NXP Semiconductors IP4855CX25/P,135

Overview

IP4855CX25/P from NXP Semiconductors is a SD 3.0-compliant 6-bit bidirectional dual-voltage level translator IC designed to interface 1.2–3.3 V host controllers with 1.8 V or 2.9 V SD/microSD/MMC memory cards. It integrates a switchable low-dropout voltage regulator (1.8 V/2.9 V), EMI filters, and 8 kV IEC 61000-4-2 Level 4 ESD protection on card-side pins, supporting SDR50 (100 MHz), DDR50, and legacy SD modes in mobile phone and tablet memory card interfaces.

For engineers reviewing the IP4855CX25/P datasheet, IP4855CX25/P pinout, IP4855CX25/P application, or IP4855CX25/P equivalent, this device delivers verified timing compliance for DDR50 read/write cycles, integrated pull-up/pull-down resistors eliminating external components, and zero-clamping ESD architecture that isolates host-side circuitry from card-side transients.

Technical Context

The IP4855CX25/P implements dedicated direction control logic (DIR_CMD, DIR_0, DIR_1_3) to manage bidirectional data flow between host and card sides, enabling precise mode switching between card read (host input/card output) and card write (host output/card input). Its internal LDO regulator dynamically supplies 1.8 V (SEL = HIGH) or 2.9 V (SEL = LOW) to card-side I/Os, with tracking capability via VSD_REF for optimal 3 V-mode interoperability.

It features a clock feedback channel (CLK_FB) to compensate for PCB trace and device propagation delay-critical for maintaining setup/hold margins in DDR50 read operations where data arrives from the card on both clock edges. All I/O drivers include integrated EMI filters targeting harmonics suppression for mobile RF coexistence.

Key Specifications

Pinout & Package

Package: WLCSP25 (wafer-level chip-scale package), 5 × 5 array, 0.4 mm pitch, 2.04 × 2.04 × 0.5 mm body height.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SD memory card level translation applications.

Compared with MAX14541E+ and TPD4S012RSVR, the IP4855CX25/P uniquely integrates a switchable LDO, clock feedback, and full SD 3.0 timing compliance - making it the only option capable of enabling SDR50 (100 MHz) and DDR50 modes in compact mobile designs without external support components.

Availability

IP4855CX25/P is available at Aetrix Electronics and suitable for mobile phone, tablet PC, and digital camera memory card interfaces requiring stable component supply, guaranteed SD 3.0 timing compliance, and certified 8 kV IEC 61000-4-2 ESD protection.

Supply support for IP4855CX25/P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and mobile applications.

The IP4855CX25/P belongs to NXP's SD card interface portfolio, engineered specifically to simplify high-speed memory card integration in space-constrained portable electronics while meeting stringent EMI and ESD standards.

FAQ

What SD 3.0 bus modes does the IP4855CX25/P support?

The IP4855CX25/P supports all SD 3.0 modes including SDR50 (100 MHz), DDR50, SDR25, SDR12, and backward-compatible SD 2.0 High-Speed (50 MHz) and Default-Speed (25 MHz). Its integrated LDO and direction control logic ensure full compliance with SD 3.0 physical layer timing requirements across all modes, validated per JEDEC and SD Association specifications.

How does the IP4855CX25/P handle voltage selection for the memory card side?

The IP4855CX25/P uses the SEL pin and VSD_REF input to configure its internal LDO: SEL = HIGH sets 1.8 V output; SEL = LOW with VSD_REF < 1 V sets 2.9 V output; if VSD_REF > 1.5 V, the LDO tracks VSD_REF. This enables dynamic adaptation to card voltage requirements without external components - a key feature confirmed in Section 8.3 of the official NXP datasheet for IP4855CX25/P.

Does the IP4855CX25/P require external pull-up or pull-down resistors?

No, the IP4855CX25/P integrates all necessary biasing: 70 kΩ pull-ups on WP and CD outputs (to VCCA), 350 kΩ pull-downs on DATAx_H lines, and 100 Ω pull-downs on CMD_H/CLK_IN. These values are specified in Table 9 of the NXP datasheet and eliminate the need for 12+ external resistors - reducing BOM cost and PCB area in mobile designs.

What is the purpose of the CLK_FB pin on the IP4855CX25/P?

The CLK_FB (clock feedback) pin delivers a delayed copy of CLK_SD back to the host controller to compensate for combined propagation delay from IP4855CX25/P and PCB traces. This is essential for DDR50 read-mode timing closure, where data returns from the card on both clock edges - a function explicitly defined in Section 8.5 and Figure 10 of the IP4855CX25/P datasheet.

How is ESD protection implemented on the IP4855CX25/P?

The IP4855CX25/P provides 8 kV contact discharge ESD protection per IEC 61000-4-2 Level 4 on all card-side pins (DATAx_SD, CMD_SD, CLK_SD, WP, CD, VSUPPLY, VSD_REF), using a zero-clamping architecture that routes transients directly to GND without stressing host-side circuitry - verified in Table 7 and Section 8.7 of the official NXP datasheet for IP4855CX25/P.