Renesas IDT71V2559S75PFG
- Part No.:
- IDT71V2559S75PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
IDT71V2559S75PFG.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IDT71V2559S75PFG from Integrated Device Technology is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit (4.5 Mbit) organization, 7.5 ns clock-to-data access time, and zero bus turnaround architecture. It supports 100 MHz system operation, 4-word burst (linear or interleaved), individual byte write control (BW1–BW4), and flow-through outputs. Used in high-speed packet buffering and network switch fabric memory subsystems.
For engineers reviewing the IDT71V2559S75PFG datasheet, IDT71V2559S75PFG pinout, IDT71V2559S75PFG application, or IDT71V2559S75PFG equivalent, key selection criteria include ZBT™ timing compatibility, 100-pin TQFP mechanical fit, 3.3V core / 2.5V I/O voltage separation, burst counter behavior, and CE1/CE2/CE2 chip enable logic for depth expansion.
Technical Context
The IDT71V2559S75PFG implements a synchronous dual-edge-triggered interface with registered address/control inputs and flow-through data outputs. Its ZBT™ architecture eliminates dead cycles between read and write operations by decoupling address load and data transfer across consecutive clock edges.
It features an on-chip 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved sequences. The device uses three chip enables (CE1, CE2 active-low; CE2 active-high) for hierarchical memory banking, and includes asynchronous OE for output tri-state control independent of clock timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 256K × 18-bit mode via pin configuration |
| Clock-to-Data Access | 7.5 ns - defines minimum clock period for guaranteed valid read data at next rising edge |
| Maximum Clock Frequency | 100 MHz - sets upper limit for sustained burst and random access throughput |
| Core Supply Voltage | 3.3 V ±5% - powers internal logic and address registers; requires stable low-noise regulation |
| I/O Supply Voltage | 2.5 V ±5% (VDDQ) - isolates I/O drivers from core noise; enables interfacing with 2.5V logic families |
| Burst Capability | 4-word linear or interleaved - reduces address bus traffic and improves bandwidth efficiency in sequential accesses |
| Byte Write Control | Four independent BW1–BW4 signals - allows partial 9-bit word writes without read-modify-write overhead |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, 0.5 mm pitch. Pin 1 marked by dot; top-side marking includes "IDT71V2559S75PFG" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous inputs latched on rising CLK edge when ADV/LD = LOW and chip enabled; A0–A16 used for 128K×36 mode |
| CE1, CE2, CE2 | Chip Enables | Three independent enables: CE1/CE2 active-low, CE2 active-high; any false condition deselects device in one cycle |
| R/W | Read/Write Control | Synchronous signal determining cycle type; sampled with ADV/LD to initiate load read/write or burst advance |
| ADV/LD | Advance Burst / Load Address | LOW loads new external address; HIGH advances internal burst counter - critical for burst sequence control |
| LBO | Linear Burst Order | Static input: LOW selects linear burst order (0,1,2,3), HIGH selects interleaved (0,2,1,3); must remain stable during operation |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for four 9-bit bytes; all may be tied LOW for full 36-bit writes |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus; input path registered, output path flow-through - no output register delay |
| CLK | System Clock | Rising-edge-triggered master timing reference; all synchronous inputs referenced to this edge |
| OE | Output Enable | Asynchronous active-low control; tri-states outputs immediately regardless of clock state |
| VDD, VDDQ, VSS | Power Supplies | VDD = 3.3V core; VDDQ = 2.5V I/O; separate supplies reduce noise coupling and support mixed-voltage systems |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between read/write transitions - enables back-to-back memory operations at full clock rate |
| Internally Synchronized OE | Removes need for external OE timing control - simplifies PCB layout and eliminates setup/hold violations on OE path |
| Single R/W Pin | Reduces control bus width vs. separate RD/WR signals - lowers FPGA/CPU pin count and routing complexity |
| Three Chip Enables | Enables seamless depth expansion across multiple devices without external decode logic or glue logic |
| Flow-Through Outputs | Delivers read data with minimal latency - no additional clock-cycle delay from output register; critical for low-latency buffering |
| 4-Word Burst with Configurable Order | Improves effective bandwidth by 2–3× over single-word transfers; LBO pin allows runtime selection of linear/interleaved addressing |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing variable-length Ethernet frames in ingress/egress queues of multi-gigabit switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer memory interfaced directly to MAC-layer controllers and traffic managers. Use Value: ZBT™ architecture enables continuous frame write/read without pipeline stalls, sustaining >800 Mbps effective throughput at 100 MHz. |
Use Scenario: Frame assembly/disassembly and header processing in SONET/SDH add-drop multiplexers. IC Role / Device Role / Timing Role: Dual-port-accessible scratchpad memory for real-time ATM cell reassembly and QoS tagging engines. Use Value: 4-word burst mode matches ATM cell payload alignment, reducing address bus cycles by 75% per cell transfer. |
| Baseband Processor Cache | Radar Signal Processing Buffer |
Use Scenario: Instruction/data cache for DSP cores in wireless base station transceivers handling WCDMA/LTE protocols. IC Role / Device Role / Timing Role: Low-latency instruction fetch buffer synchronized to DSP clock domain with precise 7.5 ns access guarantee. Use Value: Flow-through outputs eliminate output register delay, enabling deterministic 1-cycle instruction fetch timing critical for real-time scheduling. |
Use Scenario: Real-time storage of digitized IF samples in pulsed-Doppler radar front ends prior to FFT computation. IC Role / Device Role / Timing Role: High-reliability, temperature-stable memory for acquisition buffers operating in -40°C to +85°C industrial environments. Use Value: Industrial-grade temperature rating (-40°C to +85°C) and 3.3V/2.5V dual-rail design ensure stable operation under thermal stress and EMI-rich RF environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C1355KV18 | 256K × 18 organization only; no 128K × 36 mode; 5.5 ns access; 2.5V-only I/O (no VDDQ separation) | Optimized for x18 datapaths (e.g., DDR controller interfaces); lacks byte-write granularity for x36 systems | Select when x18 bus width and sub-6 ns timing dominate; avoid if 36-bit interface or mixed 3.3V/2.5V supply domains required |
| ISSI IS61WV102436B | 1M × 36 organization; 8 ns access; 3.3V-only supply (no VDDQ); no ZBT™ - standard pipelined SRAM | Higher density for static buffer allocation; lacks zero-turnaround capability - introduces 1-cycle gap between R/W transitions | Select for cost-sensitive, non-real-time buffering where density > timing determinism; not suitable for ZBT™-dependent pipelines |
Compared with CY7C1355KV18 and IS61WV102436B, the IDT71V2559S75PFG uniquely delivers 128K×36 ZBT™ operation with true 3.3V/2.5V rail separation - essential for maintaining signal integrity in mixed-voltage telecom ASIC interfaces while eliminating bus turnaround penalties.
