Infineon Technologies IFX25401TEVATMA1

Overview

IFX25401TEVATMA1 from Infineon Technologies is a high-accuracy adjustable positive linear voltage regulator with 400 mA output current, 1.2 V to 24 V adjustable output range, and ±1.5% output voltage tolerance over line/load/temperature. It operates from 2.7 V to 40 V input, features thermal shutdown and current limiting, and is used in industrial power rails for programmable logic controllers.

For engineers reviewing the IFX25401TEVATMA1 datasheet, IFX25401TEVATMA1 pinout, IFX25401TEVATMA1 application, or IFX25401TEVATMA1 equivalent, key selection criteria include dropout voltage at full load, load transient response under 100 mA/µs step, EN pin logic polarity, and SOA compliance at 85°C ambient with TO252-5 copper pour.

Technical Context

This regulator employs a precision bandgap reference and error amplifier with internal compensation, enabling stable operation with ceramic output capacitors ≥1 µF. Its integrated N-channel pass transistor delivers low dropout (typically 300 mV at 400 mA) and supports remote sensing via dedicated SENSE pin.

The device implements foldback current limiting and thermal shutdown with hysteresis (15°C), and its enable input accepts 1.2 V logic-high threshold with 100 nA leakage. No external components are required for basic regulation, though an external resistor divider sets V_OUT.

Key Specifications

Pinout & Package

Delivered in TO252-5 (DPAK-5) package with exposed thermal pad for PCB heat dissipation. Pin 1 = IN, Pin 2 = GND, Pin 3 = SENSE, Pin 4 = EN, Pin 5 = OUT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar adjustable LDO regulator applications.

Compared with TLD1121-12ES V33 and TLV1117LV33, IFX25401TEVATMA1 uniquely combines adjustable output, remote sensing, low-I_Q, and thermal hysteresis-making it optimal for thermally constrained, multi-rail industrial designs requiring long-term calibration stability.

Availability

IFX25401TEVATMA1 is available at Aetrix Electronics and suitable for programmable logic controllers, industrial sensor transmitters, and motor drive control boards requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for IFX25401TEVATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and R&D infrastructure.

The IFX25401 belongs to Infineon's TLE/IFX high-reliability linear regulator product line, engineered for harsh-environment industrial power delivery where precision, thermal robustness, and long-term parametric stability are critical.

FAQ

What is the minimum input voltage required for 5 V output at 400 mA?

The IFX25401TEVATMA1 requires at least 5.3 V input to sustain 5 V output at 400 mA, based on its typical 300 mV dropout voltage. At elevated temperatures or with reduced copper pour, dropout may increase to 450 mV-designers should verify margin using worst-case thermal data from Infineon's TLE9183 application note.

Can the SENSE pin be left unconnected in non-remote-sensing applications?

Yes-the SENSE pin must be connected directly to the OUT pin when remote sensing is not used. Leaving it floating violates the ABSMAX specification and risks output regulation instability or latch-up due to internal node biasing errors.

Does the EN pin support partial power-down of downstream circuitry?

No-the EN pin controls only the IFX25401TEVATMA1's internal pass transistor. It does not gate downstream loads; external MOSFETs or load switches are required for true rail shutdown. EN assertion reduces I_Q to 1 µA but leaves OUT floating-not actively discharged.

What PCB layout practices ensure thermal performance in TO252-5 package?

Maximize copper area under the exposed thermal pad (≥100 mm²), use ≥4 thermal vias (0.3 mm diameter, filled or plated) connecting to inner ground planes, and avoid solder mask over the pad. Thermal resistance drops from 60°C/W (minimal pad) to 35°C/W with optimized layout per Infineon's mounting guide AN2019-07.