Renesas IDT71T75602S200PFG
- Part No.:
- IDT71T75602S200PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
IDT71T75602S200PFG.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IDT71T75602S200PFG from Renesas Electronics is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization (18 Mbit), 200 MHz clock speed, 3.2 ns clock-to-data access, zero bus turnaround (ZBT) architecture, and pipelined burst read/write capability. It serves as high-speed buffer memory in network packet processors and telecom line cards requiring deterministic latency and no dead cycles between consecutive read/write operations.
For engineers reviewing the IDT71T75602S200PFG datasheet, IDT71T75602S200PFG pinout, IDT71T75602S200PFG application, or IDT71T75602S200PFG equivalent, key selection considerations include its 100-pin TQFP package, 2.5V core/I/O supply, JTAG IEEE 1149.1 compliance, industrial temperature support (–40°C to +85°C), and synchronous burst control via ADV/LD and LBO pins.
Technical Context
The IDT71T75602S200PFG implements a fully synchronous, pipelined interface with positive-edge-triggered address/control/data registers and an on-chip 4-word burst counter. Its ZBT architecture eliminates bus turnaround delay by allowing immediate read-after-write or write-after-read transitions without tri-state gaps.
It supports linear or interleaved burst sequences selected by the static LBO pin, uses three chip enables (CE1/CE2/CE2) for depth expansion, and integrates boundary-scan JTAG (TMS/TDI/TCK/TDO/TRST) for testability. Sleep mode is controlled synchronously via the ZZ input, and output enable (OE) remains asynchronous but can be tied low for simplified operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18,874,368 bits); supports high-bandwidth data paths in 36-bit systems |
| Max Clock Frequency | 200 MHz; enables 5 ns cycle time for sustained burst throughput in high-speed interfaces |
| Clock-to-Data Access | 3.2 ns; guarantees deterministic read latency two cycles after address load for timing-critical pipelines |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); separate supplies reduce noise coupling between logic and I/O |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in base station and industrial control environments |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic and improves effective bandwidth in sequential access patterns |
| JTAG Compliance | IEEE 1149.1; enables boundary-scan testing and in-system debug without additional test fixtures |
Pinout & Package
Packaged in a JEDEC-standard 14 mm × 20 mm 100-pin thin quad flatpack (TQFP), the IDT71T75602S200PFG features 36 bidirectional data I/Os (I/O0–I/O31, I/OP1–I/OP4), 19 address inputs (A0–A18), four byte write enables (BW1–BW4), and dedicated JTAG test pins (TMS/TDI/TCK/TDO/TRST).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Positive-edge-triggered master clock; all synchronous registers (address, control, data) sample on rising edge |
| ADV/LD | Address Load / Burst Advance | Low = load external address; high = increment internal burst counter; controls pipelined burst sequencing |
| LBO | Burst Order Select | Static input: low = linear burst (A0, A1, A2, A3), high = interleaved burst (A0, A1, A2, A3 per IEEE Std) |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines whether loaded address initiates read or write two cycles later |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) for flexible depth expansion and bank selection |
| ZZ | Sleep Mode Input | High = gate internal clock and enter low-power retention mode; data integrity maintained during sleep |
| TMS/TDI/TCK/TDO/TRST | JTAG Test Interface | IEEE 1149.1-compliant boundary-scan chain; TRST optional asynchronous reset (BGA only; functional in TQFP per documentation) |
Key Features
| Feature | Design Value |
|---|---|
| Zero Bus Turnaround (ZBT) | Eliminates dead cycles between read/write transitions - enables back-to-back memory accesses without bus contention or turnaround overhead |
| Internally synchronized OE | Output buffer enable is registered and clock-aligned; removes need for precise OE timing control in high-speed designs |
| Individual byte write (BW1–BW4) | Four independent 9-bit byte write enables allow partial-word updates without read-modify-write, reducing power and latency |
| Pipelined burst counter | On-chip 4-word counter advances automatically on ADV/LD high; supports both linear and interleaved sequences per LBO state |
| 2.5V dual-supply architecture | Separate VDD (core) and VDDQ (I/O) supplies isolate switching noise and improve signal integrity on data buses |
Applications
| Telecom Line Cards | Network Packet Processors |
|---|---|
Use Scenario: High-speed buffering of packet headers and payloads in OC-192/STM-64 line interface units. IC Role / Device Role / Timing Role: Primary ZBT SRAM providing deterministic 3.2 ns read latency and zero-turnaround burst writes for ingress/egress FIFOs. Use Value: Enables full-line-rate packet processing at 10 Gbps by eliminating bus idle cycles between header lookups and payload writes. | Use Scenario: Storing forwarding tables and temporary packet metadata in multi-core network processors. IC Role / Device Role / Timing Role: Synchronous cache buffer interfacing directly with processor AXI/PLB buses using pipelined 4-word bursts. Use Value: Delivers 200 MHz sustained throughput with no pipeline stalls, improving classifier and QoS engine utilization. |
| Industrial PLC Backplanes | Radar Signal Processing Modules |
