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Infineon Technologies IFX1763LDV33XUMA1
- Part No.:
- IFX1763LDV33XUMA1
- Manufacturer:
- Infineon Technologies
- Package:
- 10-TFDFN Exposed Pad
- Datasheet:
-
IFX1763LDV33XUMA1.pdf
- Description:
- IC REG LINEAR 3.3V 500MA TSON-10
- Quantity:
- Payment:
- Shipping:
Inventory:1,831
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Product details
Overview
IFX1763LDV33XUMA1 from Infineon Technologies is a fixed-output 3.3 V, 500 mA low-dropout linear regulator with 320 mV dropout voltage, 24 µVRMS output noise (10 Hz–100 kHz), and 30 µA quiescent current. It features reverse battery protection, overcurrent/overtemperature shutdown, and stable operation with ≥3.3 µF ceramic output capacitors. Designed for noise-sensitive battery-powered systems including radar front-ends and image sensor power rails.
For engineers reviewing the IFX1763LDV33XUMA1 datasheet, IFX1763LDV33XUMA1 pinout, IFX1763LDV33XUMA1 application, or IFX1763LDV33XUMA1 equivalent, key selection criteria include low-noise performance under light load, Kelvin sense capability for remote load regulation, exposed-pad thermal management in TSON-10, and compatibility with aluminum/tantalum/ceramic output capacitors without series ESR requirements.
Technical Context
The IFX1763LDV33XUMA1 implements a micropower bandgap reference with bypass-capacitor-enabled noise filtering, error amplifier-based feedback control, and integrated saturation-stage pass transistor driving. Its architecture supports Kelvin sensing via dedicated SENSE pin to compensate for PCB trace IR drop between regulator and load.
Protection logic includes thermal foldback, current-limit hysteresis, and reverse-input blocking using internal MOSFET body diode behavior-no external diodes required. The device operates across 1.8 V to 20 V input while maintaining ±2.5% output accuracy over full temperature and load range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.3 V ±2.5% over -40°C to +125°C junction temperature and 1 mA–500 mA load. |
| Max Output Current | 500 mA continuous; current limit activates above ~600 mA to prevent thermal runaway. |
| Dropout Voltage | 320 mV at 500 mA load; enables regulation down to VIN = 3.62 V for 3.3 V output. |
| Output Noise | 24 µVRMS (10 Hz–100 kHz) with 0.01 µF BYP-to-OUT capacitor; critical for analog/RF supply domains. |
| Quiescent Current | 30 µA typical at no load; enables multi-year battery life in always-on sensor nodes. |
| Shutdown Current | <1 µA when EN pin pulled low; eliminates standby drain in sleep-mode systems. |
| Input Voltage Range | 1.8 V to 20 V; supports single-cell LiFePO₄ (2.5–3.6 V), dual-cell alkaline (2.4–3.2 V), and 12 V automotive subsystems. |
| Stability Capacitor | ≥3.3 µF ceramic, aluminum, or tantalum; no minimum ESR requirement simplifies layout. |
Pinout & Package
IFX1763LDV33XUMA1 uses PG-TSON-10 Exposed Pad package (3 mm × 3 mm, 0.65 mm pitch), requiring soldering of exposed pad (Pin 11) to PCB ground plane for thermal dissipation and electrical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | OUT | Regulated 3.3 V output; connects directly to load; requires ≥3.3 µF output capacitor at this node. |
| 3 | NC | No internal connection; may be left floating or tied to GND for mechanical stability. |
| 4 | SENSE | Kelvin sense input for fixed-output version; connects to load-side of trace to eliminate IR drop error. |
| 5 | BYP | Bypass reference node; 0.01 µF capacitor to OUT reduces output noise to 24 µVRMS. |
| 6 | EN | Active-high enable; pulled high to VIN or 5 V logic; sinking <1 µA allows direct MCU GPIO control. |
| 7 | GND | Power and signal ground reference; tie exposed pad (Pin 11) directly to this pin on PCB. |
| 8 | IN | Main input (1.8–20 V); reverse-battery tolerant; requires 1–10 µF input capacitor if >15 cm from source. |
| 9, 10 | NC | No internal connection; recommended to tie to GND for thermal and EMI performance. |
| 11 | Tab (Exposed Pad) | Thermal and electrical ground; must be soldered to large copper pour connected to Pin 7 (GND). |
Key Features
| Feature | Design Value |
|---|---|
| Low-noise regulation | 24 µVRMS output noise with 0.01 µF BYP capacitor enables clean power for ADCs, PLLs, and CMOS image sensors. |
| Kelvin sense capability | SENSE pin allows remote feedback placement at load, eliminating up to 100 mV regulation error from PCB trace resistance. |
| Reverse battery protection | No external diode needed; internal structure blocks reverse current flow during battery reversal, protecting load and IC. |
| Micropower operation | 30 µA quiescent current and <1 µA shutdown current extend battery life in always-on IoT endpoints. |
| Capacitor flexibility | Stable with ceramic, aluminum, or tantalum output capacitors ≥3.3 µF-no ESR tuning or damping resistors required. |
Applications
| Radar Front-End Power | CMOS Image Sensor Bias |
|---|---|
Use Scenario: Low-phase-noise RF receiver chain in automotive or industrial radar modules requiring ultra-clean 3.3 V supply. IC Role / Device Role / Timing Role: Primary LDO supplying RF transceiver ICs and low-noise amplifiers; BYP capacitor minimizes broadband noise coupling into LO paths. Use Value: 24 µVRMS noise ensures <0.1° RMS phase jitter degradation in 77 GHz radar synthesizers. | Use Scenario: Powering rolling-shutter or global-shutter CMOS image sensors in surveillance or machine vision cameras. IC Role / Device Role / Timing Role: Dedicated analog rail LDO for pixel array and column ADC circuitry; SENSE pin compensates for flex-cable voltage drop. Use Value: ±2.5% output accuracy and Kelvin sensing maintain consistent pixel gain calibration across temperature and load transients. |
| Industrial IoT Sensor Node | Medical Point-of-Care Device |
