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Infineon Technologies IS29GL128S-10TFV01

Part No.:
IS29GL128S-10TFV01
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixIS29GL128S-10TFV01.pdf
Description:
IC FLASH 128MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,644

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Product details

Overview

IS29GL128S-10TFV01 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sectors, and a 512-byte programming buffer-enabling fast embedded code storage and firmware updates in microcontroller boot loaders.

For engineers reviewing the IS29GL128S-10TFV01 datasheet, IS29GL128S-10TFV01 pinout, IS29GL128S-10TFV01 application, or IS29GL128S-10TFV01 equivalent, key selection criteria include asynchronous read timing, Versatile I/O voltage range (1.65 V to VCC), sector erase endurance (100,000 cycles), OTP array support, and CFI-compliant interface compatibility with legacy NOR-based boot architectures.

Technical Context

This device implements an asynchronous parallel NOR flash architecture with XIP-capable random and page-mode reads. Its embedded algorithm controller handles program/erase operations autonomously, while internal hardware ECC corrects single-bit errors on-the-fly during read cycles without host intervention.

The 128-kbyte uniform sector layout supports fine-grained firmware partitioning, and the 512-byte write buffer enables burst programming at up to 1.5 MBps. Sector protection includes volatile and non-volatile lock bits per sector, plus a dedicated 1024-byte OTP array with two independently lockable regions for secure configuration or calibration data.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density128 Mb (16 MB); supports full firmware image storage for mid-tier microcontrollers
Interface typeAsynchronous parallel ×16 bus; requires no clock signal, compatible with legacy ARM Cortex-M3/M4 boot ROM interfaces
Random access time90 ns at VCC = VIO; enables direct execution of code from flash with minimal wait states
Page access time15 ns; allows rapid sequential reads within 32-byte aligned pages for tight loops or constant tables
Erase endurance100,000 program/erase cycles per sector; suitable for field-upgradable firmware with infrequent rewrites
Data retention20 years at +85°C; ensures long-term reliability in unattended industrial control systems
Operating voltageVCC = 2.7 V to 3.6 V; single-supply operation simplifies power design versus dual-rail NOR flash
I/O voltage rangeVIO = 1.65 V to VCC; supports interfacing with 1.8 V or 3.3 V logic without level shifters

Pinout & Package

IS29GL128S-10TFV01 is packaged in a 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch) with bottom-side thermal pad. This package supports high-density PCB layouts and improved thermal dissipation over TSOP variants.

Pin/TerminalCircuit RoleDesign Meaning
A0–A22Address inputs23-bit word address bus (AMAX = A22); supports full 128 Mb addressing with word-aligned access only
DQ0–DQ15Data I/O16-bit bidirectional data bus; operates at VIO voltage, enabling mixed-voltage system integration
CE#Chip enableActive-low chip select; controls device activation and reduces standby current to 100 µA when deasserted
OE#Output enableActive-low read strobe; gates output drivers to prevent bus contention during shared-memory access
WE#Write enableActive-low control for write/program operations; latches command sequences into internal state machine
RY/BY#Ready/Busy indicatorOpen-drain status flag; low during embedded program/erase, high when ready for next command
RESET#Hardware resetActive-low asynchronous reset; forces device into known state and aborts ongoing operations
WP#Write protectHardware sector lock override; disables program/erase when asserted, independent of software protection

Key Features

FeatureDesign Value
Hardware ECC engineSingle-bit error correction on every read cycle-eliminates need for external error-handling firmware overhead
512-byte programming bufferEnables 1.5 MBps effective write speed; reduces host CPU involvement during firmware updates
Uniform 128-kbyte sectorsAllows deterministic partitioning of boot code, application, and parameter storage with consistent erase granularity
1024-byte OTP arrayTwo lockable regions store immutable calibration data or security keys-prevents accidental or malicious overwrite
Common Flash Interface (CFI)Standardized query table enables automatic driver detection and configuration in RTOS or bootloader environments

Applications

Industrial PLC Firmware StorageAutomotive Instrument Cluster Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with field upgrade capability.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support and deterministic 90 ns read latency.

Use Value: Enables zero-wait-state execution of safety-critical ladder logic routines while supporting secure over-the-air firmware patches via sector-level erase.

Use Scenario: Holding calibrated display graphics, gauge configurations, and boot-time diagnostics in automotive digital instrument clusters.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified boot memory interfaced directly to MCU's external memory bus.

Use Value: Guarantees 20-year data retention at +85°C cabin temperatures and withstands 100,000 reprogramming cycles during vehicle lifetime calibration updates.

