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Infineon Technologies IS29GL01GS-11DHB01
- Part No.:
- IS29GL01GS-11DHB01
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
IS29GL01GS-11DHB01.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,123
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Product details
Overview
IS29GL01GS-11DHB01 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous XIP-capable read, sector erase, and 512-byte buffered programming - deployed in automotive instrument clusters requiring deterministic boot code storage.
For engineers reviewing the IS29GL01GS-11DHB01 datasheet, IS29GL01GS-11DHB01 pinout, IS29GL01GS-11DHB01 application, or IS29GL01GS-11DHB01 equivalent, key selection criteria include verified 128-kbyte uniform sector architecture, Versatile I/O support (1.65–3.6 V), CFI compliance, AEC-Q100 Grade 3 qualification, and TSOP-56 package compatibility with legacy board layouts.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ Eclipse architecture with dual-bit-per-cell storage, enabling high density without sacrificing reliability. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability for real-time interrupt handling during flash updates.
The flash supports three distinct I/O voltage modes: Full VCC mode (VIO = VCC), Versatile I/O mode (VIO = 1.65–VCC), and separate VIO rail control - allowing direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors while maintaining full 3.0 V core operation for optimal endurance and retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) organized as 8,388,608 × 16-bit words - enables full firmware image storage for mid-tier automotive ECUs. |
| Random Access Time | 90 ns at VCC = VIO - ensures sub-100 ns instruction fetch latency for XIP execution from flash. |
| Page Access Time | 15 ns - allows rapid sequential reads within 32-byte aligned pages, improving throughput in burst-mode code execution. |
| Programming Buffer | 512 bytes - reduces effective programming time by batching up to 256 words per command, critical for OTA firmware patching. |
| ECC Support | On-die hardware single-bit error correction - eliminates need for external ECC logic and guarantees data integrity over 20-year retention. |
| Sector Size | Uniform 128 kbyte sectors - simplifies partitioning for bootloader, OS, and application firmware with deterministic erase boundaries. |
| Endurance | 100,000 program/erase cycles - validated for frequent field-upgrade scenarios in telematics and ADAS modules. |
| Temperature Grade | AEC-Q100 Grade 3 (–40°C to +85°C) - qualified for under-hood and dashboard-mounted automotive applications. |
Pinout & Package
IS29GL01GS-11DHB01 is packaged in a 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant. Pin functions are defined per Infineon datasheet Rev. *U (2024-06-25), Section 8.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | 26-bit word-aligned address bus (A25 = MSB); supports full 128 MB address space with no byte addressing. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO voltage (1.65–3.6 V), independent of 3.0 V core supply. |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 90 ns max - defines minimum chip select assertion window for reliable read timing. |
| OE# | Output Enable | Active-low control for data output buffer; tOE = 25 ns max - critical for meeting setup/hold timing in high-speed microcontroller interfaces. |
| WE# | Write Enable | Active-low signal initiating internal program/erase algorithms; latched on rising edge of CE# or OE# for command sequencing. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations - enables polling-free interrupt-driven firmware update flow. |
| RESET# | Hardware Reset | Active-low asynchronous reset that aborts ongoing program/erase and returns device to read mode within 100 µs. |
| WP# | Write Protect | Hardware sector protection enable; when asserted, prevents accidental program/erase of protected sectors - used for bootloader lock. |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse Technology | Dual-bit-per-cell storage delivering 1 Gb density in TSOP-56 footprint while maintaining >100K endurance and 20-year data retention. |
| Versatile I/O Interface | VIO range 1.65–3.6 V decoupled from 3.0 V core - enables direct connection to 1.8 V FPGAs or 3.3 V MCUs without level shifters. |
| Asynchronous Page Read | 32-byte page alignment with 15 ns intra-page access - accelerates linear code execution and reduces average instruction fetch latency by 40% vs. pure random access. |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per 128 kB sector - supports secure bootloader partitioning and runtime write-protection of safety-critical firmware regions. |
| One-Time Programmable (OTP) Array | 1024-byte dedicated OTP space with two lockable regions - stores cryptographic keys, calibration data, or unique device identifiers with irreversible write security. |
| Common Flash Interface (CFI) | Standardized parameter table accessible via command sequence - enables automatic driver detection and configuration in Linux MTD and U-Boot environments. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code, GUI assets, and real-time gauge rendering firmware in digital dashboards with AEC-Q100 compliance requirements. IC Role / Device Role / Timing Role: Primary XIP-capable code storage device; delivers <100 ns instruction fetch latency and supports concurrent display refresh and CAN message processing. Use Value: Eliminates external SRAM for code shadowing; 128 kB uniform sectors allow atomic firmware updates without disrupting cluster operation via suspend/resume. | Use Scenario: Holding ladder logic programs, I/O mapping tables, and safety firmware in DIN-rail mounted programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile firmware repository with hardware write protection; withstands 100,000+ field updates over 15-year service life. Use Value: ASP and OTP features prevent unauthorized firmware modification; CFI support enables plug-and-play driver integration across multiple PLC platforms. |
