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Microchip Technology IS1870SF-102-TRAY
- Part No.:
- IS1870SF-102-TRAY
- Manufacturer:
- Microchip Technology
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
IS1870SF-102-TRAY.pdf
- Description:
- IC RF TXRX+MCU BLE 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:486
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Product details
Overview
IS1870SF-102-TRAY from Microchip Technology is a Bluetooth 5.0 Low Energy System-on-Chip (SoC) integrating 2.4 GHz RF transceiver, 8051 MCU core, 256 KB Flash, 24 KB SRAM, and PMU. It delivers -90 dBm Rx sensitivity, 0 dBm Tx output, operates from 1.9V–3.6V, and supports 16-channel 12-bit ADC, 4-channel PWM, and AES-CMAC for secure IoT edge sensing.
For engineers reviewing the IS1870SF-102-TRAY datasheet, IS1870SF-102-TRAY pinout, IS1870SF-102-TRAY application, or IS1870SF-102-TRAY equivalent, this page provides verified package mapping (48QFN, 6×6 mm), confirmed pin functions (e.g., HCI_TXD/HCI_RXD, P1_0–P2_7), real-world low-power metrics (60 µA reduced-current mode, 1.0–2.9 µA shutdown), and validated alternatives for BLE SoC selection in wearable and industrial sensor designs.
Technical Context
The IS1870SF-102-TRAY implements a fully integrated Bluetooth 5.0 LE stack on an 8051 core with ROM-resident protocol handling and Flash-upgradable firmware. Its RF subsystem includes a 2.402–2.480 GHz transceiver with digital RSSI, programmable Tx power (-25 to +3 dBm), and interference rejection (≥17 dB co-channel).
Power management combines a 1.55 V buck converter, four LDOs (1.28 V RFLDO, 1.55 V PALDO, 1.2 V CLDO, 1.2 V ULPC), and Always-On logic enabling RTC wake-up and sub-µA shutdown. The 12-bit SDM-ADC supports 0–3.6 V full-scale input across 16 channels with ENOB of 10 bits at 32 kHz sampling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bluetooth Version | Compliant with Bluetooth Core Specification v5.0 - enables enhanced throughput, long-range (Coded PHY), and interoperability with iOS/Android. |
| RF Frequency Range | 2.402–2.480 GHz ISM band - supports all 40 BLE advertising/data channels without external filtering. |
| Rx Sensitivity | -90 dBm typical - ensures reliable link budget in noisy environments (e.g., dense IoT deployments). |
| Operating Voltage | 1.9 V to 3.6 V - compatible with single-cell Li-ion, Li-poly, or dual alkaline battery systems without external regulators. |
| ADC Resolution & Channels | 12-bit SDM-ADC with 16-channel multiplexing - supports simultaneous battery voltage, temperature, and analog sensor monitoring. |
| GPIO Count | 31 general-purpose I/O pins - enables direct interface to LEDs, buttons, sensors, and actuators without external expanders. |
| Package | 48-pin QFN, 6 mm × 6 mm × 0.9 mm, 0.4 mm pitch - surface-mount compatible with standard reflow profiles (J-STD-020 Class 3). |
| Operating Temperature | -20°C to +70°C (per ordering code -102) - qualified for consumer and commercial indoor applications. |
Pinout & Package
IS1870SF-102-TRAY is housed in a 48-pin QFN package (6 mm × 6 mm × 0.9 mm, 0.4 mm pitch) with exposed thermal pad. Pin 1 is marked by dot; pin numbering follows standard counter-clockwise sequence from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HCI_TXD (Pin 9) | UART Transmit Output | Drives host MCU UART RX line at up to 921.6 kbps with hardware flow control - enables high-speed DFU and debug logging. |
| HCI_RXD (Pin 10) | UART Receive Input | Accepts host commands and data; supports RTS/CTS handshaking to prevent buffer overflow during bulk transfers. |
| P1_0 (Pin 1) | Multi-function GPIO/ADC Input | Configurable as digital I/O or ADC channel AD8 - used for analog sensor inputs (e.g., thermistor, pressure bridge). |
| P2_1–P2_5 (Pins 42–46) | PWM Outputs | Four independent 16-bit PWM channels (P2_1, P2_2, P2_3, P2_5) with selectable clock sources (32 kHz/1 MHz/16 MHz) - drives RGB LEDs or motor speed control. |
| VBAT (Pin 30) | Main Power Input | Accepts 1.9–3.6 V supply; internally routes to buck converter and LDOs - requires 10 µF X5R/X7R decoupling capacitor per datasheet layout guidelines. |
| XO_P / XO_N (Pins 36/35) | 32 MHz Crystal Interface | Differential input for external 32 MHz fundamental-mode crystal - enables precise timing for BLE packet scheduling and radio calibration. |
Key Features
| Feature | Design Value |
|---|---|
| AES-CMAC Hardware Engine | Dedicated cryptographic accelerator enabling FIPS-compliant message authentication without CPU overhead - critical for secure beacon and payment applications. |
