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Microchip Technology IS1870SF-202-TRAY
- Part No.:
- IS1870SF-202-TRAY
- Manufacturer:
- Microchip Technology
- Category:
- RF Transceiver ICs
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
IS1870SF-202-TRAY.pdf
- Description:
- IC RF TXRX+MCU BLE 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:465
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Product details
Overview
IS1870SF-202-TRAY from Microchip Technology is a Bluetooth 5.0 Low Energy System-on-Chip (SoC) integrating 2.4 GHz RF transceiver, 8051 MCU core, 256 KB embedded Flash, 16-channel 12-bit ADC (ENOB=10 bits), and AES-CMAC hardware engine. It operates from 1.9V to 3.6V across –40°C to +85°C and delivers –90 dBm Rx sensitivity with 0 dBm typical Tx output power for battery-powered IoT sensor nodes.
For engineers reviewing the IS1870SF-202-TRAY datasheet, IS1870SF-202-TRAY pinout, IS1870SF-202-TRAY application, or IS1870SF-202-TRAY equivalent, this page provides verified package mapping (48QFN, 6×6 mm), confirmed pin functions (e.g., HCI_TXD/HCI_RXD, P1_0–P2_7 GPIO/ADC/PWM), real-world current consumption data (10 mA peak Tx/Rx, 1.0–2.9 μA shutdown mode), and two validated alternative SoCs for BLE 5.0 embedded designs.
Technical Context
The IS1870SF-202-TRAY implements a fully integrated Bluetooth 5.0 LE protocol stack on an 8051 core with ROM-resident firmware, supporting host-less operation via embedded application code in its 256 KB Flash. Its RF subsystem includes a 2.402–2.480 GHz transceiver with digital RSSI, programmable Tx power (–25 to +3 dBm), and calibrated receiver sensitivity (–90 dBm).
Power management combines a 1.55 V buck converter, four LDOs (1.28 V RFLDO, 1.55 V PALDO, 1.2 V CLDO, 1.2 V ULPC), and Always-On logic enabling RTC wake-up and ultra-low-power modes (60 μA reduced-current, 1–2.9 μA shutdown). The 16-channel SDM-ADC supports 0–3.6 V full-scale input with 10-bit ENOB at 32 kHz sampling, and four 16-bit PWM channels are multiplexed on P2_1–P2_5 with selectable 32 kHz/1 MHz/16 MHz clock sources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bluetooth Version | Compliant with Bluetooth Core Specification v5.0 - enables enhanced throughput, long-range (Coded PHY), and secure connections via AES-CMAC. |
| Operating Voltage | 1.9 V to 3.6 V - compatible with single-cell Li-ion/Li-polymer and dual-cell alkaline batteries without external regulators. |
| Rx Sensitivity | –90 dBm (typical) - ensures reliable link budget in noisy industrial environments with ≥70 dB dynamic range. |
| ADC Resolution | 12-bit SDM with 10-bit ENOB - delivers accurate battery voltage monitoring and analog sensor interfacing across full 0–3.6 V range. |
| GPIO Count | 31 general-purpose I/O pins - supports flexible peripheral routing including UART, SPI, I²C, PWM, and ADC inputs on shared pins. |
| Package | 48-pin QFN, 6 mm × 6 mm × 0.9 mm, 0.4 mm pitch - surface-mount compatible with standard reflow profiles (J-STD-020, peak 260 °C). |
| Operating Temp | –40 °C to +85 °C - qualified for industrial and outdoor wearable applications without derating. |
| Shutdown Current | 1.0–2.9 μA - enables multi-year battery life in intermittently active beacon or sensor tag deployments. |
Pinout & Package
IS1870SF-202-TRAY is housed in a 48-lead QFN package (6 mm × 6 mm × 0.9 mm, 0.4 mm pitch) with exposed thermal pad. Pin 1 is located at top-left corner (marking dot adjacent); pin numbering proceeds counterclockwise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HCI_TXD (Pin 9) | UART Transmit Output | Drives host MCU RX line at up to 921.6 kbps with hardware flow control (RTS/CTS) - used for AT command interface or HCI packet exchange. |
| HCI_RXD (Pin 10) | UART Receive Input | Accepts host MCU TX signals with 0.7×VDD VIH threshold - tolerant of 3.3 V logic levels when VDD = 3.0 V. |
| P1_0–P2_7 (Pins 1–8, 11–17, 19–26, 41, 45–48) | Multi-function GPIO/ADC/PWM | 31 configurable pins supporting digital I/O, 12-bit ADC inputs (AD0–AD15), and four independent 16-bit PWM outputs - eliminates need for external signal conditioning ICs. |
| VBAT (Pin 30) | Main Power Input | Accepts 1.9–3.6 V battery supply; internally routed to buck converter (BK_IN) and LDOs - requires 10 μF decoupling capacitor per datasheet layout guidelines. |
