My Inquiry
My Account
NXP Semiconductors IP4853CX24/LF,135
- Part No.:
- IP4853CX24/LF,135
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 24-UFBGA, WLCSP
- Datasheet:
-
IP4853CX24/LF,135.pdf
- Description:
- IC INTFACE SPECIALIZED 24WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,560
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IP4853CX24/LF,135 from NXP Semiconductors is a monolithic WLCSP24 integrated level shifter, EMI filter, and ESD protection device for SD/microSD/MMC memory card interfaces. It provides bidirectional 1.8 V ↔ 2.9 V voltage translation, on-chip 2.9 V power regulation from battery (VBAT), IEC 61000-4-2 Level 4 ESD protection (±8 kV contact), and EMI suppression up to 6 GHz. It enables low-power mobile processors to interface directly with memory cards in smartphones and digital cameras.
For engineers reviewing the IP4853CX24/LF,135 datasheet, IP4853CX24/LF,135 pinout, IP4853CX24/LF,135 application, or IP4853CX24/LF,135 equivalent, this page delivers verified technical context, validated pin functions, real-world timing and regulator performance data, and confirmed alternative options for memory card interface design.
Technical Context
The IP4853CX24/LF,135 integrates a dual-voltage bidirectional level translator with independent direction control per channel (DIR_CMD, DIR_0, DIR_1_3), a 2.9 V linear regulator (200 mA output, 150 mV dropout), and integrated EMI filters on all clock, command, and data lines. Its feedback-controlled clock path (CLK_IN → CLK_FB) supports synchronous host-card timing.
It implements high-Z tri-state control via ENABLE and supports dynamic bus direction switching without external logic. All I/O pins feature integrated ESD diodes meeting IEC 61000-4-2 Level 4, and internal biasing resistors (Rpu, Rpd, Rs) eliminate need for discrete pull-ups/downs on CD, WP, and data lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Level shift range | 1.8 V ↔ 2.9 V bidirectional translation with independent direction control per signal group |
| Regulator output | 2.9 V ±0.087 V at 0–200 mA; supports direct powering of SD/microSD/MMC cards |
| ESD protection | IEC 61000-4-2 Level 4: ±8 kV contact, ±15 kV air discharge on all I/O pins |
| EMI filtering | ≥9 dB insertion loss from 401 MHz to 6 GHz; suppresses harmonics near cellular bands |
| Propagation delay | 4.2–10.7 ns (host↔card); enables >20 MHz SD clock operation with timing margin |
| Package | WLCSP24, 1.99 × 1.99 × 0.61 mm, 0.4 mm bump pitch, NSMD PCB compatible |
| Operating temp | −30 °C to +85 °C ambient; qualified for mobile consumer applications |
Pinout & Package
IP4853CX24/LF,135 uses a Wafer Level Chip-Size Package (WLCSP24) with 24 solder bumps arranged in a 5×5 grid (B2 pattern), index corner at bump A1. The package measures 1.99 × 1.99 × 0.61 mm and requires NSMD PCB layout with micro-vias to buried ground plane for optimal ESD/EMI performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 DATA2_H | I/O (host side) | Bidirectional data line 2 for host processor; level-shifted to card-side DATA2_SD |
| A2 DIR_CMD | Input | Direction control for CMD_H/CMD_SD; HIGH = host input / card output |
| A3 DIR_0 | Input | Direction control for DATA0_H/DATA0_SD; enables independent data flow control |
| A4 VBAT | Supply | Battery input (2.7–5.0 V); powers internal regulator and ESD clamps |
| A5 DATA2_SD | I/O (card side) | Bidirectional data line 2 for SD/microSD/MMC; referenced to VSD (2.9 V) |
| B1 DATA3_H | I/O (host side) | Bidirectional data line 3 for host; routed through level shifter to DATA3_SD |
| B2 n.c. | Not connected | No internal connection; must be left floating or grounded per PCB design rules |
| B3 VCC | Supply | Host-side supply (1.62–2.1 V); powers host-side drivers and logic |
| B4 VSD | Output | Regulated 2.9 V output for memory card; requires 1 μF external capacitor |
| B5 DATA3_SD | I/O (card side) | Bidirectional data line 3 for card; driven by internal regulator-referenced circuitry |
| C1 CLK_IN | Input | Host clock input; feeds both CLK_SD (card output) and CLK_FB (feedback) |
| C2 ENABLE | Input | Global enable; LOW places all I/Os in high-Z state for power-down or hot-plug isolation |
| C3, C4 GND | Supply | Dual ground connections; mandatory for low-inductance return path and EMI suppression |
| C5 CLK_SD | Output | Level-shifted clock output to memory card; synchronized with CLK_IN and CLK_FB |
| D1 DATA0_H | I/O (host side) | Data line 0 for host; direction controlled by DIR_0; supports SD bus mode |
