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Renesas IDT71V256SA20PZI
- Part No.:
- IDT71V256SA20PZI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
IDT71V256SA20PZI.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,477
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Product details
Overview
IDT71V256SA20PZI from Renesas Electronics is a 256K (32K × 8-bit) high-speed CMOS static RAM designed for secondary cache in 3.3V processor systems. It operates at 20 ns access time, supports industrial temperature range (–40°C to +85°C), draws ≤2 mA standby current, and uses LVTTL-compatible I/O on a single 3.3V ±0.3V supply - ideal for space-constrained embedded control and industrial computing applications.
For engineers reviewing the IDT71V256SA20PZI datasheet, IDT71V256SA20PZI pinout, IDT71V256SA20PZI application, or IDT71V256SA20PZI equivalent, key selection criteria include guaranteed full-standby power (≤2 mA at CMOS-level CS), TSOP Type I package compatibility, industrial-grade thermal performance, and verified 32K × 8-bit asynchronous SRAM timing compliance per AC table 10.
Technical Context
The IDT71V256SA20PZI implements a fully asynchronous, dual-control SRAM architecture with independent Chip Select (CS), Output Enable (OE), and Write Enable (WE) inputs. Its address decoding supports 15-bit addressing (A0–A14) for 32K words, and data I/O lines (I/O0–I/O7) operate bidirectionally with TTL-compatible thresholds (VIH = 2.0 V min, VIL = 0.8 V max).
Power management is implemented via two standby modes: TTL-level CS (ISB ≤20 mA) and CMOS-level CS (ISB1 ≤2 mA), with guaranteed full-standby dissipation <6.6 mW at VCC = 3.6 V and f = 0. The device uses advanced high-reliability CMOS process technology and meets green manufacturing standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Kbit (32K × 8-bit) - provides byte-wide data path for legacy 8-bit bus interfaces without multiplexing. |
| Access Time (tAA) | 20 ns max - ensures compatibility with 50 MHz CPU bus cycles in secondary cache roles. |
| Supply Voltage | 3.3 V ±0.3 V - matches standard low-voltage logic rails; eliminates need for level-shifting in 3.3V systems. |
| Standby Current (ISB1) | ≤2 mA at CMOS-level CS - enables >10× power reduction vs active mode, critical for battery-backed or energy-sensitive designs. |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including factory automation and transportation electronics. |
| I/O Compatibility | LVTTL - ensures direct interfacing with Intel 386/486, PowerPC, and FPGA I/O banks without external buffers. |
| Package | 28-pin TSOP Type I (PZG28) - 11.8 × 10.0 mm footprint supports high-density PCB layouts in compact modules. |
Pinout & Package
Package: 28-pin TSOP Type I (PZG28), 11.8 mm × 10.0 mm × 1.0 mm body, gull-wing leads, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit unidirectional address bus; supports full 32K-word decoding without external latching. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel data path; high-impedance state during CS HIGH or OE HIGH prevents bus contention. |
| CS | Chip Select | Active-low enable; drives device into low-power standby when HIGH (CMOS or TTL level). |
| WE | Write Enable | Active-low write control; combined with CS LOW to initiate asynchronous write cycle (tWP ≥15 ns). |
| OE | Output Enable | Active-low read control; allows output gating independent of CS for multi-chip memory banking. |
| VCC | Power Supply | +3.3 V ±0.3 V primary supply; decoupling required within 10 mm of pin per layout guidelines. |
| GND | Ground Reference | Signal and power return; must be connected to solid ground plane to meet tOH/tOLZ timing specs. |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temperature Support | Guaranteed operation from –40°C to +85°C - enables deployment in motor drives, PLCs, and outdoor telecom equipment without derating. |
| Low-Power Full Standby | ISB1 ≤2 mA at CMOS-level CS and f = 0 - reduces system sleep-mode power by >95% vs active operation, extending backup battery life. |
| TSOP Type I Packaging | PZG28 footprint - offers superior thermal dissipation vs SOJ and enables automated SMT assembly with standard reflow profiles. |
| LVTTL Interface Compatibility | VIH = 2.0 V min, VIL = 0.8 V max - ensures robust noise margin (>0.4 V) against EMI in noisy industrial environments. |
| Green Manufacturing Compliance | Lead-free, halogen-free construction - meets RoHS Directive 2011/65/EU and JEDEC J-STD-609A Class 1 moisture sensitivity. |
Applications
| Industrial PLC Memory Buffer | Legacy CPU Secondary Cache |
|---|---|
Use Scenario: Real-time I/O data buffering in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state read/write access for ladder logic execution buffers. Use Value: 20 ns tAA and tRC ensure sub-50 ns memory turnaround, enabling 20 kSPS I/O update rates without CPU stalling. | Use Scenario: Secondary cache for 3.3V x86 or PowerPC-based industrial computers. IC Role / Device Role / Timing Role: Byte-wide cache storage with independent OE/WE control for burst-mode instruction prefetching. Use Value: LVTTL compatibility and 32K × 8 organization eliminate glue logic, reducing BOM count and board area by 30% vs multiplexed alternatives. |
| Medical Imaging Frame Store | Ruggedized Network Router Buffer |
