Infineon Technologies IR082H4C10U-P2

Overview

IR082H4C10U-P2 from Infineon Technologies is a high-voltage, high-speed half-bridge IGBT driver IC with integrated 600V-rated IGBTs and fast recovery diodes. It features cross-conduction prevention logic, matched propagation delays (680–900 ns turn-on, 220–400 ns turn-off), 3.0 V_CE(on), and metal heatsink-backed 7-pin package for thermal management in motor drive inverters.

For engineers reviewing the IR082H4C10U-P2 datasheet, IR082H4C10U-P2 pinout, IR082H4C10U-P2 application, or IR082H4C10U-P2 equivalent, key selection criteria include bootstrap-compatible high-side gate drive, undervoltage lockout thresholds (V_CCUV+ = 8.0–9.8 V), logic-level Schmitt-trigger inputs (V_IH ≥ 2.7 V), and thermal resistance (R_thJC = 20 °C/W) for industrial power stage design.

Technical Context

The IR082H4C10U-P2 integrates a proprietary HVIC front-end with latch-immune CMOS logic and discrete IGBTs in a monolithic half-bridge configuration. Its cross-conduction prevention logic enforces dead-time between HIN and LIN transitions, while matched channel propagation delays simplify timing-critical PWM control in 3-phase inverter stages.

It operates with floating high-side supply (VB = VO + 10 to VO + 20 V), supports logic input voltages referenced to COM across –5 V to 600 V output swing, and includes internal FRED diodes (t_rr = 28 ns, Q_rr = 40 nC) for efficient freewheeling in inductive loads.

Key Specifications

Pinout & Package

7-pin single-in-line (SIP) package with metal heatsink back for direct board-mount thermal conduction; leads are tin-plated copper alloy, lead-free compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage half-bridge driver applications.

Compared with IR062HD4C10U-P2 and FAN7382MX, the IR082H4C10U-P2 uniquely combines cross-conduction prevention, integrated 600 V IGBTs, and FRED diodes in one thermally optimized package - ideal for space-constrained, medium-power (<1 kW) inverter designs where BOM reduction and layout simplicity are critical.

Availability

IR082H4C10U-P2 is available at Aetrix Electronics and suitable for brushless DC motor drives, industrial inverters, solar microinverters, and UPS output stages requiring stable component supply and long-term production continuity.

Supply support for IR082H4C10U-P2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.

The IR082H4C10U-P2 belongs to Infineon's high-voltage intelligent power module (IPM) family, designed specifically for compact, thermally efficient half-bridge inverter stages in cost-sensitive industrial and consumer power electronics.

FAQ

What is the purpose of the cross-conduction prevention logic in IR082H4C10U-P2?

This hardware logic inverts the HIN signal relative to LIN to enforce minimum dead-time between high-side and low-side IGBT turn-on events. It eliminates shoot-through current without requiring external timing components or MCU-based dead-time insertion, reducing design complexity and failure modes in motor drive applications.

Can IR082H4C10U-P2 operate with a 12 V VCC supply?

Yes - the device supports VCC from 10 V to 20 V per datasheet specifications. At 12 V, it delivers full gate drive strength to the integrated IGBTs while maintaining undervoltage lockout (UVLO) margin above the 8.0–9.8 V VCCUV+ threshold, ensuring robust operation during supply ripple or transient dips.

How does the metal heatsink back improve thermal performance?

The exposed metal back serves as the primary thermal path from the silicon die to an external heatsink. With R_thJC = 20 °C/W, it enables direct conduction cooling - allowing the device to dissipate its full 3.0 W package power rating at TA ≤ 25°C without relying solely on PCB copper area, which is critical in enclosed industrial enclosures.

Is IR082H4C10U-P2 pin-compatible with IR062HD4C10U-P2?

Yes - both share identical 7-pin SIP footprint, pin assignments, and mechanical outline. However, their internal logic differs: IR082 uses cross-conduction prevention (inverted HIN), while IR062 provides independent HIN/LIN. PCB layout is interchangeable, but firmware must be updated to match the input logic behavior.