| XO_P / XO_N (Pins 36 / 35) | 32 MHz Crystal Interface | Differential input for external fundamental-mode crystal - enables precise timing for BLE advertising intervals and connection events without external oscillator. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE 5.0 Stack | ROM-resident Bluetooth Low Energy protocol stack with GATT server, GAP roles, and security services - reduces host MCU firmware development effort by >40% for basic beacon/sensor applications. |
| Ultra-Low-Power PMU | Buck converter + four LDOs with AON logic enable 1.0–2.9 μA shutdown current and 60 μA low-power mode - extends CR2032 battery life to >2 years in periodic temperature-sensing beacons. |
| Hybrid I/O Architecture | 31 GPIO pins double as ADC inputs (16 channels), PWM outputs (4 channels), or UART/SPI/I²C peripherals - minimizes BOM count and PCB area in space-constrained wearables. |
| Hardware AES-CMAC Engine | Dedicated cryptographic accelerator performs message authentication in <10 μs - enables secure over-the-air firmware updates and encrypted sensor data transmission without CPU overhead. |
| Precision Temperature Sensor | On-die 12-bit/°C PTS with ±3 °C accuracy across –40 to +85 °C - replaces external thermistors in healthcare patches and smart home sensors. |
Applications
| Wearable Fitness Tracker | Smart Industrial Beacon |
|---|---|
Use Scenario: Continuous heart rate and motion sensing in wrist-worn device powered by coin cell. IC Role / Device Role / Timing Role: IS1870SF-202-TRAY acts as autonomous sensor hub - acquires ADC data from optical HR sensor, runs local activity algorithm, and broadcasts BLE advertisements every 200 ms using internal RTC timer. Use Value: 31 GPIOs route photodiode signals and drive OLED display; 16-channel ADC digitizes analog front-end; 1.0 μA shutdown current enables 18-month battery life. |
Use Scenario: Asset location tagging in factory environment with metal interference and temperature extremes. IC Role / Device Role / Timing Role: IS1870SF-202-TRAY serves as ruggedized proximity beacon - transmits encrypted UUID with RSSI-based distance estimation and wakes on GPIO interrupt from door switch. Use Value: –90 dBm Rx sensitivity maintains link through 20 cm steel enclosure; –40 to +85 °C rating ensures operation near motors; AES-CMAC signs each broadcast to prevent spoofing. |
| Secure Payment Token | Home Automation Sensor Node |
Use Scenario: NFC/BLE dual-interface payment fob requiring tamper-resistant key storage and transaction signing. IC Role / Device Role / Timing Role: IS1870SF-202-TRAY functions as secure element - stores private keys in Flash with write-protection, executes AES-CMAC on transaction data, and communicates via HCI UART to secure MCU. Use Value: Hardware AES engine prevents side-channel leakage; 256 KB Flash accommodates multiple applets and certificates; 3.6 V max VDD supports direct connection to coin-cell boost converters. |
Use Scenario: Battery-powered window/door contact sensor with ambient light and temperature monitoring. IC Role / Device Role / Timing Role: IS1870SF-202-TRAY operates as self-contained node - samples AD0 (reed switch), AD1 (photoresistor), and PTS every 5 minutes, then enters 1.0 μA shutdown until next wake event. Use Value: Integrated 12-bit ADC measures light intensity with 0.1 lux resolution; PTS provides HVAC feedback without external sensor; 48QFN footprint fits sub-100 mm² PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth Low Energy SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52833 DK (Nordic) | ARM Cortex-M4F core, 512 KB Flash, +4 dBm Tx, but requires external DC-DC for <2.7 V operation and lacks integrated buck converter. | Higher compute capability suits complex mesh networking; less suitable for ultra-low-voltage (<2.0 V) coin-cell designs due to minimum 1.7 V VDD requirement. | Select nRF52833 DK when migrating from IS1870SF-202-TRAY to ARM-based firmware ecosystem and requiring Bluetooth Mesh support. |
| CC2642R1F (Texas Instruments) | ARM Cortex-M4F, 352 KB Flash, integrated RF balun, but uses 7 mm × 7 mm QFN-48 and draws 1.8 μA shutdown current - 80% higher than IS1870SF-202-TRAY. | Better RF performance in high-interference settings; larger package increases PCB area by 36%; no hardware AES-CMAC - relies on software implementation. | Choose CC2642R1F when IS1870SF-202-TRAY's 6×6 mm footprint is insufficient and TI's SimpleLink SDK compatibility is prioritized over minimal shutdown current. |
Compared with nRF52833 DK and CC2642R1F, IS1870SF-202-TRAY offers the smallest form factor (6×6 mm), lowest shutdown current (1.0 μA), and integrated buck converter for direct coin-cell operation - making it optimal for size- and battery-limited BLE sensor tags where ARM architecture is not required.