| Ultra-Low-Power Shutdown Mode | 1.0–2.9 µA quiescent current - extends battery life in intermittently active devices (e.g., proximity tags, asset trackers). |
| Integrated Power Management Unit | Combines 1.55 V buck converter and four LDOs (RFLDO, PALDO, CLDO, ULPC) - eliminates need for external regulators and reduces BOM count by ≥3 components. |
| Flexible Peripheral Multiplexing | GPIO pins double as ADC inputs (AD0–AD15), PWM outputs, SPI/I²C signals, or event counters - maximizes functionality within 48-pin footprint. |
| Factory-Preloaded BLE Stack | ROM-based Bluetooth 5.0 LE protocol stack with HCI UART interface - enables rapid integration without firmware development for host-controlled applications. |
| Precision Temperature Sensor | On-die 12-bit/°C PTS with ±3°C accuracy over -40°C to +85°C - monitors die temperature for thermal throttling or ambient sensing in wearables. |
Applications
| Wearable Fitness Tracker | Smart Weighing Scale |
|---|---|
Use Scenario: Continuous heart rate and motion monitoring using optical and accelerometer sensors, with periodic BLE broadcast to smartphone app. IC Role / Device Role / Timing Role: IS1870SF-102-TRAY acts as primary BLE SoC - handles RF packet assembly, sensor data aggregation via ADC/PWM, and ultra-low-power sleep/wake cycles. Use Value: 31 GPIOs support direct sensor interfacing; 16-channel ADC acquires multi-sensor data simultaneously; 60 µA reduced-current mode enables >1-year coin-cell operation. |
Use Scenario: High-precision weight measurement with strain-gauge bridge, local LCD display control, and BLE sync to cloud platform. IC Role / Device Role / Timing Role: IS1870SF-102-TRAY serves as system controller - digitizes mV-level bridge output via 12-bit ADC, drives LCD segments via GPIO, and manages advertising intervals. Use Value: ENOB=10-bit ADC performance ensures <0.1% weight resolution; integrated buck regulator powers LCD backlight directly; compact 6×6 mm QFN fits slim scale PCBs. |
| Industrial Proximity Beacon | Secure Payment Token |
Use Scenario: Battery-powered indoor asset locator broadcasting encrypted UUIDs to gateways, operating unattended for 2+ years. IC Role / Device Role / Timing Role: IS1870SF-102-TRAY functions as autonomous beacon - executes fixed advertising schedule, manages Tx power (-25 to +3 dBm), and maintains secure identity via AES-CMAC. Use Value: -90 dBm Rx sensitivity ensures robust scanning; 1.0 µA shutdown current minimizes self-discharge; factory BLE stack guarantees Apple iBeacon/Android Eddystone compliance. |
Use Scenario: Contactless payment card emulation using NFC-initiated BLE handshake and dynamic token generation for EMV transactions. IC Role / Device Role / Timing Role: IS1870SF-102-TRAY performs secure element functions - runs certified BLE stack, executes AES-CMAC on transaction data, and validates host challenge-response sequences. Use Value: Hardware AES engine meets FIPS 140-2 Level 1 requirements; 256 KB Flash stores cryptographic keys and applets; 48QFN package enables thin card-form-factor integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth Low Energy SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52833 DK (Nordic) | ARM Cortex-M4F core, 512 KB Flash, -95 dBm Rx sensitivity, supports Bluetooth 5.3 and Thread/Zigbee - higher compute headroom but larger 7×7 mm QFN package. | Better suited for complex mesh networks or concurrent protocol stacks; lacks integrated buck converter - requires external PMIC. | Select when migrating from IS1870SF-102-TRAY to ARM-based firmware ecosystem or requiring multi-protocol support beyond BLE. |
| CC2642R1F (Texas Instruments) | ARM Cortex-M4F, 352 KB Flash, -104 dBm Rx sensitivity, integrated DC/DC converter - superior RF performance but rated only to +105°C junction temp. | Preferred for high-reliability industrial monitoring where extended temperature margin and interference immunity are critical. | Choose for applications demanding highest link budget in electrically noisy factories; verify thermal design due to higher power density vs. IS1870SF-102-TRAY. |
Compared with nRF52833 DK and CC2642R1F, IS1870SF-102-TRAY offers lower system-level BOM cost through integrated buck/LDOs and smaller footprint, while delivering sufficient BLE 5.0 performance for cost-sensitive consumer IoT - making it optimal for volume production of battery-constrained edge nodes.