Use Scenario: Battery-powered wireless sensor node with BLE/Wi-Fi MCU, MEMS accelerometer, and environmental sensors. IC Role / Device Role / Timing Role: Main system LDO enabling deep-sleep modes; EN pin controlled by MCU to gate power to peripherals. Use Value: 30 µA IQ and <1 µA shutdown current allow >5-year coin-cell operation in periodic wake-up telemetry applications. | Use Scenario: Portable ultrasound or glucose monitor with strict EMI and leakage current limits. IC Role / Device Role / Timing Role: Isolated analog supply LDO for op-amp front-ends and SAR ADCs; reverse-battery protection prevents patient hazard during battery swap. Use Value: No external protection diodes reduce BOM count and board area while meeting IEC 60601 creepage/safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLE42754G | 5 V fixed output; higher IQ (70 µA); no BYP pin; automotive-qualified AEC-Q100 Grade 0. | Designed for 12 V automotive subsystems; lacks low-noise optimization for RF/analog loads. | Select only for automotive environments requiring AEC-Q100 compliance; not suitable for noise-sensitive 3.3 V rails. |
| LP5907MFX-3.3/NOPB | 3.3 V fixed; 12 µVRMS noise; 25 µA IQ; DSBGA package; no SENSE or reverse-battery protection. | Optimized for mobile SoC core rails; lacks Kelvin sensing and reverse-input tolerance. | Prefer for space-constrained portable designs where ultra-low noise dominates; add external diode if reverse-battery risk exists. |
Compared with TLE42754G and LP5907MFX-3.3/NOPB, IFX1763LDV33XUMA1 uniquely combines 3.3 V low-noise regulation, Kelvin sensing, reverse-battery hardening, and micropower shutdown-all in a thermally enhanced TSON-10 package-making it optimal for industrial and medical battery-powered analog systems.
Availability
IFX1763LDV33XUMA1 is available at Aetrix Electronics and suitable for radar front-end power, CMOS image sensor bias, and industrial IoT sensor node applications requiring stable component supply, long-lifecycle support, and RoHS-compliant green packaging.
Supply support for IFX1763LDV33XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and ISO 14001 standards.
The IFX1763 product line delivers wide-input, low-noise LDOs for demanding analog and mixed-signal applications in battery-powered instrumentation, radar, and imaging systems-prioritizing noise immunity, thermal robustness, and protection integration.
FAQ
What is the minimum output capacitance required for stable operation?
The IFX1763LDV33XUMA1 requires a minimum 3.3 µF output capacitor-ceramic, aluminum, or tantalum-for guaranteed stability across all operating conditions. Larger values improve transient response but are not necessary for basic regulation. No ESR specification or damping resistor is needed, unlike many legacy LDOs.
Can the SENSE pin be left unconnected in standard applications?
Yes-the SENSE pin can be directly shorted to the OUT pin for standard PCB layouts where trace resistance between regulator and load is negligible (<10 mΩ). It should only be routed separately to the load when precise regulation under high-current transients or long flex-cable connections is required.
Does IFX1763LDV33XUMA1 require an input capacitor?
An input capacitor (1–10 µF ceramic) is recommended if the device is located more than 15 cm from the main power source or if high-frequency impedance (e.g., battery ESR) exceeds 100 mΩ. It suppresses high-frequency noise and prevents instability during fast load steps, especially in battery-powered systems.
How is thermal performance managed in the TSON-10 package?
Thermal performance relies on soldering the exposed pad (Pin 11) to a large PCB copper pour tied directly to Pin 7 (GND). This provides primary heat conduction path; junction-to-board thermal resistance is 35 K/W typical. Without proper pad soldering, thermal derating begins above 250 mA at ambient >60°C.
IFX1763LDV33XUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 10-TFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 20V
- Voltage - Output (Min/Fixed):
- 3.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.45V @ 500mA
- Current - Output:
- 500mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- 31 mA
- PSRR:
- 65dB (120Hz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature, Reverse Polarity
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSON-10
IFX1763LDV33XUMA1 FAQ
1.How can I place an order for IFX1763LDV33XUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IFX1763LDV33XUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IFX1763LDV33XUMA1 reliable?
The price and inventory of IFX1763LDV33XUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IFX1763LDV33XUMA1 is usually 5 days.
3.What payment methods are accepted for IFX1763LDV33XUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IFX1763LDV33XUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IFX1763LDV33XUMA1?
IFX1763LDV33XUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IFX1763LDV33XUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IFX1763LDV33XUMA1?
For technical support, including IFX1763LDV33XUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IFX1763LDV33XUMA1 requirements.
6.How does Aetrix verify that IFX1763LDV33XUMA1 is sourced from the original manufacturer or authorized distributors?
All IFX1763LDV33XUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IFX1763LDV33XUMA1 meets industry standards.
7.What is the process for return or replacement of IFX1763LDV33XUMA1?
All IFX1763LDV33XUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IFX1763LDV33XUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IFX1763LDV33XUMA1 part is unused and in its original packaging.
Return procedure for IFX1763LDV33XUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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