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Microchip Technology IS1870SF-102
- Part No.:
- IS1870SF-102
- Manufacturer:
- Microchip Technology
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
IS1870SF-102.pdf
- Description:
- IC RF TXRX+MCU BLE 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,980
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Product details
Overview
IS1870SF-102 from Microchip Technology is a Bluetooth 5.0 Low Energy System-on-Chip (SoC) integrating an 8051 MCU core, 256 KB embedded Flash, 24 KB SRAM, 2.4 GHz RF transceiver, 16-channel 12-bit ADC (ENOB=10 bits), 4-channel PWM, and AES-CMAC hardware engine - designed for ultra-low-power IoT sensor nodes and wearable devices operating from 1.9V to 3.6V across -20°C to +70°C.
For engineers reviewing the IS1870SF-102 datasheet, IS1870SF-102 pinout, IS1870SF-102 application, or IS1870SF-102 equivalent, this page delivers verified technical context, QFN48 package mapping, Bluetooth LE 5.0 RF performance (Rx sensitivity: -90 dBm, Tx power: 0 dBm typ.), GPIO/ADC/PWM peripheral allocation, and real-world selection guidance against comparable BLE SoCs.
Technical Context
The IS1870SF-102 implements a fully integrated Bluetooth 5.0 LE protocol stack on its internal 8051 core with ROM-resident firmware, supporting host-less operation or HCI UART interface to external MCUs. Its RF subsystem includes a 2.402–2.480 GHz transceiver with digital RSSI, programmable Tx output (−25 dBm to +3 dBm), and interference rejection (co-channel: 17 dB).
Power management integrates a 1.55V buck converter, four LDOs (1.28V RFLDO, 1.55V PALDO, 1.2V CLDO, 1.2V ULPC), and Always-On logic enabling RTC wake-up and sub-2.9 μA shutdown current. The 32 kHz internal oscillator and optional external 32.768 kHz crystal support precise timing in low-power modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bluetooth Version | Compliant with Bluetooth Core Specification v5.0 - enables 2× data throughput vs. v4.2 and supports long-range coded PHY (not implemented in default firmware). |
| RF Frequency Range | 2.402–2.480 GHz ISM band - covers all 40 BLE advertising/data channels without external filtering. |
| Rx Sensitivity | −90 dBm typical - ensures reliable link budget in battery-powered beacons and proximity sensors. |
| Operating Voltage | 1.9V to 3.6V - compatible with single-cell Li-ion, Li-poly, or dual-cell alkaline batteries without external regulators. |
| ADC Resolution | 12-bit SDM architecture with 16 input channels and 10-bit ENOB - supports simultaneous battery voltage monitoring and multi-sensor analog acquisition. |
| GPIO Count | 31 general-purpose I/O pins - includes configurable pull-up/pull-down, interrupt capability, and multiplexed ADC/PWM functions. |
| Embedded Memory | 256 KB Flash + 24 KB SRAM - sufficient for full BLE stack, custom application code, and OTA firmware updates. |
| Package | 48-pin QFN, 6 mm × 6 mm × 0.9 mm, 0.4 mm pitch - surface-mount compatible with standard reflow profiles (J-STD-020 Class 3). |
Pinout & Package
IS1870SF-102 is housed in a 48-lead QFN package (6 mm × 6 mm × 0.9 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions are validated per Microchip DS60001371G, including dedicated RF paths (Tx, Rx, VCC_PA, VCC_RF), power domains (VBAT, BK_IN, AVDD, CLDO_O), and mixed-signal I/O (P0_0–P3_4, P1_0–P2_7).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1_0–P1_7, P0_0–P0_7, P2_0–P2_7, P3_0–P3_4 | Configurable DIO/ADC/PWM | 31 GPIOs support analog input (AD0–AD15), PWM outputs (PWM0–PWM3), and event capture - enabling sensor interfacing and actuator control without external components. |
| HCI_TXD / HCI_RXD | UART Interface | Full-duplex HCI UART up to 921.6 kbps with RTS/CTS flow control - allows seamless integration with host processors using standard BLE HCI commands. |
| XO_P / XO_N | 32 MHz Crystal Input | Differential input for external 32 MHz fundamental-mode crystal - required for BLE timing accuracy and RF frequency stability (±20 ppm tolerance recommended). |
| VCC_PA / VCC_RF / AVDD / BK_IN / VBAT | Power Supply Inputs | Separate rails for RF PA (1.55V), RF core (1.28V), digital logic (1.2V), and battery input (1.9–3.6V) - enable independent noise isolation and optimized power sequencing. |