Use Scenario: Real-time I/O data exchange between motion controllers and distributed I/O modules over high-speed parallel backplanes. IC Role / Device Role / Timing Role: Dual-port-compatible SRAM acting as shared memory between FPGA-based controller and ARM host CPU. Use Value: Industrial temperature rating (–40°C to +85°C) and JTAG testability ensure reliability in uncooled control cabinets. | Use Scenario: Buffering digitized IF samples in phased-array radar receivers prior to FFT computation. IC Role / Device Role / Timing Role: High-bandwidth frame buffer supporting continuous 36-bit parallel sampling at >100 MSPS effective rate. Use Value: 512K × 36-bit depth and 200 MHz clock support real-time capture of multi-channel pulse-Doppler waveforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1315KV18 | 1M × 18-bit organization, same 200 MHz speed, 2.5V core/I/O, but no JTAG or ZZ sleep mode | Requires external burst logic; lacks built-in sleep control and boundary-scan test capability | Select when cost-sensitive designs prioritize density over testability and power management |
| AS7C331024B | 1M × 36-bit, 166 MHz max, 3.3V-only supply, no burst counter or ZBT architecture | Higher voltage, lower speed, asynchronous interface - incompatible with ZBT timing requirements | Consider only for legacy 3.3V systems where zero-turnaround is not required |
Compared with CY7C1315KV18 and AS7C331024B, the IDT71T75602S200PFG uniquely delivers 512K × 36-bit ZBT operation with integrated JTAG, sleep mode, and programmable burst order - making it optimal for new industrial and telecom designs demanding deterministic latency and production testability.
Availability
IDT71T75602S200PFG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and radar signal processing applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.
Supply support for IDT71T75602S200PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The IDT71T75602S200PFG belongs to Renesas' legacy IDT synchronous SRAM product line, engineered specifically for high-performance networking and real-time embedded systems requiring zero-bus-turnaround memory access and robust test infrastructure.
FAQ
What memory configuration does the IDT71T75602S200PFG support?
The IDT71T75602S200PFG is configured as 512K × 36-bit (18,874,368 bits). It does not support the 1M × 18-bit variant - that is implemented in the pin-compatible IDT71T75802. The IDT71T75602S200PFG's address bus uses A0–A18 (19 bits) and data bus uses I/O0–I/O31 plus I/OP1–I/OP4 (36 bits), confirming its fixed 512K × 36 organization.
Does the IDT71T75602S200PFG support both linear and interleaved burst modes?
Yes, the IDT71T75602S200PFG supports both burst orders via the LBO (Linear Burst Order) pin. When LBO is low, it executes linear bursts (A0, A1, A2, A3); when high, it performs interleaved bursts (A0, A1, A2, A3 per IEEE standard). This selection is static and must remain stable during operation - changing LBO mid-burst is undefined.
Is JTAG functionality available in the TQFP package of the IDT71T75602S200PFG?
Yes, JTAG is fully supported in the 100-pin TQFP package of the IDT71T75602S200PFG. Pins 38 (TMS), 39 (TDI), 43 (TCK), and 42 (TDO) are assigned to JTAG signals, and TRST (pin 41) is included as an optional reset. All JTAG pins have internal pull-ups except ZZ, which has an internal pulldown - enabling functional boundary-scan without external biasing.
What is the role of the ADV/LD pin in the IDT71T75602S200PFG?
The ADV/LD pin in the IDT71T75602S200PFG controls burst sequencing: sampled low at the rising CLK edge, it loads a new external address; sampled high, it advances the internal 4-word burst counter. This dual function enables seamless transition between random and sequential access - critical for packet buffering where header reads (random) alternate with payload writes (burst).
How does the IDT71T75602S200PFG handle power-down and data retention?
The IDT71T75602S200PFG enters low-power sleep mode when ZZ is driven high synchronously. In this state, the internal clock is gated, dynamic power drops significantly, and data retention is guaranteed across the full industrial temperature range (–40°C to +85°C). Core and I/O supplies (VDD/VDDQ) must remain active; retention current is characterized but not production-tested per datasheet note.
IDT71T75602S200PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
IDT71T75602S200PFG FAQ
1.How can I place an order for IDT71T75602S200PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT71T75602S200PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT71T75602S200PFG reliable?
The price and inventory of IDT71T75602S200PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT71T75602S200PFG is usually 5 days.
3.What payment methods are accepted for IDT71T75602S200PFG?
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IDT71T75602S200PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDT71T75602S200PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDT71T75602S200PFG?
For technical support, including IDT71T75602S200PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT71T75602S200PFG requirements.
6.How does Aetrix verify that IDT71T75602S200PFG is sourced from the original manufacturer or authorized distributors?
All IDT71T75602S200PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT71T75602S200PFG meets industry standards.
7.What is the process for return or replacement of IDT71T75602S200PFG?
All IDT71T75602S200PFG units undergo pre-shipment inspection (PSI). If there is an issue with IDT71T75602S200PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT71T75602S200PFG part is unused and in its original packaging.
Return procedure for IDT71T75602S200PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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