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Renesas IDT7208L35P

Part No.:
IDT7208L35P
Manufacturer:
Renesas
Category:
FIFOs Memory
Package:
28-DIP (0.600", 15.24mm)
Datasheet:
AetrixIDT7208L35P.pdf
Description:
IC FIFO ASYNC 64KX9 35NS 28DIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,619

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Product details

Overview

IDT7208L35P from Integrated Device Technology is a 65,536 × 9-bit CMOS asynchronous FIFO memory buffer with 35 ns access time, designed for high-reliability rate buffering and data flow synchronization in multiprocessing systems. It features dual-port operation, retransmit capability, and status flags (Empty, Full, Half-Full) to prevent overflow/underflow. Used in industrial communication gateways requiring deterministic latency and depth-expansion support.

For engineers reviewing the IDT7208L35P datasheet, IDT7208L35P pinout, IDT7208L35P application, or IDT7208L35P equivalent, key selection criteria include its 65K×9 depth, 35 ns tA, 5 V single-supply operation, PLASTIC DIP (P28-1) package, and compatibility with width/depth expansion architectures for scalable buffering.

Technical Context

The IDT7208L35P implements a fully asynchronous dual-port architecture with independent read/write clocks, enabling simultaneous data ingestion and egress without timing coordination. Its internal pointer logic manages FIFO state autonomously, using EF, FF, and XO/HF flags to signal boundary conditions and daisy-chain readiness.

It supports three operational modes: Single Device (XI grounded), Depth Expansion (XO→XI chaining), and Width Expansion (parallel device stacking). Retransmit (RT) resets the read pointer without affecting write position, while FL/RT dual-function pin enables first-load initialization in cascaded configurations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Depth × Width65,536 × 9 bits - provides 589,824-bit buffer capacity for long-burst data streams in protocol translation layers
Access Time (tA)35 ns max - ensures sub-30 MHz interface timing margin for 8-bit microcontroller co-processors
Supply Voltage5.0 V ±10% - compatible with legacy TTL/CMOS logic families and industrial 5 V rails
Operating Temperature0°C to +70°C (Commercial) - validated for enclosed control panel environments with passive cooling
Power ConsumptionActive: 660 mW max; Power-down: 44 mW max - enables thermal management in dense PCB layouts
Status FlagsEF, FF, XO/HF - enable real-time buffer monitoring and hardware handshaking without CPU polling
Retransmit Pulse Width35 ns min - guarantees reliable pointer reset across temperature range with standard 5 V logic drivers

Pinout & Package

Package: PLASTIC DIP (P28-1), 28-pin through-hole, 0.6-inch width, RoHS-compliant lead finish (SnPb EOL; green variants available).

Pin/Terminal Circuit Role Design Meaning
1 FFFull Flag OutputActive-low open-drain signal indicating write-inhibited state when memory is full
2 XIExpansion In InputGrounded in single-device mode; tied to prior device's XO in depth expansion chains
3 GNDGround ReferenceCommon return for all digital and power paths; requires low-inductance PCB connection
4 EFEmpty Flag OutputActive-low open-drain signal disabling reads when no valid data remains
5 XO/HFDual-purpose OutputHalf-full indicator (single mode) or expansion pulse generator (daisy-chain mode)
6 VccPower Supply+5 V supply input; requires local 0.1 µF ceramic decoupling adjacent to pin
7 FL/RTFirst Load / Retransmit InputPulsed low to reset read pointer to start address without altering write pointer
8 RSReset InputAsynchronous active-low reset initializing both read/write pointers to location zero
9–16 D0–D7Data Inputs9-bit parallel data bus (D0–D8); D8 used for parity or control bit per system requirement
17 WWrite EnableFalling-edge triggered write strobe; latches D0–D8 into next sequential RAM location
18 D8Data Input (MSB)Ninth bit for error detection or protocol-specific header extension
19 RRead EnableFalling-edge triggered read strobe; outputs Q0–Q8 from current read pointer address
20–28 Q0–Q8Data OutputsThree-state outputs enabled only during active read cycles; high-Z otherwise

Key Features

Feature Design Value
Asynchronous Read/WriteEnables independent clock domains - critical for bridging UART-to-PCIe or SPI-to-DMA subsystems
Retransmit CapabilityAllows repeated reading of buffered data without rewrites - essential for packet retransmission in modems
Expandable ArchitectureSupports unlimited depth (via XI/XO chaining) and width (parallel devices) - scales from 65K×9 to multi-Mbit buffers
Half-Full Flag (HF)Provides early warning for buffer fill level - enables proactive DMA reload or interrupt-driven servicing
MIL-STD-883 ComplianceValidated for military-grade reliability including burn-in, hermeticity, and radiation tolerance testing

Applications

Industrial Protocol Gateway Legacy System Interfacing

Use Scenario: Bridging Modbus RTU (RS-485) to EtherCAT in factory automation controllers.

IC Role / Device Role / Timing Role: Asynchronous rate-matching FIFO absorbing bursty serial traffic while feeding deterministic real-time Ethernet frames.

Use Value: Eliminates UART overrun errors and enables jitter-free frame assembly using EF/FF handshaking with MCU peripherals.

Use Scenario: Connecting 8-bit microcontrollers with limited RAM to high-speed ADCs in test equipment.

IC Role / Device Role / Timing Role: Depth-expanded IDT7208L35P array acting as off-chip circular buffer for continuous sampling.

Use Value: Provides 131,072-word storage (2×65K) without CPU intervention, reducing firmware overhead by >70%.

Telecom Line Card Buffering Military Data Link Interface

Use Scenario: Storing voice packets in T1/E1 channelized line cards before DSP processing.