| D2 CMD_H | I/O (host side) | Command line for host; direction controlled by DIR_CMD; handles CMD/RESP protocol |
| D3 CD | Output | Card detect bias output; drives mechanical switch with integrated 49–91 kΩ pull-up |
| D4 CMD_SD | I/O (card side) | Command line for memory card; referenced to VSD; includes ESD protection |
| D5 DATA0_SD | I/O (card side) | Data line 0 for card; level-shifted and EMI-filtered; supports 4-bit SD mode |
| E1 DATA1_H | I/O (host side) | Data line 1 for host; grouped under DIR_1_3 for simultaneous direction control |
| E2 CLK_FB | Output | Clock feedback to host processor; enables precise timing alignment and jitter monitoring |
| E3 DIR_1_3 | Input | Shared direction control for DATA1_H–DATA3_H and corresponding card-side signals |
| E4 WP | Output | Write protect bias output; drives WP switch with 70–130 kΩ pull-up resistor |
| E5 DATA1_SD | I/O (card side) | Data line 1 for card; fully regulated, filtered, and protected; part of 4-line data bus |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 2.9 V regulator | Eliminates external LDO; delivers 200 mA with <150 mV dropout and 40 dB PSRR at 1 kHz |
| Per-channel direction control | Enables mixed-direction SD bus operation (e.g., CMD input while DATA0 output) without glue logic |
| On-die EMI filtering | Provides ≥9 dB attenuation from 401 MHz to 6 GHz-critical for passing radiated emissions in handheld devices |
| Integrated bias resistors | Includes factory-trimmed pull-ups (10.5–19.5 kΩ), pull-downs (329–611 kΩ), and series resistors (32–48 Ω) for CD, WP, and data lines |
| Tri-state enable | ENABLE pin forces all I/Os into high-Z state-essential for hot-plug detection and system-level power sequencing |
Applications
| Smartphone Memory Card Interface | Digital Camera SD Slot |
|---|---|
Use Scenario: Integrating microSD expansion into space-constrained smartphone mainboard with 1.8 V AP and 2.9 V card compliance. IC Role / Device Role / Timing Role: Bidirectional level shifter, 2.9 V card PSU, EMI filter, and ESD protector-all in one WLCSP24 die. Use Value: Reduces BOM count by 12+ passives and discrete ICs; meets IEC 61000-4-2 Level 4 without external TVS diodes. | Use Scenario: Enabling high-speed SDHC/SDXC support in compact digital camera with battery-powered operation. IC Role / Device Role / Timing Role: Translates 1.8 V host interface to 2.9 V card voltage while maintaining <10.7 ns propagation delay for 25 MHz SD clock. Use Value: Guarantees timing margin for UHS-I mode; integrated CLK_FB allows host to monitor clock integrity during high-speed transfers. |
| Laptop Card Reader Module | Industrial Handheld Data Logger |
Use Scenario: Adding SD/microSD support to ultrabook card reader with strict EMC requirements. IC Role / Device Role / Timing Role: EMI filter suppresses harmonics from 400 MHz to 6 GHz; integrated regulator eliminates noise coupling from shared battery rail. Use Value: Passes EN 55032 Class B radiated emissions without shielded enclosure or ferrite beads. | Use Scenario: Reliable memory card interfacing in ruggedized field equipment operating from 2.7–5.0 V battery. IC Role / Device Role / Timing Role: Wide VBAT range (2.7–5.0 V) and −30 °C to +85 °C operation ensure robustness across temperature and voltage extremes. Use Value: Maintains 2.9 V card supply and ESD protection even at end-of-battery-life (2.7 V VBAT). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar memory card interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX14541EETE+ | Single-supply 1.65–3.6 V operation; no integrated regulator; supports only 1.8 V ↔ 3.3 V translation | Lacks VSD output and EMI filtering; requires external 2.9 V LDO and RC filters for SD compliance | Select when host and card share common supply or when regulator integration is unnecessary |
| TPD4S012YZR | ESD-only solution (no level shifting or regulation); 4-channel, 0.65 mm pitch DSBGA12 | Requires separate level shifter and LDO; limited to basic ESD protection on 4 lines (CMD, CLK, DAT0, DAT1) | Select when existing design already includes discrete level shifter and regulator, and only ESD hardening is needed |
Compared with MAX14541EETE+ and TPD4S012YZR, the IP4853CX24/LF,135 uniquely combines level shifting, 2.9 V regulation, EMI filtering, and full SD bus ESD protection in one WLCSP24 package-reducing board area by >40% and eliminating 15+ external components required by alternative solutions.
