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Renesas IDT71T016SA12PHG

Part No.:
IDT71T016SA12PHG
Manufacturer:
Renesas
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixIDT71T016SA12PHG.pdf
Description:
IC SRAM 1MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,219

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Product details

Overview

IDT71T016SA12PHG from Integrated Device Technology is a 64K × 16-bit (1 Mbit), high-speed, single-supply 2.5V CMOS static RAM with 12 ns access and cycle times, LVTTL-compatible I/O, and independent upper/lower byte enables - used in embedded controllers, network packet buffers, and FPGA configuration memory.

For engineers reviewing the IDT71T016SA12PHG datasheet, IDT71T016SA12PHG pinout, IDT71T016SA12PHG application, or IDT71T016SA12PHG equivalent, key selection criteria include 2.5V operation, 12 ns read/write timing, byte-select capability, industrial temperature support (–40°C to +85°C), and FBGA-48 packaging compatibility.

Technical Context

The IDT71T016SA12PHG implements fully static asynchronous logic with no clocks or refresh required. It supports three distinct access modes: word-wide (BHE and BLE low), high-byte-only (BHE low, BLE high), and low-byte-only (BHE high, BLE low), each with guaranteed timing under industrial conditions.

All control inputs (CS, OE, WE, BHE, BLE) are active-low and LVTTL-compatible; bidirectional I/Os (I/O0–I/O15) drive and receive at 2.5V levels with 5 ns OE access and 4 ns tOH hold time. Power management includes dynamic standby (ISB = 40 mA max) and full static standby (ISB1 = 15 µA max) states.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 16-bit (1,048,576 bits) - supports 16-bit data bus interfacing without external multiplexing
Access Time (tAA) 12 ns max (industrial range) - enables direct attachment to 83 MHz bus systems with setup margin
Supply Voltage 2.375 V to 2.625 V - tightly regulated 2.5V domain compatible with modern low-voltage SoC interfaces
I/O Interface LVTTL-compatible - interoperable with 2.5V logic families without level-shifting circuitry
Operating Temperature –40°C to +85°C - qualified for industrial-grade embedded and networking equipment
Standby Current (ISB1) 15 µA max - enables ultra-low-power retention during system sleep modes
Package 48-ball FBGA (7 mm × 7 mm, 0.8 mm pitch) - compact footprint for space-constrained PCB layouts

Pinout & Package

Package: 48-ball plastic FBGA (JEDEC standard BF48-1, 7 mm × 7 mm, 0.8 mm ball pitch).

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit address bus for full 64K-word addressing; TTL-compatible thresholds (VIH ≥ 1.7 V, VIL ≤ 0.7 V)
CS Chip Select (active low) Primary enable for device selection; deactivates outputs and reduces current to ISB/ISB1 levels when high
OE Output Enable (active low) Controls output drivers only; allows read access while CS remains asserted (tOE = 6 ns max)
WE Write Enable (active low) Initiates write cycles; latches data on rising edge of WE when CS and byte enables are active
BHE High-Byte Enable (active low) Selects I/O8–I/O15 for 8-bit high-byte operations; enables partial writes without disturbing low byte
BLE Low-Byte Enable (active low) Selects I/O0–I/O7 for 8-bit low-byte operations; supports mixed-width data transfers in legacy systems
I/O0–I/O15 Bidirectional Data I/O 16-bit multiplexed data path; tri-stated when CS high or OE high; driven to VOH ≥ 1.7 V / VOL ≤ 0.7 V
VDD Power Supply Single 2.5V supply pin (two dedicated balls: E1 and D1 per FBGA layout); requires local decoupling
VSS Ground Ground reference (four dedicated balls: D2, E2, F1, F2); critical for noise immunity in high-speed reads

Key Features

Feature Design Value
Byte-select architecture Independent BHE/BLE controls allow 8-bit sub-word writes - eliminates read-modify-write overhead in microcontroller systems
Zero-power standby mode ISB1 = 15 µA max ensures negligible leakage during power-gated states - extends battery life in portable industrial tools
Asynchronous static core No clocks, no refresh, no wait states - simplifies timing closure and eliminates DRAM controller complexity
Industrial-grade reliability Qualified over –40°C to +85°C with 100% burn-in and accelerated life testing - suitable for uncooled telecom line cards
FBGA thermal performance 7 mm × 7 mm package with exposed thermal pad (ball A1–H8 perimeter) enables >1.2 W dissipation at 40°C ambient

Applications

Network Packet Buffer FPGA Configuration Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2 switches before forwarding decisions.

IC Role / Device Role / Timing Role: Asynchronous dual-port buffer with byte-enable write granularity for header/payload separation.

Use Value: 12 ns tAA and tRC enable real-time frame buffering at 100 Mbps line rate without pipeline stalls.

Use Scenario: Holding configuration bitstreams for Xilinx Spartan-6 or Intel Cyclone IV FPGAs during power-up.

IC Role / Device Role / Timing Role: Non-volatile boot memory interface delivering parallel 16-bit configuration words to FPGA CCLK domain.

Use Value: LVTTL-compatible I/O and 2.5V supply match FPGA configuration voltage requirements - no level translation needed.

Industrial PLC Data Log DSP Co-Processor Cache

Use Scenario: Capturing sensor readings (temperature, pressure, vibration) at 10 kHz sampling in programmable logic controllers.

IC Role / Device Role / Timing Role: High-reliability SRAM buffer with industrial temp rating and low ISB1 for extended offline logging.

Use Value: 15 µA full-standby current allows >1 year battery-backed operation in maintenance-free field deployments.