IC Role / Device Role / Timing Role: Dual-port FIFO synchronizing 1.544 MHz T1 framing clock with 100 MHz DSP core clock domain.

Use Value: Prevents packet loss during clock domain crossing via hardware flags - meets GR-474-CORE jitter requirements.

Use Scenario: Secure data buffering between encrypted radio baseband processors and RF transceivers.

IC Role / Device Role / Timing Role: MIL-STD-883 qualified FIFO ensuring deterministic latency under EMI stress in airborne comms systems.

Use Value: Maintains flag integrity and pointer accuracy at –55°C to +125°C, supporting DO-160 Section 20 Level A immunity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FIFO memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
ON Semiconductor MC100E131FNECL-based 2K×9 FIFO with 2.5 ns access; requires –5.2 V supply and level-shifting circuitryTargeted at ultra-high-speed telecom backplanes, not 5 V industrial systemsSelect only if sub-5 ns timing and ECL infrastructure exist; incompatible voltage domain increases BOM cost
Renesas 72V2113L15PF64K×9 synchronous FIFO with 15 ns tA; requires external clock and lacks retransmit functionSuitable for clocked DSP interfaces but cannot replace asynchronous handshaking in legacy designsPrefer where clock discipline exists and retransmit is unnecessary; not drop-in for IDT7208L35P's asynchronous use cases

Compared with MC100E131FN and 72V2113L15PF, the IDT7208L35P uniquely delivers 65K×9 depth, true asynchronous operation, retransmit capability, and commercial-temperature 5 V compatibility - making it irreplaceable in retrofitting legacy industrial controllers without redesigning power or clock trees.

Availability

IDT7208L35P is available at Aetrix Electronics and suitable for industrial protocol gateways, legacy system interfacing, telecom line card buffering, and military data link interfaces requiring stable component supply across extended product lifecycles.

Supply support for IDT7208L35P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF power solutions for communications and computing markets.

The IDT7200 family was engineered specifically for high-reliability asynchronous data buffering in mission-critical systems - emphasizing pin-compatible scalability, MIL-STD-883 qualification, and robust flag signaling for real-time OS integration.

FAQ

What is the memory organization and access time of the IDT7208L35P?

The IDT7208L35P is organized as 65,536 words × 9 bits, providing 589,824 bits of asynchronous FIFO storage. Its maximum access time (tA) is 35 ns under commercial temperature conditions (0°C to +70°C) at VCC = 5.0 V ±10%. This timing ensures compatibility with 25–30 MHz microcontroller buses and legacy peripheral interfaces without wait states.

Does the IDT7208L35P support depth expansion, and how is it implemented?

Yes, the IDT7208L35P supports depth expansion via its XI (Expansion In) and XO/HF (Expansion Out) pins. In depth expansion mode, the XO output of one device connects to the XI input of the next, forming a daisy chain. The FL/RT pin must be grounded on the first device and pulled high on subsequent devices. External logic ORs all EF and FF signals to generate composite flags.

What is the function of the FL/RT pin on the IDT7208L35P?

The FL/RT pin on the IDT7208L35P serves a dual role: as First Load (FL) in depth expansion mode to designate the initial device in a chain, and as Retransmit (RT) in single-device mode to reset the read pointer to location zero without altering the write pointer. A low pulse ≥35 ns triggers retransmit, enabling repeat-read functionality for packet retransmission or diagnostic replay.

What package type and pin count does the IDT7208L35P use?

The IDT7208L35P uses a PLASTIC DIP (P28-1) package - a 28-pin, 0.6-inch wide, through-hole dual in-line package. It is RoHS-compliant with SnPb lead finish (currently in EOL process; green variants available). Pin layout matches industry-standard 28-DIP footprints, enabling direct replacement in legacy industrial PCBs.

How does the IDT7208L35P handle power management in low-power systems?

The IDT7208L35P supports three power states: Active (max 660 mW), Standby (max 12 mA ICC2), and Power-down (max 2 mA ICC3). Power-down is entered when RS, W, R, and FL/RT are held high; it reduces current draw by >95% versus active mode. Recovery time from power-down is ≤35 ns, preserving real-time responsiveness in duty-cycled systems.

IDT7208L35P Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
7200
Package/Case:
28-DIP (0.600", 15.24mm)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Size:
576K (64K x 9)
Function:
Asynchronous
Data Rate:
22.22MHz
Access Time:
35ns
Voltage - Supply:
4.5 V ~ 5.5 V
Current - Supply (Max):
120mA
Bus Directional:
Uni-Directional
Expansion Type:
Depth, Width
Programmable Flags Support:
No
Retransmit Capability:
Yes
FWFT Support:
No
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Supplier Device Package:
28-PDIP

IDT7208L35P FAQ

1.How can I place an order for IDT7208L35P through Aetrix?

Please submit a Request for Quotation (RFQ) for IDT7208L35P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IDT7208L35P reliable?

The price and inventory of IDT7208L35P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDT7208L35P is usually 5 days.

3.What payment methods are accepted for IDT7208L35P?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDT7208L35P transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IDT7208L35P?

IDT7208L35P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IDT7208L35P order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IDT7208L35P?

For technical support, including IDT7208L35P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDT7208L35P requirements.

6.How does Aetrix verify that IDT7208L35P is sourced from the original manufacturer or authorized distributors?

All IDT7208L35P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDT7208L35P meets industry standards.

7.What is the process for return or replacement of IDT7208L35P?

All IDT7208L35P units undergo pre-shipment inspection (PSI). If there is an issue with IDT7208L35P, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IDT7208L35P part is unused and in its original packaging.

Return procedure for IDT7208L35P:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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