Renesas IDT71V416L10BEGI
- Part No.:
- IDT71V416L10BEGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
IDT71V416L10BEGI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IDT71V416L10BEGI from Renesas Electronics is a 4,194,304-bit (256K × 16) high-speed CMOS static RAM with 10 ns access time, single 3.3 V supply operation, LVTTL-compatible I/O, and industrial temperature range (–40°C to +85°C). It features separate byte enable pins (BHE/BLE), output enable (OE), and JEDEC-standard center-power/ground pinout for noise reduction - deployed in embedded controllers, network packet buffers, and real-time data acquisition systems.
For engineers reviewing the IDT71V416L10BEGI datasheet, IDT71V416L10BEGI pinout, IDT71V416L10BEGI application, or IDT71V416L10BEGI equivalent, key selection criteria include 10 ns read cycle time, low-power standby current (10 mA max), 48-ball BGA (BEG48) package compatibility, and byte-selectable write capability for mixed-width bus interfacing.
Technical Context
The IDT71V416L10BEGI implements fully static asynchronous circuitry-no clocks or refresh required-and uses high-reliability CMOS technology optimized for deterministic timing across industrial temperatures. Its dual-byte enable architecture enables independent 8-bit writes without affecting adjacent bytes, while the OE-controlled 5 ns output enable path supports fast burst reads in pipelined systems.
Pin-compatible with the IDT71V416S/L family, it shares identical address decoding (A0–A17), bidirectional I/O mapping (I/O0–I/O15), and control logic (CS, WE, OE, BHE, BLE), but distinguishes itself via lower dynamic and standby current: ISB = 50 mA (max) and ISB1 = 10 mA (max) at VDD = 3.6 V and fMAX.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4,194,304 bits (256K × 16), enabling 512 KB of word-accessible storage per device. |
| Access Time (tAA) | 10 ns max - guarantees valid data on I/O lines within 10 ns of stable address and CS assertion. |
| Supply Voltage | 3.0 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of ±10% regulation variation. |
| Standby Current (ISB1) | 10 mA max - ensures ultra-low power retention during system sleep modes without data loss. |
| I/O Interface | LVTTL-compatible - directly interfaces with 3.3 V microcontrollers, FPGAs, and ASICs without level-shifting. |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade deployment in base stations, motor drives, and factory automation. |
| Package | 48-ball BGA (BEG48), 9 mm × 9 mm - supports high-density PCB layouts with improved thermal dissipation vs. SOJ/TSOP. |
Pinout & Package
Package: 48-ball fine-pitch BGA (BEG48), 9 mm × 9 mm, 0.8 mm ball pitch, RoHS-compliant green variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; no address multiplexing required. |
| I/O0–I/O7 | Low-Byte Data I/O | Bidirectional 8-bit data path enabled only when BLE = LOW; isolated from high byte during partial writes. |
| I/O8–I/O15 | High-Byte Data I/O | Bidirectional 8-bit data path enabled only when BHE = LOW; enables independent high-byte updates. |
| CS | Chip Select | Active-low global enable: device enters standby (high-Z I/O, low ICC) when HIGH; required for all operations. |
| WE | Write Enable | Active-low control for write cycles; combined with CS and BHE/BLE to define write boundaries and data direction. |
| OE | Output Enable | Active-low control for read output drivers; allows read data to appear on I/O lines with 5 ns latency (tOE). |
| BHE / BLE | Byte Enable Inputs | Independent active-low controls for high- and low-byte write masking - eliminates need for external byte gating logic. |
| VDD | Power Supply | Single 3.3 V supply input; decoupling required per Renesas layout guidelines to maintain 10 ns timing integrity. |
| VSS | Ground | System ground reference; JEDEC center-pin placement minimizes simultaneous switching noise (SSN) in dense arrays. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC Center Power/Ground Pinout | Reduces ground bounce and supply noise by symmetrically distributing VDD/VSS pins around the die perimeter. |
| Byte-Selectable Write Architecture | Enables 8-bit writes to either high or low byte without disturbing the other - critical for legacy 8-bit peripheral coexistence. |
| 5 ns Output Enable Latency (tOE) | Supports tight-timing read bursts in FPGA-based DMA engines where OE is strobed per word transfer. |
| 10 ns Read Cycle Time (tRC) | Permits sustained 100 MHz random-access throughput in synchronous bus interfaces with proper setup/hold margins. |
| Industrial Temperature Qualification | Validated operation from –40°C to +85°C with full AC/DC parameter compliance - suitable for uncontrolled ambient deployments. |
Applications
| Industrial PLC Data Buffer | Network Switch Packet Memory |
|---|---|
Use Scenario: Storing real-time I/O scan data and ladder logic state variables in programmable logic controllers operating in factory environments with wide thermal swings. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer providing zero-wait-state read/write access to CPU and DMA controllers during cyclic scan execution. Use Value: 10 ns tAA and industrial temp rating ensure deterministic response under voltage droop and thermal stress, eliminating timing-related watchdog resets. |
Use Scenario: Holding ingress/egress packet headers and metadata in Layer 2/L3 Ethernet switches before forwarding decisions are made. IC Role / Device Role / Timing Role: Dual-port-capable memory bank accessed concurrently by ingress parser and egress scheduler logic blocks. Use Value: Byte-enable isolation prevents corruption during partial header updates, while 3.3 V LVTTL I/O simplifies interface to 10/100/1000 Mbps PHY controllers. |
| FPGA Configuration Cache | Digital Signal Acquisition Buffer |
