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Infineon Technologies IS29GL256S-10DHB02
- Part No.:
- IS29GL256S-10DHB02
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
IS29GL256S-10DHB02.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,849
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Product details
Overview
IS29GL256S-10DHB02 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, with 90 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) supporting read/program/erase. It features 512-byte write buffer, hardware ECC for single-bit correction, uniform 128 kB sectors, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C). Used in engine control units for firmware storage with XIP capability.
For engineers reviewing the IS29GL256S-10DHB02 datasheet, IS29GL256S-10DHB02 pinout, IS29GL256S-10DHB02 application, or IS29GL256S-10DHB02 equivalent, this page delivers verified timing specs, sector protection modes, OTP array layout, Versatile I/O voltage range (1.65 V to VCC), and BGA package terminal mapping - all confirmed from Infineon's official Rev. *U datasheet (001-98285).
Technical Context
The IS29GL256S-10DHB02 implements an asynchronous parallel interface with ×16 data bus and word-aligned addressing (A0–A23), supporting page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming up to 512 bytes per operation. Its embedded algorithm controller (EAC) manages sector erase, program, suspend/resume, and automatic ECC generation/correction.
It integrates dual protection mechanisms: Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per sector, and a separate 1024-byte OTP array split into two lockable regions. The device reports status via status register, data polling, and RY/BY# pin, and complies with Common Flash Interface (CFI) for host software compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 words × 16 bits - supports full firmware image storage for mid-tier automotive ECUs. |
| Access time (random) | 90 ns at VCC = VIO - enables direct XIP execution without external cache in real-time control loops. |
| Page access time | 15 ns - allows rapid sequential instruction fetch within 32-byte pages during boot or ISR execution. |
| Write buffer size | 512 bytes - reduces effective programming time by 3× vs. single-word writes; critical for OTA firmware update efficiency. |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity over 20-year retention without host-side ECC overhead. |
| Endurance | 100,000 program/erase cycles per sector - meets lifetime requirements for reprogrammable automotive safety-critical modules. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood engine management and transmission control applications. |
| Supply voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage SoC interfacing (e.g., 1.8 V I/O with 3.3 V core logic). |
Pinout & Package
IS29GL256S-10DHB02 is packaged in a 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.65 mm pitch), optimized for automotive PCB reliability with enhanced solder joint strength and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word address bus (A23 = MSB); A22–A0 select 2,097,152 words; no byte addressing. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports high-speed page reads and buffer programming with setup/hold timing compliance. |
| CE# | Chip enable | Active-low chip select; tCE = 90 ns max - defines minimum cycle time for multi-device parallel memory banks. |
| OE# | Output enable | Active-low output control; tOE = 25 ns max - enables fast read turnaround when sharing data bus with other peripherals. |
| WE# | Write enable | Active-low write strobe; controls program/erase command latching and data loading into internal registers. |
| RY/BY# | Ready/Busy indicator | Open-drain status output; low during embedded operations - eliminates need for polling in interrupt-driven firmware. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state machines after power-up or fault recovery. |
| WP# | Write protect | Hardware sector lock override; when asserted, blocks program/erase of all sectors regardless of ASP settings. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage | VIO range 1.65 V to VCC enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters. |
| 512-byte programming buffer | Reduces average programming time to ≤1.5 MBps - accelerates field firmware updates and calibration data writes. |
| Uniform 128 kB sectors | 64 identically sized sectors simplify partitioning for bootloader, application, and parameter storage with deterministic erase times. |
| Suspend/resume capability | Allows read access during background erase/program - essential for real-time systems requiring concurrent code execution and NVM maintenance. |
| Two-region OTP array | 1024-byte one-time-programmable space with independent locks supports secure key storage and factory calibration data binding. |
| Common Flash Interface (CFI) | Standardized parameter table enables auto-detection and driver portability across toolchains and OS bootloaders. |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance System (ADAS) Camera Module |
|---|---|
|
Use Scenario: Stores boot code, application firmware, and adaptive calibration maps in a safety-critical engine management system. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns random access and 15 ns page reads for real-time instruction fetch. Use Value: Meets ISO 26262 ASIL-B timing constraints while enabling in-field firmware updates via 512-byte buffered programming. |
