STMicroelectronics IPS1025HFTR

Overview

IPS1025HFTR from STMicroelectronics is a single-channel high-side switch IC designed for industrial load control, featuring 8.65–60 V supply range, 12 mΩ typical R_DS(on) at 25 °C, 2.4 A continuous output current, <25 µs propagation delay (L→H), and dual-threshold overload protection with smart capacitive-load driving capability. It is used in programmable logic controllers and numerical control machines requiring SIL-compliant interface architectures.

For engineers reviewing the IPS1025HFTR datasheet, IPS1025HFTR pinout, IPS1025HFTR application, or IPS1025HFTR equivalent, key selection considerations include its dual-level overcurrent thresholds (IPKH = 15.4 A / IPKL = 8.0 A), case/junction thermal shutdown (TCSD = 130 °C / TJSD = 150–190 °C), fast demagnetization (V_DEMAG = V_CC−72.5 V), and diagnostic pins FLT1/FLT2 with 200–550 µs blanking time.

Technical Context

The IPS1025HFTR integrates independent junction and case temperature sensors enabling hierarchical thermal management: junction shutdown triggers first (TJSD ≥150 °C), followed by case shutdown (TCSD = 130 °C) if thermal stress persists. Its active clamp circuit delivers controlled demagnetization of inductive loads with V_DEMAG = V_CC−72.5 V, limiting voltage overshoot during turn-off.

Overload response is configurable via the IPD pin: capacitor coupling enables dual-threshold operation (IPKH/ILIMH for initial peak, IPKL/ILIML for steady state), while resistor biasing selects single-threshold modes (IPKL-only or IPKH-only). Diagnostic outputs FLT1 (over-temperature) and FLT2 (overload) are open-drain current sources with 2–4 mA fault-source capability and 6–8 V clamp voltage.

Key Specifications

Pinout & Package

IPS1025HFTR uses the VFQFPN-48L package (8 mm × 6 mm × 0.9 mm, 0.5 mm pitch), optimized for high-power density and thermal performance with exposed thermal pad. Pin count and function mapping match the PowerSSO-24 variant but provide enhanced routing flexibility and lower R_th(JA) (26 °C/W vs. 22 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side switch applications.

Compared with VNS3NV04PTR-E, IPS1025HFTR delivers wider voltage operation, superior thermal safety, and intelligent inrush handling; versus IPS1035HFTR, it provides 33% higher continuous current (2.4 A vs. 1.8 A) with lower conduction loss-critical for high-duty-cycle industrial loads.

Availability

IPS1025HFTR is available at Aetrix Electronics and suitable for programmable logic control, vending machine load management, and numerical control machine applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for industrial OEMs.

Supply support for IPS1025HFTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with strong focus on functional safety and reliability.

The IPS1025HFTR belongs to ST's VIPower™ M0-7 high-side switch family, engineered for industrial automation systems demanding high-voltage resilience, precise diagnostics, and SIL-compliant fault management.

FAQ

What is the purpose of the IPD pin, and how does it affect overload protection?

The IPD pin configures the IPS1025HFTR's overload protection behavior. Connecting it to GND via a capacitor (470 pF–470 nF) enables dual-threshold operation: IPKH = 15.4 A activates for up to DPK = 215×CPD µs during turn-on, then switches to IPKL = 8.0 A. Resistor biasing selects single-threshold modes-10 kΩ to GND forces IPKH-only, 220 kΩ to IN forces IPKL-only. This allows precise tailoring to load inrush profiles.

How do FLT1 and FLT2 differ in fault reporting, and what external circuitry is required?

FLT1 signals junction or case over-temperature events (TJ ≥ TJSD or TC ≥ TCSD), while FLT2 reports overload conditions (I_OUT > IPK). Both are current-source outputs (2–4 mA sink capability) requiring external pull-down resistors (1.5 kΩ recommended) if unused. They cannot be left floating and must be connected to MCU GPIOs or optocouplers with appropriate current-limiting resistors for voltage translation.

Can the IPS1025HFTR drive inductive loads without external components, and what is the demagnetization mechanism?

Yes-the IPS1025HFTR integrates an active clamp circuit that pulls OUT to V_DEMAG = V_CC−72.5 V during turn-off, dissipating inductive energy internally. This eliminates the need for external freewheeling diodes or RC snubbers. The clamp operates automatically when dV/dt at OUT exceeds threshold, modulating the internal switch to maintain constant V_DEMAG until stored energy decays.

What is the significance of separate junction and case temperature sensors, and how do they interact during thermal stress?

Separate sensors enable staged thermal response: junction shutdown (TJSD ≥150 °C) occurs first to protect the die, turning OFF OUT until TJ falls below TJR (~150 °C). If case temperature continues rising (TC ≥ TCSD = 130 °C), case shutdown activates, holding OUT OFF until both TJ and TC fall below their respective reset thresholds (TJR and TCR = 110 °C). This prevents premature shutdown during transient junction heating while ensuring safe board-level thermal limits.