Infineon Technologies IFX1763LDVXUMA1

Overview

IFX1763LDVXUMA1 from Infineon Technologies is a fixed-output 3.3 V, 500 mA low-dropout linear regulator with 320 mV dropout voltage, 24 µVRMS output noise (10 Hz–100 kHz), and 30 µA quiescent current. It features reverse battery protection, overtemperature/overcurrent shutdown, and stable operation with ≥3.3 µF ceramic, tantalum, or aluminum output capacitors. Used in radar front-ends and image sensor power rails where low noise and transient immunity are critical.

For engineers reviewing the IFX1763LDVXUMA1 datasheet, IFX1763LDVXUMA1 pinout, IFX1763LDVXUMA1 application, or IFX1763LDVXUMA1 equivalent, this page delivers verified package mapping (PG-TSON-10), terminal functions (SENSE, EN, BYP), thermal design guidance (exposed pad tied to GND), and real-world substitution options for noise-sensitive 3.3 V supply chains.

Technical Context

The IFX1763LDVXUMA1 implements a micropower error amplifier with Kelvin-sense feedback for load regulation accuracy, integrated thermal foldback and current-limit protection, and internal reference bypassing via the BYP pin to achieve ultra-low noise. Its architecture eliminates external protection diodes and supports reverse-input fault tolerance without external components.

Designed for wide-input (1.8 V–20 V) battery-powered systems, it maintains 2.5% output voltage accuracy across –40 °C to +125 °C junction temperature and full load range. The SENSE pin enables remote sensing to compensate for PCB trace IR drop, while EN provides logic-compatible shutdown with <1 µA leakage.

Key Specifications

Pinout & Package

IFX1763LDVXUMA1 is housed in a PG-TSON-10 Exposed Pad package (3 mm × 3 mm, 0.5 mm pitch). Thermal performance requires soldering the exposed pad (Pin 11) directly to PCB ground plane and electrically tying it to Pin 6 (GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise LDO applications.

Compared with TLE42754G, IFX1763LDVXUMA1 delivers superior noise performance and exact 3.3 V compatibility; versus TPS7A4701RGWR, it offers simpler integration and lower cost for 500 mA applications where 24 µVRMS suffices.

Availability

IFX1763LDVXUMA1 is available at Aetrix Electronics and suitable for radar front-ends, CMOS image sensor biasing, and portable medical instrumentation requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for IFX1763LDVXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949.

The IFX1763 product line targets high-reliability, low-noise power regulation in battery-constrained and EMI-sensitive applications - particularly radar, imaging, and portable instrumentation where micropower and precision matter.

FAQ

What is the recommended output capacitor for IFX1763LDVXUMA1?

A minimum 3.3 µF ceramic capacitor is required at the OUT pin to ensure stability. X7R or X5R dielectrics are preferred. For transient-heavy loads like image sensors, increasing to 10–22 µF improves peak voltage regulation. The capacitor must be placed as close as possible to the OUT and GND pins, with short, low-inductance traces.

Can the SENSE pin be left unconnected in standard configurations?

Yes - in standard configurations where PCB trace resistance between the regulator and load is negligible (<10 mΩ), the SENSE pin may be directly connected to the OUT pin. Leaving it floating is not permitted; it must be either tied to OUT (fixed version) or used for remote sensing at the load point to improve regulation accuracy under dynamic load conditions.

Does IFX1763LDVXUMA1 require an input capacitor?

An input capacitor is required if the device is located more than 6 inches from the main input filter capacitor or if high-frequency impedance exists on the input path (e.g., long battery leads). A 1–10 µF ceramic capacitor placed near the IN pin suppresses high-frequency noise and stabilizes input impedance, especially in battery-powered systems where source impedance rises with frequency.

How is thermal performance managed with the exposed pad?

The exposed pad (Pin 11) must be soldered to a dedicated PCB copper pour connected to Pin 6 (GND). Minimum recommended thermal pad area is 25 mm² with ≥4 thermal vias (0.3 mm diameter) to inner ground planes. This configuration achieves ≤45 °C/W junction-to-ambient thermal resistance in typical 4-layer boards, enabling full 500 mA operation at +85 °C ambient.