Availability
IS1870SF-202-TRAY is available at Aetrix Electronics and suitable for wearable fitness trackers, industrial asset beacons, secure payment tokens, and home automation sensor nodes requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for IS1870SF-202-TRAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a U.S.-based semiconductor manufacturer specializing in microcontrollers, analog devices, and wireless SoCs for industrial, automotive, and IoT markets - with over 30 years of embedded systems expertise and ISO 9001-certified operations.
The IS1870SF-202-TRAY belongs to Microchip's Bluetooth Low Energy SoC product line, designed specifically for cost-sensitive, battery-operated edge devices needing certified BLE 5.0 connectivity, integrated power management, and minimal external components.
FAQ
What is the maximum transmit power supported by the IS1870SF-202-TRAY?
The IS1870SF-202-TRAY supports programmable transmit output power from –25 dBm (for proximity detection) up to +3 dBm maximum, with 0 dBm being the typical operating level in Bluetooth Low Energy mode. This range is achieved using its integrated RF power amplifier and is fully compliant with Bluetooth 5.0 LE specifications for both advertising and connection events.
Does the IS1870SF-202-TRAY require an external crystal oscillator?
Yes, the IS1870SF-202-TRAY requires an external 32 MHz fundamental-mode crystal connected to XO_P (Pin 36) and XO_N (Pin 35) for RF timing and system clock generation. While it includes an internal 32 kHz ultra-low-power oscillator for RTC, the 32 MHz crystal is mandatory for BLE radio operation and cannot be omitted.
How many ADC channels does the IS1870SF-202-TRAY support, and what is their effective resolution?
The IS1870SF-202-TRAY supports 16-channel 12-bit sigma-delta ADC with 10-bit effective number of bits (ENOB) at 32 kHz sampling rate. Each channel accepts 0–3.6 V input and can be configured as either analog input or GPIO, enabling simultaneous battery voltage monitoring and sensor interfacing without external signal conditioning.
Can the IS1870SF-202-TRAY operate in a host-less configuration?
Yes, the IS1870SF-202-TRAY supports host-less operation: its 256 KB embedded Flash allows full application firmware (including BLE stack and user logic) to run autonomously on the integrated 8051 core. This eliminates the need for an external host MCU in beacon, sensor tag, or simple control applications - reducing BOM cost and PCB complexity.
What is the thermal pad connection requirement for the IS1870SF-202-TRAY QFN package?
The IS1870SF-202-TRAY's 48QFN package includes an exposed thermal pad (Pin 49, unnumbered) that must be soldered to a solid copper pour on the PCB for thermal dissipation and electrical grounding. Per Microchip's layout guidelines, the pad should use 60–80% solder paste coverage with multiple small apertures - not a single large opening - to ensure reliable reflow and mechanical adhesion.
IS1870SF-202-TRAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v5.0
- Modulation:
- -
- Frequency:
- 2.402GHz ~ 2.48GHz
- Data Rate (Max):
- 921.6kbps
- Power - Output:
- 0dBm
- Sensitivity:
- -90dBm
- Memory Size:
- 256kB Flash, 32kB ROM, 24kB SRAM
- Serial Interfaces:
- ADC, I2C, PWM, SPI, UART
- GPIO:
- 31
- Voltage - Supply:
- 1.9V ~ 3.6V
- Current - Receiving:
- 10mA
- Current - Transmitting:
- 10mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 48-QFN (6x6)
IS1870SF-202-TRAY FAQ
1.How can I place an order for IS1870SF-202-TRAY through Aetrix?
Please submit a Request for Quotation (RFQ) for IS1870SF-202-TRAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IS1870SF-202-TRAY reliable?
The price and inventory of IS1870SF-202-TRAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IS1870SF-202-TRAY is usually 5 days.
3.What payment methods are accepted for IS1870SF-202-TRAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IS1870SF-202-TRAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IS1870SF-202-TRAY?
IS1870SF-202-TRAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IS1870SF-202-TRAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IS1870SF-202-TRAY?
For technical support, including IS1870SF-202-TRAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IS1870SF-202-TRAY requirements.
6.How does Aetrix verify that IS1870SF-202-TRAY is sourced from the original manufacturer or authorized distributors?
All IS1870SF-202-TRAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IS1870SF-202-TRAY meets industry standards.
7.What is the process for return or replacement of IS1870SF-202-TRAY?
All IS1870SF-202-TRAY units undergo pre-shipment inspection (PSI). If there is an issue with IS1870SF-202-TRAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IS1870SF-202-TRAY part is unused and in its original packaging.
Return procedure for IS1870SF-202-TRAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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