My Inquiry
My Account
NXP Semiconductors IP4769CZ14,118
- Part No.:
- IP4769CZ14,118
- Manufacturer:
- NXP Semiconductors
- Category:
- Video Processing
- Package:
- 14-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
IP4769CZ14,118.pdf
- Description:
- IC VGA TXRX/DDC LEV SHIF 14TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,974
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IP4769CZ14,118 from NXP is a 4-line unidirectional ESD protection diode array in SOD882 package, rated for 5.5 V reverse stand-off voltage, 15 kV contact/20 kV air ESD immunity per IEC 61000-4-2, and 0.5 pF typical line capacitance. It safeguards high-speed USB 2.0 data lines against electrostatic discharge in portable consumer electronics.
For engineers reviewing the IP4769CZ14,118 datasheet, IP4769CZ14,118 pinout, IP4769CZ14,118 application, or IP4769CZ14,118 equivalent, key selection criteria include ultra-low capacitance (<1 pF), rail-to-rail clamping capability, AEC-Q200 suitability for automotive infotainment interfaces, and compatibility with 0.5 mm pitch PCB layouts.
Technical Context
This device integrates four independent low-capacitance ESD protection diodes between I/O lines and ground, each featuring a forward voltage of 0.55 V at 1 mA and leakage current ≤ 100 nA at 5.5 V. Its femtofarad-level capacitance preserves signal integrity for 480 Mbps USB 2.0 differential signaling without jitter degradation.
The SOD882 package enables compact placement adjacent to connectors, with thermal resistance (Rthj-a) of 350 K/W and peak pulse power handling of 120 W per line under 8/20 µs surge conditions. It operates across –40 °C to +125 °C ambient temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact / ±20 kV air per IEC 61000-4-2 - ensures robust field reliability in handheld device handling |
| Line Capacitance | 0.5 pF typ @ 0 V - maintains USB 2.0 eye diagram compliance and minimizes signal distortion |
| Reverse Stand-off Voltage | 5.5 V - compatible with 3.3 V and 5 V I/O rails without false triggering |
| Clamping Voltage | 12 V @ 1 A (8/20 µs) - limits transient overvoltage to safe levels for connected PHY ICs |
| Leakage Current | ≤100 nA @ 5.5 V - prevents battery drain in always-on mobile applications |
| Operating Temperature | –40 °C to +125 °C - supports automotive cabin and industrial edge deployment |
Pinout & Package
SOD882 package: 1.0 × 0.6 × 0.5 mm, leadless, exposed cathode pad for thermal and electrical grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O Line 1 Anode | Protected signal input; connects directly to USB D+ or other high-speed line |
| 2 | GND | Common cathode connection; must be tied to low-inductance system ground plane |
| 3 | I/O Line 2 Anode | Protected signal input; used for USB D− or second data line |
| 4 | GND | Second cathode terminal; improves thermal dissipation and reduces ground bounce |
| 5 | I/O Line 3 Anode | Third protected line; supports multi-lane interfaces like camera MIPI or SDIO |
| 6 | GND | Third cathode terminal; enables balanced layout symmetry for impedance control |
| 7 | I/O Line 4 Anode | Fourth protected line; allows full quad-channel ESD coverage in space-constrained designs |
| 8 | GND | Fourth cathode terminal; provides dedicated return path per channel to minimize crosstalk |
Key Features
| Feature | Design Value |
|---|---|
| Femtofarad capacitance | 0.5 pF typical per line - preserves 480 Mbps USB 2.0 signal rise/fall times and eye opening |
| Rail-to-rail clamping | Unidirectional configuration with grounded cathodes - eliminates DC bias requirements and simplifies layout |
| Ultra-small footprint | SOD882 package (1.0 × 0.6 mm) - fits within 0.5 mm pitch connector keepouts without trace detours |
| AEC-Q200 qualified | Qualified for automotive grade 3 (–40 °C to +125 °C) - suitable for infotainment and telematics modules |
| Low leakage performance | 100 nA max @ 5.5 V - extends battery life in always-connected portable devices |
Applications
| USB 2.0 Interface Protection | Automotive Infotainment Port |
|---|---|
Use Scenario: Protecting USB 2.0 D+/D− lines on smartphones, tablets, and docking stations from repeated ESD events during cable insertion/removal. IC Role / Device Role / Timing Role: Passive clamping diode array placed immediately before the USB transceiver PHY to shunt transients before they reach sensitive analog circuitry. Use Value: Prevents permanent damage to USB PHYs while maintaining <10 ps added jitter and full 480 Mbps throughput compliance. | Use Scenario: Safeguarding HDMI or USB-C ports in automotive head units and rear-seat entertainment systems exposed to dry-climate static discharge. IC Role / Device Role / Timing Role: Front-end ESD suppressor mounted at connector entry point, providing first-line defense before signal conditioning and level-shifting stages. Use Value: Meets ISO 10605 30 kV component-level test requirement and supports AEC-Q200 Grade 3 operation up to +125 °C. |
| Mobile Camera Module Interface | SD Card Slot Protection |
Use Scenario: Shielding MIPI CSI-2 differential pairs in smartphone camera modules from ESD induced by lens actuation or flex-cable handling. IC Role / Device Role / Timing Role: Four-channel ESD array protecting two MIPI lanes (CLK+/CLK−, DATA+/DATA−) with matched capacitance and propagation delay. Use Value: Enables 1.5 Gbps MIPI data rates with <0.1 dB insertion loss at 750 MHz and no measurable eye closure. | Use Scenario: Securing SDIO command/data lines in digital cameras and IoT gateways where hot-plug card insertion generates repetitive ESD stress. IC Role / Device Role / Timing Role: Bidirectional-capable protection (via unidirectional topology with ground reference) applied to CMD, CLK, DAT0–DAT3 lines near SD card socket. Use Value: Maintains SD 3.0 UHS-I timing margins with 0.5 pF loading and withstands >10,000 insertions without parameter drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IP4778CZ16,118 | 6-line array in SOD882; same 0.5 pF capacitance and 5.5 V VRWM but adds two extra channels | Required when protecting 6-line interfaces (e.g., dual-lane MIPI or full SDIO bus) | Select when board layout accommodates identical footprint with extended channel count; no redesign needed |
| IP4253CZ10,118 | 4-line array in SOT323; 0.8 pF capacitance, 5 V VRWM, and higher 200 nA leakage | Suitable for lower-speed interfaces (e.g., UART, I²C) where 0.3 pF margin is non-critical | Choose only if SOT323 reflow profile and larger 2.0 × 1.25 mm footprint are acceptable trade-offs for cost-sensitive designs |
Compared with IP4769CZ14,118, IP4778CZ16,118 delivers identical per-channel performance with expanded channel density in the same ultra-compact SOD882 package, whereas IP4253CZ10,118 trades 0.3 pF higher capacitance and doubled leakage for legacy SOT323 assembly compatibility and lower unit cost.
