT71T016SA12BFI implements fully static asynchronous logic-no clocks or refresh required-and uses dual active-low byte enables (BHE, BLE) to support independent high- and low-byte access within the 16-bit data bus. Its address decoding covers A0–A15 (64K addresses), and all control inputs (CS, OE, WE, BHE, BLE) are LVTTL-compatible with VIH = 1.7 V min and VIL = 0.7 V max at VDD = 2.5 V.
It delivers guaranteed 12 ns read cycle time (tRC) and address access time (tAA), with output enable latency as low as 6 ns (tOE), and supports three distinct write control modes: CS-, WE-, or byte-enable–controlled. Standby current is limited to 45 mA (ISB) under dynamic standby and only 15 mA (ISB1) in full static standby.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576 bits); supports 16-bit parallel data interface with byte-select granularity. |
| Access Time (tAA) | 12 ns max; ensures compatibility with 83 MHz bus systems without wait states. |
| Supply Voltage | 2.375 V to 2.625 V; tight 2.5 V ±5% tolerance simplifies power rail design and eliminates level-shifting. |
| Operating Temperature | –40°C to +85°C; qualified for industrial environments including base station control modules and motor drives. |
| I/O Interface | LVTTL-compatible bidirectional I/O0–I/O15; interoperable with 2.5 V FPGA I/O banks and ASIC memory controllers. |
| Package | 48-ball FBGA (7 mm × 7 mm, 0.8 mm pitch); enables high-density PCB layouts with improved thermal dissipation vs. SOJ/TSOP. |
| Standby Current (ISB1) | 15 mA max at VDD max and f = 0; reduces idle power in always-on network edge devices. |
Pinout & Package
Package: 48-ball plastic FBGA (JEDEC standard BF48-1, 7 mm × 7 mm body, 0.8 mm ball pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 65,536 locations; compatible with standard microprocessor address lines. |
| CS | Chip Select (active low) | Enables device operation; must be low before OE or WE to initiate valid read/write cycles. |
| OE | Output Enable (active low) | Gates output drivers; allows shared bus operation by placing I/Os in high-Z when deasserted. |
| WE | Write Enable (active low) | Controls direction of I/O pins during CS-active window; low = write, high = read. |
| BHE | High-Byte Enable (active low) | Selects I/O8–I/O15 for byte-level writes; used with BLE to implement 8-bit peripheral interfacing. |
| BLE | Low-Byte Enable (active low) | Selects I/O0–I/O7 for byte-level writes; enables mixed 8/16-bit data transfers without external logic. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit LVTTL I/O; automatically tri-stated when CS, OE, BHE, or BLE are inactive. |
| VDD | Power Supply | Single 2.5 V supply input; two dedicated VDD balls (pins E1, D1) reduce IR drop and noise coupling. |
| VSS | Ground | Two ground balls (pins E2, D2) provide low-inductance return path for switching currents. |
Key Features
| Feature | Design Value |
|---|---|
| Byte-select write control | Dedicated BHE/BLE pins enable independent 8-bit writes to upper/lower bytes-eliminates need for external byte-mask logic in 8-bit peripheral interfaces. |
| Zero-power standby mode | ISB1 = 15 mA max at f = 0; cuts memory subsystem leakage in battery-backed or energy-harvesting applications. |
| Asynchronous operation | No clock, no refresh, no wait-state logic required-simplifies timing closure in FPGA-based SoM designs. |
| LVTTL I/O compatibility | VIH ≥ 1.7 V, VIL ≤ 0.7 V at VDD = 2.5 V; ensures direct connection to Xilinx Spartan-3 or Altera Cyclone II I/O banks. |
| Industrial temperature qualification | –40°C to +85°C operation with full AC/DC specs guaranteed-meets EN 50155 for rolling stock electronics. |
Applications
| Industrial PLC Memory Buffer | Telecom Line Card Data Cache |
|---|---|
|
Use Scenario: Stores real-time I/O status and configuration registers in modular programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between ARM9-based controller and fieldbus interface ASIC; provides sub-12 ns register read latency. Use Value: Enables 100 µs PLC scan times without CPU wait states, while byte-enable support allows efficient bit-mapped I/O updates. |
Use Scenario: Caches packet header metadata and lookup tables in TDM-to-packet gateway cards operating in central office environments. IC Role / Device Role / Timing Role: High-reliability 16-bit memory bank for FPGA-based traffic manager; accessed concurrently by multiple DMA channels. Use Value: 12 ns tAA ensures zero-cycle penalty on header rewrite operations, and FBGA package withstands thermal cycling in NEBS-compliant chassis. |
| Medical Imaging Control FIFO | Avionics Sensor Data Logger |
|
Use Scenario: Buffers time-critical sensor acquisition data from analog front-end ADCs in portable ultrasound systems. IC Role / Device Role / Timing Role: Dual-port–emulated FIFO using alternating read/write cycles; leverages BHE/BLE for interleaved channel storage. Use Value: 2.5 V operation matches ADC/DAC core voltage, eliminating level shifters; ISB1 < 15 mA extends battery life during idle acquisition phases. |
Use Scenario: Logs inertial measurement unit (IMU) outputs in DO-160G-certified flight control units with extended temperature operation. IC Role / Device Role / Timing Role: Non-volatile-configurable SRAM for black-box recording; retains data across cold starts via backup supply. Use Value: –40°C to +85°C rating ensures functionality during high-altitude thermal transients; FBGA mechanical robustness resists vibration-induced solder fatigue. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C1019DV33-10ZSXI | 3.3 V supply, 10 ns access, 44-pin TSOP-II; lacks byte-enable pins (uses UB/LB instead of BHE/BLE). | Requires level-shifting for 2.5 V systems; not suitable where BHE/BLE timing or 2.5 V compliance is mandatory. | Select only if migrating from 3.3 V designs with existing TSOP layout and no byte-select requirement. |
| ISSI IS61WV102416BLL-12MLI | 2.5 V supply, 12 ns access, 48-ball FBGA; identical pinout but different ball assignment for A12/A13 and NC pins. | Not pin-compatible-requires PCB redesign; however, same footprint and thermal profile simplify mechanical requalification. | Consider for cost-sensitive industrial designs where layout revision is acceptable and JEDEC FBGA footprint reuse is prioritized. |
Compared with IDT71T016SA12BFI, the CY7C1019DV33-10ZSXI demands system-level voltage translation and omits true byte-enable control, while the IS61WV102416BLL-12MLI offers matching speed and voltage but requires board-level adaptation due to non-identical ball mapping-making IDT71T016SA12BFI optimal for drop-in replacement in existing FBGA-based 2.5 V designs.
