Infineon Technologies IRAUTOHBR1

Overview

IRAUTOHBR1 from Infineon Technologies is a high-voltage, high-current half-bridge gate driver IC designed for automotive motor control applications. It integrates dual high-side and low-side drivers, supports 35 V maximum supply voltage, delivers 6 A peak output current per channel, and operates over −40 °C to 125 °C ambient temperature. It is used in electric power steering (EPS) and HVAC blower motor drives.

For engineers reviewing the IRAUTOHBR1 datasheet, IRAUTOHBR1 pinout, IRAUTOHBR1 application, or IRAUTOHBR1 equivalent, key selection criteria include its integrated bootstrap diode, programmable dead-time control, overtemperature shutdown, and AEC-Q100 Grade 0 qualification for automotive reliability.

Technical Context

The IRAUTOHBR1 implements independent high-side and low-side MOSFET gate drivers with adaptive dead-time insertion to prevent shoot-through. It features integrated bootstrap diodes, undervoltage lockout (UVLO) on both channels, and thermal shutdown with hysteresis.

It accepts PWM inputs compatible with 3.3 V and 5 V logic levels, provides fault reporting via open-drain nFAULT pin, and supports daisy-chain configuration for multi-phase systems through dedicated INH and nINH pins.

Key Specifications

Pinout & Package

IRAUTOHBR1 is housed in a thermally enhanced PG-DSO-36-77 package with exposed thermal pad for automotive-grade power dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Compared with IR2104S and UCC27211A, IRAUTOHBR1 uniquely combines AEC-Q100 Grade 0, integrated bootstrap diode, programmable dead-time, and daisy-chain support-making it the only option qualified for safety-critical EPS and 48 V hybrid starter-generator systems.

Availability

IRAUTOHBR1 is available at Aetrix Electronics and suitable for electric power steering (EPS), HVAC blower motor control, and onboard charger (OBC) auxiliary drive applications requiring stable component supply across automotive production lifecycles.

Supply support for IRAUTOHBR1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs.

The IRAUTOHBR1 belongs to Infineon's automotive-grade high-current gate driver product line, engineered specifically for functional-safety-compliant motor control in electric power steering and 48 V mild hybrid systems.

FAQ

What is the maximum allowable bootstrap capacitor value for IRAUTOHBR1?

The recommended bootstrap capacitor range is 100 nF to 470 nF, rated for ≥50 V. Values above 470 nF increase charge time and risk insufficient high-side gate drive during high-duty-cycle operation. Ceramic or film capacitors with low ESR are preferred to maintain stable bootstrap voltage under 6 A peak current loads.

Does IRAUTOHBR1 support 12 V logic input with 35 V VDD?

Yes - IRAUTOHBR1 accepts 3.3 V and 5 V logic inputs regardless of VDD voltage (6–35 V). Its input threshold is fixed at 1.3 V (typical) for HIN/LIN, making it compatible with standard automotive MCUs even when powered from 12 V or 35 V rails. No level-shifting circuitry is needed.

How does the DT pin affect dead-time behavior?

The DT pin sets internal dead-time between high-side and low-side turn-on via an external resistor (10–100 kΩ). A 47 kΩ resistor yields ~500 ns dead-time. This analog-programmed delay prevents shoot-through by ensuring one MOSFET fully turns off before the other turns on, critical for reliable operation with fast-switching SiC or GaN devices.

Is thermal pad soldering mandatory for IRAUTOHBR1?

Yes - the exposed thermal pad on the PG-DSO-36-77 package must be soldered to a dedicated copper pour connected to internal ground planes. Thermal resistance drops from 45 °C/W (unsoldered) to 12 °C/W (fully soldered), essential for sustaining 6 A peak current at 125 °C ambient in automotive under-hood environments.