Nexperia USA Inc. IP3319CX6,135

Overview

IP3319CX6,135 from Nexperia is a single-channel common-mode filter with integrated ESD protection for USB 2.0 high-speed differential lines (480 Mbit/s), featuring ±15 kV IEC 61000-4-2 contact ESD rating, 1.5 pF diode capacitance (A2/B2 to GND), and −25 dB common-mode attenuation at 700–1.8 GHz. It protects D+/D− and ID lines in compact WLCSP6 packaging.

For engineers reviewing the IP3319CX6,135 datasheet, IP3319CX6,135 pinout, IP3319CX6,135 application, or IP3319CX6,135 equivalent, this device serves as a signal-integrity-preserving ESD filter for high-speed interface I/O protection where ultra-low capacitance, rail-to-rail clamping, and sub-1 GHz differential bandwidth are critical selection criteria.

Technical Context

The IP3319CX6 integrates copper-coil-based common-mode filtering with monolithic silicon ESD protection, using two ultra-low-capacitance rail-to-rail diodes plus a dedicated ID-line diode. Its snap-back clamping structure delivers dynamic resistance as low as 0.14 Ω (negative transient) and clamping voltage of −2.5 V at −6 A surge.

It operates without supply dependency due to rail-to-rail architecture, supports bidirectional D+/D− interchangeability, and achieves >1 GHz differential-mode −3 dB bandwidth while suppressing common-mode noise above 800 MHz by ≥13 dB across GSM and LTE bands.

Key Specifications

Pinout & Package

IP3319CX6,135 uses a 6-bump Wafer-Level Chip-Scale Package (WLCSP6) with non-solder-mask-defined (NSMD) pad layout optimized for micro-via grounding and minimal parasitic inductance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar common-mode ESD filter applications.

Compared with TPD2EUSB30DRTR and EMIF06-USB03F3, IP3319CX6,135 offers the smallest footprint (1.34 × 0.95 mm), lowest component count for USB 2.0-only applications, and optimized common-mode rejection above 800 MHz-making it ideal for space-constrained mobile and portable designs prioritizing cost and size over multi-protocol support.

Availability

IP3319CX6,135 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, DVI/LVDS display subsystems, and industrial USB host ports requiring stable component supply, long-term lifecycle assurance, and traceable wafer-level sourcing.

Supply support for IP3319CX6,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, analog, and ESD protection solutions with focus on efficiency, reliability, and miniaturization for consumer, computing, and industrial markets.

IP3319CX6 belongs to Nexperia's ESD protection and common-mode filter product line, engineered specifically for high-speed differential interface I/O hardening where ultra-low capacitance, rail-to-rail operation, and compact WLCSP packaging are essential design requirements.

FAQ

Can IP3319CX6,135 be used on USB 3.0 SuperSpeed lines?

No. IP3319CX6,135 is characterized for USB 2.0 high-speed (480 Mbit/s) operation with a differential −3 dB bandwidth >1 GHz. USB 3.0 SuperSpeed requires >2.5 GHz bandwidth and lower capacitance (<0.3 pF), which this device does not provide. Its electrical characteristics and frequency response are validated only up to 1.8 GHz for common-mode suppression and beyond 1 GHz for differential passband.

What is the recommended PCB layout for optimal ESD performance?

Use Non-Solder-Mask-Defined (NSMD) pads with laser-drilled 100 µm micro-vias connecting C1 (GND) directly to an internal buried ground plane. Maintain 250 µm pad diameter, 325 µm solder mask aperture, and FR4 substrate. This minimizes ground loop inductance, ensuring clamping voltage remains below 4 V during ±15 kV ESD events as specified in IEC 61000-4-2.

Does the ID pin (C2) support USB On-The-Go (OTG) functionality?

Yes. Pin C2 is designated as the USB ID line and includes a dedicated 1.7 pF ESD diode to GND. It enables OTG role detection (e.g., mini-A vs. mini-B plug identification) while maintaining low capacitance to avoid false ID state transitions. The rail-to-rail protection ensures correct ID voltage levels even when V_CC is absent.

Is reflow soldering compatible with standard Pb-free profiles?

Yes. IP3319CX6,135 is qualified for Pb-free reflow with peak temperature of 230–260 °C, 30 s maximum time above 250 °C, and cooling rate ≤−6 °C/s. It withstands at least three reflows per JEDEC J-STD-020. The WLCSP6 package uses AuNi copper finish and meets all thermal requirements in Table 13 of the official Nexperia datasheet Rev. 2 (29 May 2013).