Use Scenario: Temporary frame storage in portable ultrasound or X-ray digitizers operating in mobile carts. IC Role / Device Role / Timing Role: Nonvolatile-buffered image line storage during analog-to-digital conversion bursts. Use Value: Industrial temp rating and ≤2 mA ISB1 allow continuous operation in uncooled enclosures while minimizing thermal drift in ADC reference paths. | Use Scenario: Packet buffer memory in DIN-rail mounted industrial Ethernet switches. IC Role / Device Role / Timing Role: Shared-memory FIFO for ingress/egress packet queuing with hardware flow control. Use Value: TSOP packaging withstands 50g vibration per IEC 60068-2-6, and 3.3V operation aligns with PoE-powered PHY voltage domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62256LL-20ZSXIT | 256K × 8, 20 ns, 3.3V, SOIC-28 package - lacks TSOP option and industrial temp grade. | Best suited for commercial-grade test equipment where board space is less constrained. | Select if SOIC mounting and lower procurement cost outweigh TSOP density and extended temperature needs. |
| AS6C4008-20TIN | 256K × 8, 20 ns, 3.3V, TSOP-28, industrial temp - higher ISB1 (5 mA) and no green compliance. | Fits legacy designs requiring identical PZG28 footprint but tolerates higher standby leakage. | Choose only when existing layout validation precludes requalification of power sequencing or environmental compliance. |
Compared with CY62256LL-20ZSXIT and AS6C4008-20TIN, the IDT71V256SA20PZI uniquely combines TSOP-28 industrial qualification, ≤2 mA full-standby current, and RoHS-compliant green materials - making it optimal for new industrial designs prioritizing thermal resilience, energy efficiency, and regulatory alignment.
Availability
IDT71V256SA20PZI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, ruggedized network routers, and legacy CPU cache modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for IDT71V256SA20PZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, SoCs, power management, and memory solutions for automotive, industrial, and infrastructure markets.
The IDT71V256SA20PZI belongs to Renesas' legacy high-speed SRAM product line, engineered specifically for low-latency, low-power, industrial-grade memory buffering in 3.3V embedded systems where reliability and thermal stability are non-negotiable.
FAQ
What is the maximum guaranteed access time for IDT71V256SA20PZI?
The IDT71V256SA20PZI has a maximum guaranteed address access time (tAA) of 20 ns under industrial conditions (VCC = 3.3 V ±0.3 V, TA = –40°C to +85°C). This value is production-tested and specified in Table 10 of the Renesas datasheet, ensuring deterministic timing for synchronous CPU interface design.
Does IDT71V256SA20PZI support both commercial and industrial temperature grades?
No - the "I" suffix in IDT71V256SA20PZI explicitly denotes industrial temperature grade (–40°C to +85°C). Commercial-grade variants (0°C to +70°C) use the same speed and package but carry no "I" suffix (e.g., IDT71V256SA20PZG). The PZI variant is qualified and tested across the full industrial range.
What package type does IDT71V256SA20PZI use, and is it RoHS-compliant?
IDT71V256SA20PZI uses a 28-pin TSOP Type I package (PZG28) and is RoHS-compliant and green (lead-free, halogen-free), as confirmed in the Renesas ordering information and "Green parts available" feature note. Moisture sensitivity level is rated at MSL-3 per JEDEC J-STD-020.
How does the standby current of IDT71V256SA20PZI compare between TTL and CMOS-level chip select?
IDT71V256SA20PZI specifies ISB ≤20 mA when CS is held at TTL HIGH (VIH), but drops to ISB1 ≤2 mA when CS is driven to CMOS HIGH (≥VCC – 0.2 V) with f = 0. This 10× reduction enables true low-power retention in battery-backed systems, and is guaranteed across the full industrial temperature range.
Can IDT71V256SA20PZI be used as a drop-in replacement for IDT71V256SA15PZI?
No - while both share identical pinout, voltage, and organization, the IDT71V256SA20PZI has slower timing (20 ns vs 15 ns tAA). Substituting it into a design validated for 15 ns may cause setup/hold violations. The 20 ns variant is functionally compatible but not timing-interchangeable; redesign verification is required.
IDT71V256SA20PZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP
IDT71V256SA20PZI FAQ
1.How can I place an order for IDT71V256SA20PZI through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT71V256SA20PZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT71V256SA20PZI reliable?
The price and inventory of IDT71V256SA20PZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT71V256SA20PZI is usually 5 days.
3.What payment methods are accepted for IDT71V256SA20PZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT71V256SA20PZI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDT71V256SA20PZI?
IDT71V256SA20PZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDT71V256SA20PZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDT71V256SA20PZI?
For technical support, including IDT71V256SA20PZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT71V256SA20PZI requirements.
6.How does Aetrix verify that IDT71V256SA20PZI is sourced from the original manufacturer or authorized distributors?
All IDT71V256SA20PZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT71V256SA20PZI meets industry standards.
7.What is the process for return or replacement of IDT71V256SA20PZI?
All IDT71V256SA20PZI units undergo pre-shipment inspection (PSI). If there is an issue with IDT71V256SA20PZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT71V256SA20PZI part is unused and in its original packaging.
Return procedure for IDT71V256SA20PZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IDT71V256SA20PZI Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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