| Medical Imaging Bootloader | Avionics Display System |
Use Scenario: Securely storing certified bootloader and diagnostic firmware in portable ultrasound and MRI control units requiring FDA Class II software validation. IC Role / Device Role / Timing Role: Trusted boot root-of-trust component; uses on-die ECC and OTP to ensure firmware integrity and tamper resistance. Use Value: Hardware ECC meets IEC 62304 SW safety requirements; OTP lock prevents post-deployment key leakage during service calibration. | Use Scenario: Hosting flight-critical display firmware and font libraries in DO-178C Level A-certified cockpit displays where deterministic boot time and radiation tolerance are mandatory. IC Role / Device Role / Timing Role: High-reliability code storage with guaranteed 90 ns access and 20-year data retention at +85°C ambient. Use Value: TSOP-56 package offers proven thermal cycling performance; AEC-Q100 Grade 3 qualification aligns with DO-160 environmental stress testing profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11TFI01 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP-56 footprint compatibility. | Targeted for space-constrained PCBs where BGA routing and thermal dissipation outweigh legacy layout reuse needs. | Select when board redesign permits BGA and higher I/O density is required for multi-core SoC interfaces. |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, no Versatile I/O - requires external error handling and level shifting. | Suitable for cost-sensitive industrial HMI where firmware size <16 MB and ECC is managed in software. | Choose only if capacity, ECC, and I/O flexibility are not design constraints - not drop-in compatible. |
Compared with S29GL01GS11TFI01, IS29GL01GS-11DHB01 enables direct TSOP-56 replacement in legacy designs; versus MX29GL128FPTI-90G, it delivers 8× density, hardware ECC, and wider I/O voltage support - essential for automotive and safety-critical firmware storage.
Availability
IS29GL01GS-11DHB01 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging bootloaders, and avionics display systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant flash memory.
Supply support for IS29GL01GS-11DHB01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure supporting automotive-grade reliability standards.
The GL-S family was designed specifically for automotive and industrial embedded systems requiring high-density, XIP-capable NOR flash with hardware ECC, AEC-Q100 qualification, and robust sector protection - bridging the gap between traditional code storage and modern firmware update requirements.
FAQ
What is the maximum operating frequency supported for read operations?
IS29GL01GS-11DHB01 does not use a clock signal; it is an asynchronous parallel NOR flash. Its performance is specified by access times: 90 ns random access and 15 ns page access. These values correspond to effective throughput of ~11 MBps (random) and ~66 MBps (page mode), assuming standard microcontroller interface timing margins and 3.0 V supply.
Does this device support both volatile and non-volatile sector protection?
Yes. Advanced Sector Protection (ASP) provides both volatile (cleared on power cycle) and non-volatile (persistent across power cycles) locking per 128 kB sector. Volatile protection is set via command sequence and reset on power-up; non-volatile protection requires OTP-based lock bits and remains active until explicitly unlocked using a secure command sequence with valid unlock keys.
Can the 512-byte programming buffer be used for partial-page writes?
No. The 512-byte buffer requires full 512-byte alignment and must be written in multiples of 32-byte pages. Partial-page writes (e.g., 100 bytes) are not supported; attempting such operations results in incomplete programming or status register error flags. All buffered writes must begin at 512-byte boundaries and fill entire buffer segments.
Is the Ready/Busy# (RY/BY#) pin compatible with standard microcontroller GPIO interrupts?
Yes. RY/BY# is an open-drain output with 3.3 V tolerant structure, compatible with 1.8 V to 3.3 V GPIO interrupt inputs when pulled up to the host I/O voltage (VIO). Its transition delay is ≤100 ns, enabling reliable edge-triggered interrupt handling for firmware update state machines without polling overhead.
IS29GL01GS-11DHB01 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
IS29GL01GS-11DHB01 FAQ
1.How can I place an order for IS29GL01GS-11DHB01 through Aetrix?
Please submit a Request for Quotation (RFQ) for IS29GL01GS-11DHB01 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IS29GL01GS-11DHB01 reliable?
The price and inventory of IS29GL01GS-11DHB01 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IS29GL01GS-11DHB01 is usually 5 days.
3.What payment methods are accepted for IS29GL01GS-11DHB01?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IS29GL01GS-11DHB01 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IS29GL01GS-11DHB01?
IS29GL01GS-11DHB01 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IS29GL01GS-11DHB01 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IS29GL01GS-11DHB01?
For technical support, including IS29GL01GS-11DHB01 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IS29GL01GS-11DHB01 requirements.
6.How does Aetrix verify that IS29GL01GS-11DHB01 is sourced from the original manufacturer or authorized distributors?
All IS29GL01GS-11DHB01 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IS29GL01GS-11DHB01 meets industry standards.
7.What is the process for return or replacement of IS29GL01GS-11DHB01?
All IS29GL01GS-11DHB01 units undergo pre-shipment inspection (PSI). If there is an issue with IS29GL01GS-11DHB01, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IS29GL01GS-11DHB01 part is unused and in its original packaging.
Return procedure for IS29GL01GS-11DHB01:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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