Availability
IP4853CX24/LF,135 is available at Aetrix Electronics and suitable for smartphone, digital camera, laptop card reader, and industrial handheld applications requiring stable component supply, guaranteed long-term availability, and RoHS-compliant packaging.
Supply support for IP4853CX24/LF,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and mobile applications.
The IP4853CX24/LF,135 belongs to NXP's interface protection and level-shifting product line, designed specifically to simplify SD/microSD/MMC integration in battery-powered portable electronics with stringent size, EMI, and reliability requirements.
FAQ
What is the maximum supported clock frequency for SD interface operation using IP4853CX24/LF,135?
The IP4853CX24/LF,135 supports SD clock frequencies up to 25 MHz in standard speed mode, with worst-case propagation delay of 10.7 ns (host→card) and 9.2 ns (card→host) at +70 °C. Its EMI filtering and low-jitter CLK_FB output maintain signal integrity for reliable UHS-I SDR12 operation, though higher modes require validation against specific host controller timing budgets.
Does IP4853CX24/LF,135 require external passive components for basic SD interface functionality?
No-IP4853CX24/LF,135 integrates all essential passives: internal pull-ups (CD, WP), pull-downs (data lines), series termination (32–48 Ω), and EMI filter capacitance. Only a single 1 μF ceramic capacitor on VSD is required for regulator stability; no external ESD diodes, LDOs, or RC filters are needed for compliant SD/microSD/MMC operation.
How does the ENABLE pin affect power states and signal integrity in IP4853CX24/LF,135?
When ENABLE is LOW, all I/O pins enter high-Z state-including CLK_SD, CMD_SD, and DATAx_SD-preventing back-driving of the memory card during hot-plug events or system suspend. This ensures clean power sequencing and eliminates leakage paths, while maintaining VSD regulation active if VBAT remains applied.
Can IP4853CX24/LF,135 interface with both SD and MMC memory cards?
Yes-IP4853CX24/LF,135 is explicitly designed for SD, microSD, and Multi Media Card (MMC) interfaces. Its pin naming (e.g., CMD_H, DATA0_SD), direction control architecture, and 2.9 V regulator output comply with JEDEC Standard JESD84-A44 (SD) and JESD84-A42 (MMC), supporting legacy and high-capacity variants across all three standards.
What is the thermal performance of IP4853CX24/LF,135 under full 200 mA load on VSD?
At 200 mA load and +85 °C ambient, IP4853CX24/LF,135 maintains VO(reg) ≥2.75 V with ΔVdo(reg) ≤150 mV. Its 550 mW total power dissipation limit and WLCSP24 thermal resistance allow operation without heatsinking in typical smartphone/camera PCB layouts with 2-layer ground planes and micro-via stitching.
IP4853CX24/LF,135 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 24-UFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Cell Phones, Digital Cameras, Media Players
- Interface:
- microSD™, MMC, SD
- Voltage - Supply:
- 1.62V ~ 2.1V
- Supplier Device Package:
- 24-WLCSP (5x5)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
IP4853CX24/LF,135 FAQ
1.How can I place an order for IP4853CX24/LF,135 through Aetrix?
Please submit a Request for Quotation (RFQ) for IP4853CX24/LF,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IP4853CX24/LF,135 reliable?
The price and inventory of IP4853CX24/LF,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IP4853CX24/LF,135 is usually 5 days.
3.What payment methods are accepted for IP4853CX24/LF,135?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IP4853CX24/LF,135 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IP4853CX24/LF,135?
IP4853CX24/LF,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IP4853CX24/LF,135 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IP4853CX24/LF,135?
For technical support, including IP4853CX24/LF,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IP4853CX24/LF,135 requirements.
6.How does Aetrix verify that IP4853CX24/LF,135 is sourced from the original manufacturer or authorized distributors?
All IP4853CX24/LF,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IP4853CX24/LF,135 meets industry standards.
7.What is the process for return or replacement of IP4853CX24/LF,135?
All IP4853CX24/LF,135 units undergo pre-shipment inspection (PSI). If there is an issue with IP4853CX24/LF,135, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IP4853CX24/LF,135 part is unused and in its original packaging.
Return procedure for IP4853CX24/LF,135:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IP4853CX24/LF,135 Tags
-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP Semiconductors
-
PCA9540BDP,118
NXP Semiconductors
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP Semiconductors
-
PTN3360DBS,518
NXP Semiconductors
-
PCA9546ABS,118
NXP Semiconductors
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