Medical Diagnostic Device Parameter StorageNetwork Router Boot Image Repository

Use Scenario: Retaining sensor calibration coefficients, user preferences, and regulatory audit logs in portable ultrasound or ECG units.

IC Role / Device Role / Timing Role: Secure, sector-protected non-volatile storage with OTP-backed calibration constants.

Use Value: Prevents unauthorized modification of FDA-required calibration data using hardware WP# and non-volatile sector locks.

Use Scenario: Hosting primary and fallback U-Boot images and Linux kernel binaries in enterprise-grade wired/wireless routers.

IC Role / Device Role / Timing Role: High-reliability parallel NOR flash with CFI support for automatic bootloader initialization.

Use Value: Ensures fail-safe dual-image boot capability with atomic sector erase-no risk of partial corruption during power loss during update.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL128S10TFV01Same die, identical electrical specs; differs only in Infineon's internal part numbering convention (no 'IS' prefix)No functional difference; used interchangeably in production by Infineon-authorized distributorsSelect based on procurement channel availability-both meet identical AEC-Q100 Grade 3 requirements
MX29GL128FPTI-90G90 ns access, but lacks hardware ECC and OTP array; uses different command set and CFI structureRequires host-side error handling and external OTP emulation; less suitable for safety-critical or calibration-sensitive useChoose only if cost sensitivity outweighs ECC/OTP requirements and firmware can be adapted to Macronix command protocol

Compared with S29GL128S10TFV01, IS29GL128S-10TFV01 offers identical functionality and qualification-while MX29GL128FPTI-90G trades ECC and OTP for lower unit cost but increases host software complexity and reduces data integrity assurance.

Availability

IS29GL128S-10TFV01 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic device parameter storage requiring stable component supply across extended product lifecycles.

Supply support for IS29GL128S-10TFV01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring XIP-capable NOR flash with enhanced data integrity, extended temperature operation, and automotive qualification-designed specifically for boot code, firmware, and secure configuration storage.

FAQ

Does IS29GL128S-10TFV01 support execute-in-place (XIP) operation?

Yes. The device supports true XIP with 90 ns random access time and 15 ns page-mode reads, allowing microcontrollers to fetch and execute instructions directly from flash without copying to RAM. Its asynchronous interface and deterministic timing comply with ARM AMBA and legacy bus protocols for seamless integration into boot ROM subsystems.

What is the purpose of the 1024-byte OTP array?

The OTP array contains two independently lockable 512-byte regions used to store immutable data such as factory calibration coefficients, cryptographic keys, or regulatory compliance identifiers. Once locked via dedicated commands, contents cannot be erased or rewritten-even with full device unlock-ensuring permanent integrity of critical system parameters.

How does hardware ECC function during normal read operations?

Hardware ECC runs transparently on every read access: the device automatically detects and corrects single-bit errors in real time using internal syndrome calculation and bit-flip correction logic. No host intervention or additional read cycles are required, and corrected data is delivered to the bus while uncorrectable multi-bit errors trigger status register flags for host exception handling.

Can IS29GL128S-10TFV01 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC, enabling direct connection to 1.8 V logic families (e.g., FPGA I/O banks or low-voltage MCUs) while maintaining 3.3 V core operation. This eliminates external level shifters and reduces BOM count and board area in mixed-voltage embedded systems.

IS29GL128S-10TFV01 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

IS29GL128S-10TFV01 FAQ

1.How can I place an order for IS29GL128S-10TFV01 through Aetrix?

Please submit a Request for Quotation (RFQ) for IS29GL128S-10TFV01 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IS29GL128S-10TFV01 reliable?

The price and inventory of IS29GL128S-10TFV01 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IS29GL128S-10TFV01 is usually 5 days.

3.What payment methods are accepted for IS29GL128S-10TFV01?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IS29GL128S-10TFV01 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IS29GL128S-10TFV01?

IS29GL128S-10TFV01 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IS29GL128S-10TFV01 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IS29GL128S-10TFV01?

For technical support, including IS29GL128S-10TFV01 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IS29GL128S-10TFV01 requirements.

6.How does Aetrix verify that IS29GL128S-10TFV01 is sourced from the original manufacturer or authorized distributors?

All IS29GL128S-10TFV01 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IS29GL128S-10TFV01 meets industry standards.

7.What is the process for return or replacement of IS29GL128S-10TFV01?

All IS29GL128S-10TFV01 units undergo pre-shipment inspection (PSI). If there is an issue with IS29GL128S-10TFV01, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IS29GL128S-10TFV01 part is unused and in its original packaging.

Return procedure for IS29GL128S-10TFV01:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IS29GL128S-10TFV01 Tags

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