Use Scenario: Serving as low-latency instruction/data cache between TI C6748 DSP and external SDRAM in radar signal processing.

IC Role / Device Role / Timing Role: Zero-wait-state local memory mapped into DSP EMIF address space via CS/OE/WE control.

Use Value: 12 ns access time matches C6748's 83 MHz EMIF clock - eliminates pipeline bubbles during FFT kernel execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress CY7C1019DV33-10ZSXI 3.3V supply, 10 ns access, 1 Mbit (64K × 16), SOJ-44 only - no FBGA option Requires 3.3V rail and level-shifting for 2.5V systems; incompatible with IDT71T016SA12PHG's voltage domain Choose only if existing design uses 3.3V infrastructure and SOJ-44 footprint is fixed.
ISSI IS61WV102416BLL-12MLI 2.5V supply, 12 ns access, 1 Mbit (64K × 16), 48-pin TSOP-II - different pinout and no FBGA variant TSOP-II package increases board area by 42% vs. FBGA; lacks BHE/BLE pin mapping compatibility Acceptable for cost-sensitive industrial boards where FBGA rework is prohibited and layout space permits.

Compared with CY7C1019DV33-10ZSXI and IS61WV102416BLL-12MLI, the IDT71T016SA12PHG uniquely delivers industrial-qualified 2.5V operation in a compact 7 mm × 7 mm FBGA - enabling higher-density routing and lower EMI than TSOP/SOJ alternatives.

Availability

IDT71T016SA12PHG is available at Aetrix Electronics and suitable for network packet buffers, FPGA configuration memory, and industrial PLC data loggers requiring stable component supply across extended product lifecycles.

Supply support for IDT71T016SA12PHG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The IDT71T016SA12PHG belongs to IDT's T-series high-speed SRAM family, engineered specifically for low-voltage, low-latency memory interfacing in bandwidth-constrained embedded systems.

FAQ

What is the operating voltage range for IDT71T016SA12PHG?

IDT71T016SA12PHG operates from 2.375 V to 2.625 V - a tightly controlled 2.5V nominal supply. This range ensures compatibility with modern 2.5V logic families and avoids overvoltage stress that could trigger latch-up. The device draws ICC = 150 mA max during dynamic operation at VDD = 2.625 V and fMAX, and ISB1 = 15 µA max in full standby. Operation outside this range may cause data corruption or permanent damage.

Does IDT71T016SA12PHG support byte-level writes?

Yes, IDT71T016SA12PHG supports true byte-level writes via dedicated BHE (high-byte enable) and BLE (low-byte enable) pins. When BHE is low and BLE is high, only I/O8–I/O15 are written; when BLE is low and BHE is high, only I/O0–I/O7 are written. This eliminates read-modify-write cycles in microcontroller-based systems. Both enables are active-low and fully specified for tBW = 8 ns max under industrial conditions.

What package type is used for IDT71T016SA12PHG?

IDT71T016SA12PHG uses a 48-ball plastic FBGA (JEDEC BF48-1) with 7 mm × 7 mm body size and 0.8 mm ball pitch. Pin assignments follow the standard FBGA top-view layout shown in Figure 3 of the datasheet (DSC-5326/02), including dual VDD (E1, D1) and quad VSS (D2, E2, F1, F2) for low-impedance power delivery. This package is not pin-compatible with SOJ-44 or TSOP-44 variants of the same family.

Is IDT71T016SA12PHG suitable for industrial temperature applications?

Yes, IDT71T016SA12PHG is fully qualified for industrial temperature operation from –40°C to +85°C. All AC parameters - including tAA = 12 ns, tRC = 12 ns, and tOE = 6 ns - are guaranteed across this range. DC characteristics such as VIH (≥1.7 V), VOL (≤0.7 V), and ISB1 (≤15 µA) are also specified for industrial conditions. Burn-in and HTOL testing confirm reliability in uncooled industrial enclosures.

How does the output enable (OE) function interact with chip select (CS) in IDT71T016SA12PHG?

In IDT71T016SA12PHG, OE controls output driver state independently of CS. When CS is low and OE is low, data appears on I/O pins after tOE = 6 ns max. When CS is low but OE is high, outputs enter high-Z - useful for bus sharing. When CS is high, the device enters standby regardless of OE state, reducing ICC to ISB or ISB1 levels. This two-level control enables flexible bus arbitration without disabling the entire memory subsystem.

IDT71T016SA12PHG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

IDT71T016SA12PHG FAQ

1.How can I place an order for IDT71T016SA12PHG through Aetrix?

Please submit a Request for Quotation (RFQ) for IDT71T016SA12PHG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IDT71T016SA12PHG reliable?

The price and inventory of IDT71T016SA12PHG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT71T016SA12PHG is usually 5 days.

3.What payment methods are accepted for IDT71T016SA12PHG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT71T016SA12PHG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IDT71T016SA12PHG?

IDT71T016SA12PHG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IDT71T016SA12PHG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IDT71T016SA12PHG?

For technical support, including IDT71T016SA12PHG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT71T016SA12PHG requirements.

6.How does Aetrix verify that IDT71T016SA12PHG is sourced from the original manufacturer or authorized distributors?

All IDT71T016SA12PHG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT71T016SA12PHG meets industry standards.

7.What is the process for return or replacement of IDT71T016SA12PHG?

All IDT71T016SA12PHG units undergo pre-shipment inspection (PSI). If there is an issue with IDT71T016SA12PHG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IDT71T016SA12PHG part is unused and in its original packaging.

Return procedure for IDT71T016SA12PHG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IDT71T016SA12PHG Tags

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