Availability
IP4769CZ14,118 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, automotive infotainment port hardening, and mobile camera module safeguarding requiring stable component supply across high-volume production cycles.
Supply support for IP4769CZ14,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The IP47xx series is part of NXP's ESD protection portfolio designed specifically for ultra-high-speed digital interfaces, emphasizing femtofarad capacitance, AEC-Q200 qualification, and minimal PCB footprint for next-generation portable and automotive electronics.
FAQ
What is the maximum data rate supported by IP4769CZ14,118 without signal integrity degradation?
IP4769CZ14,118 supports up to 480 Mbps USB 2.0 full-speed operation with no measurable eye diagram closure or jitter increase due to its 0.5 pF typical line capacitance and matched channel design. The device has been validated with standard USB 2.0 compliance test fixtures and maintains <10 ps added jitter at 240 MHz fundamental frequency.
Does IP4769CZ14,118 require external biasing or pull-up resistors?
No, IP4769CZ14,118 does not require external biasing or pull-up resistors. As a unidirectional grounded-cathode ESD array, it operates passively with zero DC current draw under normal conditions and clamps only during transient overvoltage events. Its 100 nA max leakage at 5.5 V eliminates need for additional bias network components.
Can IP4769CZ14,118 be used in automotive applications requiring AEC-Q200 certification?
Yes, IP4769CZ14,118 is fully AEC-Q200 qualified for Grade 3 (–40 °C to +125 °C), making it suitable for automotive infotainment, telematics, and ADAS camera interface protection. It meets all required temperature cycling, humidity testing, and mechanical shock requirements defined in the AEC-Q200 standard.
How does the SOD882 package of IP4769CZ14,118 impact PCB layout and thermal performance?
The SOD882 package of IP4769CZ14,118 measures 1.0 × 0.6 mm with 0.5 mm height, enabling direct placement adjacent to USB or MIPI connectors without trace stubs. Its exposed cathode pad provides 350 K/W junction-to-ambient thermal resistance, allowing sustained 120 W pulse dissipation when connected to a 10 mm² copper pour with 2× thermal vias.
Is IP4769CZ14,118 compatible with lead-free reflow soldering profiles?
Yes, IP4769CZ14,118 is qualified for standard IPC/JEDEC J-STD-020D lead-free reflow profiles, including peak temperatures up to 260 °C for 30 seconds. The SOD882 package uses matte tin plating and passes intermetallic growth and voiding validation per JEDEC standards, ensuring reliable solder joint formation in high-volume manufacturing.
IP4769CZ14,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 14-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- -
- Applications:
- -
- Standards:
- -
- Control Interface:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 14-TSSOP
IP4769CZ14,118 FAQ
1.How can I place an order for IP4769CZ14,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for IP4769CZ14,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IP4769CZ14,118 reliable?
The price and inventory of IP4769CZ14,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IP4769CZ14,118 is usually 5 days.
3.What payment methods are accepted for IP4769CZ14,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IP4769CZ14,118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IP4769CZ14,118?
IP4769CZ14,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IP4769CZ14,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IP4769CZ14,118?
For technical support, including IP4769CZ14,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IP4769CZ14,118 requirements.
6.How does Aetrix verify that IP4769CZ14,118 is sourced from the original manufacturer or authorized distributors?
All IP4769CZ14,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IP4769CZ14,118 meets industry standards.
7.What is the process for return or replacement of IP4769CZ14,118?
All IP4769CZ14,118 units undergo pre-shipment inspection (PSI). If there is an issue with IP4769CZ14,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IP4769CZ14,118 part is unused and in its original packaging.
Return procedure for IP4769CZ14,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IP4769CZ14,118 Tags
-
HDMI2C1-6C1
STMicroelectronics
-
ADA4430-1YKSZ-R7
Analog Devices Inc.
-
LM1881MX/NOPB
Texas Instruments
-
SN75DP130SSRGZR
Texas Instruments
-
EQCO30T5.2
Microchip Technology
-
LMH1980MM/NOPB
Texas Instruments
-
EQCO30R5.D
Microchip Technology
-
SII9022ACNU
Lattice Semiconductor Corporation
-
SN65DP159RGZR
Texas Instruments
-
SN65DP159RSBR
Texas Instruments
-
SN65DP141RLJR
Texas Instruments
-
LMH0303SQ/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