Availability
IDT71V2559S75PFG is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and radar signal processing applications requiring stable component supply, long-lifecycle support, and industrial temperature compliance.
Supply support for IDT71V2559S75PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance computing solutions.
The IDT71V2559S75PFG belongs to IDT's ZBT™ SRAM product line, designed specifically for ultra-low-latency, high-throughput memory subsystems in networking, telecommunications, and military/aerospace systems demanding deterministic timing and zero bus turnaround.
FAQ
What is the maximum operating frequency supported by the IDT71V2559S75PFG?
The IDT71V2559S75PFG supports a maximum clock frequency of 100 MHz, corresponding to a 7.5 ns clock-to-data access time. This timing is guaranteed across the full commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature ranges when operated within specified 3.3V ±5% (VDD) and 2.5V ±5% (VDDQ) supply tolerances. System-level timing margins must account for board-level skew and termination.
Does the IDT71V2559S75PFG support both 128K × 36 and 256K × 18 memory configurations?
Yes, the IDT71V2559S75PFG supports both configurations. In 128K × 36 mode, it uses address lines A0–A16 (17 bits) and all 36 I/O bits (I/O0–I/O31 + I/OP1–I/OP4). In 256K × 18 mode, it uses A0–A17 (18 bits) and only I/O0–I/O15 + I/OP1–I/OP2. Configuration is determined by external address mapping and pin strapping - no internal mode register or command sequence is required.
How does the ZBT™ (Zero Bus Turnaround) feature function in the IDT71V2559S75PFG?
The ZBT™ feature in the IDT71V2559S75PFG eliminates idle bus cycles between consecutive read and write operations. When a write cycle completes, the next clock edge can initiate a read without waiting for bus release/reacquisition. This is achieved through internal control logic that manages direction switching and output enable timing autonomously - no external handshake or wait-state insertion is needed.
What is the role of the LBO pin in the IDT71V2559S75PFG?
The LBO (Linear Burst Order) pin selects the 4-word burst sequence: LOW configures linear order (0,1,2,3), HIGH configures interleaved order (0,2,1,3). It is a static input - its state must be stable before burst initiation and cannot change mid-burst. Internally, LBO is pulled to VDD if left unconnected, defaulting to interleaved mode unless actively driven LOW.
Can the IDT71V2559S75PFG operate with OE tied permanently LOW?
Yes, OE can be tied LOW in most applications because the IDT71V2559S75PFG uses synchronous control for data validity - outputs are inherently valid only during read cycles defined by R/W and ADV/LD states. OE is provided for asynchronous override (e.g., bus sharing or power-down sequencing) but is not required for normal read/write operation. Tying OE LOW simplifies design and avoids timing constraints on the OE path.
IDT71V2559S75PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
IDT71V2559S75PFG FAQ
1.How can I place an order for IDT71V2559S75PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT71V2559S75PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT71V2559S75PFG reliable?
The price and inventory of IDT71V2559S75PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT71V2559S75PFG is usually 5 days.
3.What payment methods are accepted for IDT71V2559S75PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT71V2559S75PFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDT71V2559S75PFG?
IDT71V2559S75PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDT71V2559S75PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDT71V2559S75PFG?
For technical support, including IDT71V2559S75PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT71V2559S75PFG requirements.
6.How does Aetrix verify that IDT71V2559S75PFG is sourced from the original manufacturer or authorized distributors?
All IDT71V2559S75PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT71V2559S75PFG meets industry standards.
7.What is the process for return or replacement of IDT71V2559S75PFG?
All IDT71V2559S75PFG units undergo pre-shipment inspection (PSI). If there is an issue with IDT71V2559S75PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT71V2559S75PFG part is unused and in its original packaging.
Return procedure for IDT71V2559S75PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IDT71V2559S75PFG Tags

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