| RST_N | Active-Low Reset | Asynchronous reset input compatible with 1.9–3.6V logic levels - supports system-level reset coordination and brown-out recovery. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE 5.0 Stack | ROM-based Bluetooth Low Energy protocol stack eliminates external memory requirements and reduces BOM cost for certified wireless connectivity. |
| AES-CMAC Hardware Engine | Dedicated cryptographic accelerator enables secure over-the-air firmware updates and authenticated pairing without CPU overhead or software library dependencies. |
| Ultra-Low-Power Shutdown Mode | 1.0–2.9 μA typical current draw - extends shelf life and operational runtime in battery-powered applications requiring infrequent wake-up events. |
| Multi-Source Clock Architecture | Internal 32 kHz ULP oscillator + external 32.768 kHz crystal option + 32 MHz RF crystal - provides flexible timing sources for RTC, sleep modes, and BLE radio synchronization. |
| Hybrid Analog-Digital I/O | 16 ADC inputs share pins with GPIO and PWM - allows dynamic reconfiguration of sensor acquisition, LED dimming, and motor control on same physical pins. |
| Factory-Configured Beacon Support | Pre-loaded firmware enables immediate iBeacon/Eddystone advertisement without host MCU - accelerates time-to-market for location-aware consumer and industrial products. |
Applications
| Wearable Fitness Tracker | Smart Home Sensor Node |
|---|---|
Use Scenario: Compact wrist-worn device measuring heart rate, motion, and ambient temperature with BLE transmission to smartphone. IC Role / Device Role / Timing Role: Primary BLE SoC handling RF communication, sensor data acquisition via 16-channel ADC, and real-time activity classification using on-chip 8051 core. Use Value: 31 GPIOs and integrated temperature sensor eliminate external signal conditioning ICs; sub-2.9 μA shutdown current enables >1-year battery life on coin cell. | Use Scenario: Battery-powered door/window contact sensor with magnetic switch, temperature monitoring, and periodic BLE status reporting. IC Role / Device Role / Timing Role: Autonomous sensor hub managing wake-on-interrupt, ADC sampling, and scheduled BLE advertisements using internal RTC and Always-On logic. Use Value: Integrated buck converter and LDOs reduce external power components; −90 dBm Rx sensitivity ensures reliable connection through walls and enclosures. |
| Industrial Proximity Beacon | Digital Weight Scale |
Use Scenario: Asset-tracking beacon mounted on machinery, transmitting unique ID and battery level at configurable intervals. IC Role / Device Role / Timing Role: Standalone BLE transmitter with AES-CMAC-secured payload generation and adaptive advertising interval based on battery voltage. Use Value: Factory-configured beacon mode requires zero firmware development; 0 dBm Tx power and 48QFN package meet size and regulatory constraints for metal-mount deployment. | Use Scenario: Consumer-grade weighing scale using strain gauge bridge, precision ADC, and BLE weight data streaming to health apps. IC Role / Device Role / Timing Role: Signal acquisition SoC performing ratiometric ADC conversion, digital filtering, and BLE HID profile transmission. Use Value: 12-bit ADC with 10-bit ENOB and internal reference enables ±0.1% full-scale accuracy; UART HCI interface simplifies integration with display microcontroller. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth Low Energy SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52833 DK (Nordic) | ARM Cortex-M4F core, 512 KB Flash, +4 dBm Tx, but requires external DC-DC and crystal load capacitors. | Better compute performance for complex sensor fusion; higher Tx power suits longer-range industrial use cases. | Select when needing floating-point math or >0 dBm output; avoid if minimizing BOM count and layout area is critical. |
| CC2642R (Texas Instruments) | ARM Cortex-M4F, 352 KB Flash, integrated DC-DC, but larger 7 mm × 7 mm QFN and no factory beacon firmware. | Superior RF robustness in noisy environments; TI's BLE stack offers more profile customization than Microchip's fixed HCI implementation. | Select for high-interference factory floors; avoid if rapid beacon deployment or smallest PCB footprint is mandatory. |
Compared with nRF52833 DK and CC2642R, the IS1870SF-102 delivers lowest component count for basic BLE sensor nodes due to integrated buck regulator, factory-certified beacon firmware, and compact 6×6 mm QFN - making it optimal for cost-sensitive, space-constrained, battery-operated designs where raw processing power is secondary to integration and time-to-market.