Use Scenario: Caching configuration bitstreams or lookup tables for Xilinx/Intel FPGAs in reconfigurable test equipment requiring rapid mode switching. IC Role / Device Role / Timing Role: Off-chip fast-access memory mapped into FPGA's AXI or Avalon-MM address space for runtime table updates. Use Value: 48-ball BGA footprint minimizes trace length and signal integrity degradation at >50 MHz bus speeds, preserving setup/hold timing margins. |
Use Scenario: Capturing high-fidelity sensor samples (e.g., vibration, temperature, pressure) in predictive maintenance edge nodes prior to FFT processing. IC Role / Device Role / Timing Role: High-speed circular buffer interfaced to ADC controller logic, accepting parallel 16-bit samples at up to 100 MSPS. Use Value: 10 ns tRC and 5 ns tOE allow back-to-back sampling without pipeline stalls, maximizing effective ADC utilization in burst capture modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-10ZSXI | Same density (256K × 16), 10 ns access, but uses 44-pin TSOP-II (PHG44); higher ISB1 (25 mA) and no BGA option. | Suitable for cost-sensitive board designs where TSOP footprint and manual rework are acceptable. | Select when legacy board reuse or hand-soldering capability is prioritized over thermal performance and density. |
| AS6C4008-10BIN | 256K × 16, 10 ns, but operates at 2.7–3.6 V; lacks byte enables (BHE/BLE); only available in SOJ/TSOP packages. | Applicable in simpler 16-bit-only systems where byte masking is handled externally or not required. | Choose when power supply flexibility (2.7 V min) outweighs need for independent byte writes and BGA packaging. |
Compared with CY62167EV30LL-10ZSXI and AS6C4008-10BIN, the IDT71V416L10BEGI delivers superior thermal management via BEG48 BGA, lowest standby current (10 mA), and native byte-enable logic - making it optimal for thermally constrained, power-aware industrial systems requiring partial-write efficiency.
Availability
IDT71V416L10BEGI is available at Aetrix Electronics and suitable for industrial PLCs, network packet buffers, FPGA configuration caches, and digital signal acquisition systems requiring stable component supply across extended lifecycles.
Supply support for IDT71V416L10BEGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The IDT71V416L10BEGI belongs to Renesas' legacy high-speed SRAM product line, engineered for deterministic, low-latency memory access in real-time embedded systems where refresh-free operation and industrial reliability are mandatory.
FAQ
What is the maximum operating frequency supported by the IDT71V416L10BEGI?
The IDT71V416L10BEGI does not use a clock; it is an asynchronous SRAM. Its maximum effective throughput is determined by its 10 ns read cycle time (tRC), enabling up to 100 million random accesses per second. Sustained bandwidth depends on bus protocol overhead and address stability - no internal oscillator or PLL is present.
Does the IDT71V416L10BEGI require external refresh circuitry?
No. The IDT71V416L10BEGI is a fully static RAM: it retains data indefinitely as long as VDD is applied and CS remains asserted or deselected properly. No refresh cycles, timers, or external circuitry are needed - unlike DRAM or pseudo-SRAM devices.
Can the IDT71V416L10BEGI be used with a 5 V microcontroller interface?
No. The IDT71V416L10BEGI is strictly a 3.3 V LVTTL device: VIH(max) = VDD + 0.3 V (≤3.9 V), and absolute max VIN = VDD + 0.5 V (≤4.1 V). Direct connection to 5 V logic will exceed ratings and risk damage. Level translation is mandatory for 5 V host interfaces.
What is the function of the NC pins on the BEG48 package of the IDT71V416L10BEGI?
The IDT71V416L10BEGI's BEG48 package has multiple NC (No Connect) balls, including Ball A1, Ball D1, Ball E1, Ball G1, and Ball H1 per Renesas pin map. These are unconnected silicon pads - they must remain unpopulated and unconnected on PCBs to avoid signal integrity issues or unintended coupling.
How does the IDT71V416L10BEGI handle simultaneous read and write operations?
The IDT71V416L10BEGI does not support true simultaneous read/write. It is a single-port SRAM: when WE is LOW (write active), outputs go high-Z regardless of OE state. Reads occur only when WE is HIGH and OE/CS are asserted - enforcing strict read-then-write or write-then-read sequencing.
IDT71V416L10BEGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CABGA (9x9)
IDT71V416L10BEGI FAQ
1.How can I place an order for IDT71V416L10BEGI through Aetrix?
Please submit a Request for Quotation (RFQ) for IDT71V416L10BEGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDT71V416L10BEGI reliable?
The price and inventory of IDT71V416L10BEGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT71V416L10BEGI is usually 5 days.
3.What payment methods are accepted for IDT71V416L10BEGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT71V416L10BEGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDT71V416L10BEGI?
IDT71V416L10BEGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDT71V416L10BEGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDT71V416L10BEGI?
For technical support, including IDT71V416L10BEGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT71V416L10BEGI requirements.
6.How does Aetrix verify that IDT71V416L10BEGI is sourced from the original manufacturer or authorized distributors?
All IDT71V416L10BEGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT71V416L10BEGI meets industry standards.
7.What is the process for return or replacement of IDT71V416L10BEGI?
All IDT71V416L10BEGI units undergo pre-shipment inspection (PSI). If there is an issue with IDT71V416L10BEGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDT71V416L10BEGI part is unused and in its original packaging.
Return procedure for IDT71V416L10BEGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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