Availability
IDT71T016SA12BFI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, telecom line card data caches, and medical imaging control FIFOs requiring stable component supply, long-lifecycle availability, and guaranteed industrial temperature performance.
Supply support for IDT71T016SA12BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology, Inc. (IDT) is a U.S.-based semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning ICs, acquired by Renesas Electronics in 2019.
The IDT71T016SA12BFI belongs to IDT's high-speed asynchronous SRAM product line, engineered for deterministic, low-latency memory access in industrial control, telecom infrastructure, and medical instrumentation where refresh-free operation and byte-granular write control are critical.
FAQ
What is the maximum operating frequency supported by the IDT71T016SA12BFI?
The IDT71T016SA12BFI does not use a clock and therefore has no operating frequency specification. Its performance is defined by timing parameters: 12 ns read cycle time (tRC) and 12 ns address access time (tAA), enabling reliable operation in systems with effective bus rates up to ~83 MHz when interfaced with appropriate setup/hold margins. The IDT71T016SA12BFI achieves this without clocks or refresh circuitry.
Does the IDT71T016SA12BFI support true independent byte writes?
Yes-the IDT71T016SA12BFI provides dedicated active-low BHE (high-byte enable) and BLE (low-byte enable) inputs that allow fully independent 8-bit writes to I/O8–I/O15 or I/O0–I/O7 without affecting the complementary byte. This is confirmed in the truth table and timing waveforms, where BHE/BLE control output drivers separately, making the IDT71T016SA12BFI suitable for mixed 8/16-bit peripheral interfacing.
Is the IDT71T016SA12BFI pin-compatible with other members of the IDT71T016SA family?
Yes-the IDT71T016SA12BFI shares identical pinout and ball map with all IDT71T016SA variants (e.g., IDT71T016SA10BFI, IDT71T016SA15BFI) in the 48-ball FBGA package. Only timing specifications differ (tAA/tRC); all DC characteristics, control pin functions, and I/O behavior remain consistent across speed grades, enabling drop-in replacement within the same package variant.
What is the meaning of "BFI" in the part number IDT71T016SA12BFI?
The "BFI" suffix in IDT71T016SA12BFI denotes the industrial temperature grade (–40°C to +85°C) and FBGA package (48-ball, 7 mm × 7 mm). "B" indicates FBGA, "F" confirms the 48-ball configuration, and "I" specifies industrial temperature screening-consistent with IDT's ordering nomenclature documented in the datasheet's Ordering Information section.
Can the IDT71T016SA12BFI operate with a 2.3 V supply?
No-the IDT71T016SA12BFI is specified for VDD = 2.375 V to 2.625 V per the Recommended Operating Conditions table. Operation at 2.3 V falls below the minimum 2.375 V limit and risks timing violations, data retention loss, or functional failure. System designs must regulate to ≥2.375 V; the IDT71T016SA12BFI is not characterized or guaranteed below this threshold.
IDT71T016SA12BFI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CABGA (7x7)
IDT71T016SA12BFI FAQ
1.How can I place an order for IDT71T016SA12BFI through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT71T016SA12BFI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT71T016SA12BFI reliable?
The price and inventory of IDT71T016SA12BFI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT71T016SA12BFI is usually 5 days.
3.What payment methods are accepted for IDT71T016SA12BFI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT71T016SA12BFI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDT71T016SA12BFI?
IDT71T016SA12BFI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDT71T016SA12BFI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDT71T016SA12BFI?
For technical support, including IDT71T016SA12BFI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT71T016SA12BFI requirements.
6.How does Aetrix verify that IDT71T016SA12BFI is sourced from the original manufacturer or authorized distributors?
All IDT71T016SA12BFI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT71T016SA12BFI meets industry standards.
7.What is the process for return or replacement of IDT71T016SA12BFI?
All IDT71T016SA12BFI units undergo pre-shipment inspection (PSI). If there is an issue with IDT71T016SA12BFI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT71T016SA12BFI part is unused and in its original packaging.
Return procedure for IDT71T016SA12BFI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IDT71T016SA12BFI Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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