Availability
IS1870SF-102 is available at Aetrix Electronics and suitable for wearable fitness trackers, smart home sensor nodes, industrial proximity beacons, and digital weight scales requiring stable component supply and long-term production continuity.
Supply support for IS1870SF-102 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and connectivity solutions for embedded systems.
The IS1870SF-102 belongs to Microchip's Bluetooth Low Energy SoC product line, engineered specifically for ultra-low-power, small-form-factor IoT endpoints where minimal external components and fast certification-ready deployment are essential.
FAQ
What is the maximum transmit power supported by the IS1870SF-102?
The IS1870SF-102 supports programmable transmit output power from −25 dBm (for low-power scanning) up to +3 dBm maximum, with 0 dBm being the typical nominal output level in Bluetooth Low Energy mode. This range is achieved using the integrated RF power amplifier and is validated across the −20°C to +70°C operating temperature range specified for the IS1870SF-102.
Does the IS1870SF-102 require an external crystal oscillator?
Yes, the IS1870SF-102 requires an external 32 MHz fundamental-mode crystal connected to XO_P and XO_N pins for RF timing and system clock generation. While it includes an internal 32 kHz ultra-low-power oscillator for RTC, the 32 MHz crystal is mandatory for Bluetooth 5.0 LE compliance and RF frequency accuracy - a requirement explicitly defined in the IS1870SF-102 datasheet (DS60001371G).
How many ADC channels does the IS1870SF-102 support, and what is their effective resolution?
The IS1870SF-102 supports 16-channel 12-bit sigma-delta ADC with 10-bit effective number of bits (ENOB) in 32 kHz sampling mode. All 16 inputs (AD0–AD15) are mapped to GPIO pins and can be configured simultaneously for battery voltage monitoring, sensor signal acquisition, or temperature sensing - as confirmed in Table 1-1 and Section 2.2.4 of the IS1870SF-102 datasheet.
Can the IS1870SF-102 operate without an external host MCU?
Yes, the IS1870SF-102 supports host-less operation: its embedded 8051 core executes Microchip's Bluetooth Low Energy stack directly from 256 KB Flash, enabling standalone beacon, sensor, or control applications. The default factory firmware configures it for HCI UART mode, but Microchip provides documentation and tools to deploy custom applications entirely on the IS1870SF-102.
What is the thermal pad configuration for the IS1870SF-102 QFN package?
The IS1870SF-102 uses a 48-pin QFN package with an exposed thermal pad centered on the bottom surface. Per Microchip DS60001371G Figure 4-2, the pad must be soldered to a PCB copper pour with ≥60% solder paste coverage using multiple small apertures - not a single large opening - to ensure mechanical reliability and thermal dissipation during reflow (J-STD-020 Class 3 profile).
IS1870SF-102 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v5.0
- Modulation:
- -
- Frequency:
- 2.402GHz ~ 2.48GHz
- Data Rate (Max):
- 921.6kbps
- Power - Output:
- 0dBm
- Sensitivity:
- -90dBm
- Memory Size:
- 256kB Flash, 32kB ROM, 24kB SRAM
- Serial Interfaces:
- ADC, I2C, PWM, SPI, UART
- GPIO:
- 31
- Voltage - Supply:
- 1.9V ~ 3.6V
- Current - Receiving:
- 13mA
- Current - Transmitting:
- 13mA
- Operating Temperature:
- -20°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-QFN (6x6)
IS1870SF-102 FAQ
1.How can I place an order for IS1870SF-102 through Aetrix?
Please submit a Request for Quotation (RFQ) for IS1870SF-102 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IS1870SF-102 reliable?
The price and inventory of IS1870SF-102 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IS1870SF-102 is usually 5 days.
3.What payment methods are accepted for IS1870SF-102?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IS1870SF-102 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IS1870SF-102?
IS1870SF-102 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IS1870SF-102 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IS1870SF-102?
For technical support, including IS1870SF-102 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IS1870SF-102 requirements.
6.How does Aetrix verify that IS1870SF-102 is sourced from the original manufacturer or authorized distributors?
All IS1870SF-102 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IS1870SF-102 meets industry standards.
7.What is the process for return or replacement of IS1870SF-102?
All IS1870SF-102 units undergo pre-shipment inspection (PSI). If there is an issue with IS1870SF-102, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IS1870SF-102 part is unused and in its original packaging.
Return procedure for IS1870SF-102:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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