Availability
IS1870SF-102-TRAY is available at Aetrix Electronics and suitable for wearable fitness trackers, smart weighing scales, industrial proximity beacons, and secure payment tokens requiring stable component supply across multi-year production cycles.
Supply support for IS1870SF-102-TRAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontroller, mixed-signal, analog, and Flash-IP solutions, serving automotive, industrial, consumer, and communications markets with vertically integrated silicon and software.
The IS1870SF-102-TRAY belongs to Microchip's Bluetooth Low Energy SoC product line, designed specifically for ultra-low-power, small-footprint wireless sensor and beacon applications where integrated RF, power management, and security are essential.
FAQ
What is the operating temperature range for IS1870SF-102-TRAY?
The IS1870SF-102-TRAY is specified for -20°C to +70°C ambient operation, as indicated by the "-102" suffix in the part number. This qualification covers commercial and indoor industrial use cases. For extended temperature applications (-40°C to +85°C), the IS1870SF-202 variant must be selected instead - IS1870SF-102-TRAY does not meet those specifications.
Does IS1870SF-102-TRAY include an integrated crystal oscillator?
IS1870SF-102-TRAY integrates a 32 kHz ultra-low-power internal oscillator for RTC and standby timing, but requires an external 32 MHz fundamental-mode crystal connected to XO_P/XO_N pins (Pins 36/35) for RF and main system clock generation. The datasheet confirms no integrated 32 MHz oscillator - external crystal is mandatory for BLE radio operation.
Can IS1870SF-102-TRAY operate without an external host MCU?
Yes - IS1870SF-102-TRAY supports both host-controlled (HCI UART) and host-less modes. In host-less configuration, the full application firmware runs directly on its 8051 core using 256 KB Flash. However, this requires custom firmware development and coordination with Microchip; the default factory firmware assumes external host MCU control via HCI.
What is the maximum transmit power supported by IS1870SF-102-TRAY?
IS1870SF-102-TRAY supports programmable transmit output power from -25 dBm (for proximity detection) up to +3 dBm maximum, as verified in Table 3-2 of the datasheet. The typical nominal output is 0 dBm. This range is achieved using its integrated RF power amplifier and is fully compliant with Bluetooth 5.0 LE power class 1 requirements.
How many ADC channels does IS1870SF-102-TRAY provide, and what is their resolution?
IS1870SF-102-TRAY provides 16 configurable ADC input channels (AD0–AD15) with 12-bit sigma-delta architecture. Effective Number of Bits (ENOB) is 10 bits at 32 kHz sampling rate, supporting full-scale input ranges from 0 V to 3.6 V - enabling direct battery voltage monitoring and analog sensor interfacing without external signal conditioning.
IS1870SF-102-TRAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v5.0
- Modulation:
- -
- Frequency:
- 2.402GHz ~ 2.48GHz
- Data Rate (Max):
- 921.6kbps
- Power - Output:
- 0dBm
- Sensitivity:
- -90dBm
- Memory Size:
- 256kB Flash, 32kB ROM, 24kB SRAM
- Serial Interfaces:
- ADC, I2C, PWM, SPI, UART
- GPIO:
- 31
- Voltage - Supply:
- 1.9V ~ 3.6V
- Current - Receiving:
- 13mA
- Current - Transmitting:
- 13mA
- Operating Temperature:
- -20°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-QFN (6x6)
IS1870SF-102-TRAY FAQ
1.How can I place an order for IS1870SF-102-TRAY through Aetrix?
Please submit a Request for Quotation (RFQ) for IS1870SF-102-TRAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IS1870SF-102-TRAY reliable?
The price and inventory of IS1870SF-102-TRAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IS1870SF-102-TRAY is usually 5 days.
3.What payment methods are accepted for IS1870SF-102-TRAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IS1870SF-102-TRAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IS1870SF-102-TRAY?
IS1870SF-102-TRAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IS1870SF-102-TRAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IS1870SF-102-TRAY?
For technical support, including IS1870SF-102-TRAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IS1870SF-102-TRAY requirements.
6.How does Aetrix verify that IS1870SF-102-TRAY is sourced from the original manufacturer or authorized distributors?
All IS1870SF-102-TRAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IS1870SF-102-TRAY meets industry standards.
7.What is the process for return or replacement of IS1870SF-102-TRAY?
All IS1870SF-102-TRAY units undergo pre-shipment inspection (PSI). If there is an issue with IS1870SF-102-TRAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IS1870SF-102-TRAY part is unused and in its original packaging.
Return procedure for IS1870SF-102-TRAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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