Infineon Technologies IFX1763XEJV33XUMA1

Overview

IFX1763XEJV33XUMA1 from Infineon Technologies is a fixed-output 3.3 V, 500 mA low-dropout linear regulator with 320 mV dropout voltage, 24 µVRMS output noise (10 Hz–100 kHz), and 30 µA quiescent current. It features reverse battery protection, overcurrent/overtemperature shutdown, and stable operation with ≥3.3 µF ceramic output capacitors. Designed for radar front-ends and image sensor power rails where low noise and high PSRR are critical.

For engineers reviewing the IFX1763XEJV33XUMA1 datasheet, IFX1763XEJV33XUMA1 pinout, IFX1763XEJV33XUMA1 application, or IFX1763XEJV33XUMA1 equivalent, key selection criteria include its 1.8–20 V input range, ±2.5% output accuracy across temperature/load, exposed-pad DSO-8 thermal performance, and Kelvin sense capability for precision load regulation.

Technical Context

The IFX1763XEJV33XUMA1 implements a micropower bandgap reference with bypass-capacitor-enabled low-noise architecture, achieving 24 µVRMS via external 0.01 µF BYP-to-OUT capacitor. Its error amplifier drives a PMOS pass transistor with integrated saturation control to maintain regulation down to 320 mV VIN–VOUT differential.

Internal protection includes reverse-battery blocking (no external diode needed), thermal foldback above 150 °C junction, and current-limiting that clamps output at ~600 mA. The SENSE pin enables remote sensing for <1% load regulation error in high-impedance PCB traces.

Key Specifications

Pinout & Package

IFX1763XEJV33XUMA1 is housed in PG-DSO-8 Exposed Pad (RoHS-compliant, green product), with thermal pad (Pin 9) soldered to PCB ground for optimal junction-to-board thermal resistance (R_θJB = 25 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise LDO applications.

Compared with TLE42754G and TLV70733PDQNR, IFX1763XEJV33XUMA1 uniquely combines 500 mA drive, 24 µVRMS noise with bypass, Kelvin sensing, and reverse-battery protection in a thermally enhanced DSO-8 EP package - making it optimal for high-reliability, noise-critical embedded systems.

Availability

IFX1763XEJV33XUMA1 is available at Aetrix Electronics and suitable for radar front-end power, image sensor bias supply, and microcontroller core supply requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for IFX1763XEJV33XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949.

The IFX1763 belongs to Infineon's wide-input, low-noise LDO family designed specifically for high-reliability industrial and radar applications - emphasizing thermal robustness, reverse-polarity resilience, and precision regulation under transient load conditions.

FAQ

What is the minimum output capacitance required for stability?

The IFX1763XEJV33XUMA1 requires a minimum 3.3 µF ceramic output capacitor placed directly at the OUT pin for unconditional stability. Larger values improve transient response but are not necessary for basic regulation. Aluminum or tantalum capacitors are also supported without ESR constraints.

Can the SENSE pin be left unconnected in standard applications?

Yes - in standard PCB layouts with short, low-impedance traces between OUT and the load, the SENSE pin may be directly connected to the OUT pin. Leaving it unconnected risks instability; tying it to OUT ensures proper error amplifier feedback and maintains ±2.5% output accuracy.

Does the device require an input capacitor?

An input capacitor is recommended when the IFX1763XEJV33XUMA1 is located more than 6 inches from the main system filter capacitor or when high source impedance (e.g., long battery leads) exists. A 1–10 µF ceramic capacitor at the IN pin suppresses high-frequency noise and improves transient response.

How is thermal performance affected if the exposed pad is not soldered?

Failure to solder the exposed thermal pad (Pin 9) significantly degrades thermal resistance - R_θJA increases from ~50 °C/W (with proper pad soldering) to >120 °C/W. This can cause premature thermal shutdown at >300 mA load, especially in ambient temperatures above 60 °C.