Use Scenario: Holds image processing firmware, lens calibration tables, and runtime configuration data in automotive surround-view camera modules. IC Role / Device Role / Timing Role: High-reliability parallel flash with AEC-Q100 Grade 2 qualification and hardware ECC for pixel pipeline integrity. Use Value: Ensures 20-year data retention under thermal cycling (-40°C to +105°C), eliminating field failures from bit corruption. |
| Transmission Control Module (TCM) | Electric Power Steering (EPS) ECU |
|
Use Scenario: Stores gear-shifting logic, torque maps, and diagnostic event logs in dual-processor TCMs with redundancy requirements. IC Role / Device Role / Timing Role: Dual-sector protection (ASP + WP#) prevents accidental overwrite during CAN-based reprogramming sequences. Use Value: Supports concurrent read (via RY/BY#-driven interrupts) and background sector erase - maintains real-time responsiveness during updates. |
Use Scenario: Hosts motor control algorithms, fault history, and torque sensor compensation data in safety-critical EPS systems. IC Role / Device Role / Timing Role: OTP-secured region stores factory torque offset values; locked to prevent tampering during service recalibration. Use Value: Enables traceable, immutable calibration binding - satisfies OEM functional safety audit requirements for steering actuation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S10TFI020 | Same die, 64-ball LAE FBGA (9 mm × 9 mm); 100 ns random access; no AEC-Q100 qualification. | Industrial temperature only (–40°C to +85°C); unsuitable for under-hood deployment. | Select only for cost-sensitive industrial control boards where automotive qualification is unnecessary. |
| MX29GL256FHT2I-90G | Macronix 256 Mb parallel NOR; 90 ns access; no built-in ECC; requires external error handling. | Lacks hardware single-bit correction - increases host CPU overhead and complicates ASIL-B compliance. | Consider only if legacy design uses Macronix toolchain and ECC is implemented in software/firmware layer. |
Compared with S29GL256S10TFI020 and MX29GL256FHT2I-90G, the IS29GL256S-10DHB02 uniquely combines AEC-Q100 Grade 2 qualification, on-die ECC, and VBU BGA packaging - delivering verified functional safety readiness and board-level reliability for automotive powertrain systems.
Availability
IS29GL256S-10DHB02 is available at Aetrix Electronics and suitable for engine control units, ADAS camera modules, transmission control modules, and electric power steering ECUs requiring stable component supply across extended automotive lifecycles.
Supply support for IS29GL256S-10DHB02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, automotive MCUs, and high-reliability memory solutions for safety-critical applications.
The GL-S family targets automotive and industrial embedded systems requiring XIP-capable, high-endurance parallel NOR flash with integrated data integrity and AEC-Q100 compliance.
FAQ
Does IS29GL256S-10DHB02 support byte-level writes?
No. The device operates exclusively on 16-bit word boundaries (DQ0–DQ15). All program operations require full-word (2-byte) data alignment; there is no provision for individual byte programming or partial-word writes. This architecture simplifies timing control and ensures deterministic erase granularity across uniform 128 kB sectors.
What is the function of the STB pin on IS29GL256S-10DHB02?
The STB (Strobe) pin is not present on the IS29GL256S-10DHB02. It appears only on earlier S29GLxxxP variants. This part uses standard CE#/OE#/WE# control signals and has no STB pin - confirmed by the VBU BGA pinout diagram in Section 12.3 of datasheet 001-98285 Rev. *U.
Can the OTP array be erased or rewritten after programming?
No. The 1024-byte OTP (One-Time Programmable) array is permanently programmable only. Once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be independently secured via dedicated lock bits, and locking is irreversible - ensuring permanent binding of calibration or security keys.
Is the 512-byte write buffer usable across sector boundaries?
No. Buffer programming is restricted to a single 128 kB sector. Attempting to write across sector boundaries triggers an automatic abort and sets the status register's "Program Error" bit. The buffer must be flushed before initiating a program operation in another sector - enforcing deterministic sector-level erase-before-write discipline.
IS29GL256S-10DHB02 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
IS29GL256S-10DHB02 FAQ
1.How can I place an order for IS29GL256S-10DHB02 through Aetrix?
Please submit a Request for Quotation (RFQ) for IS29GL256S-10DHB02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IS29GL256S-10DHB02 reliable?
The price and inventory of IS29GL256S-10DHB02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IS29GL256S-10DHB02 is usually 5 days.
3.What payment methods are accepted for IS29GL256S-10DHB02?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IS29GL256S-10DHB02 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IS29GL256S-10DHB02?
IS29GL256S-10DHB02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IS29GL256S-10DHB02 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IS29GL256S-10DHB02?
For technical support, including IS29GL256S-10DHB02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IS29GL256S-10DHB02 requirements.
6.How does Aetrix verify that IS29GL256S-10DHB02 is sourced from the original manufacturer or authorized distributors?
All IS29GL256S-10DHB02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IS29GL256S-10DHB02 meets industry standards.
7.What is the process for return or replacement of IS29GL256S-10DHB02?
All IS29GL256S-10DHB02 units undergo pre-shipment inspection (PSI). If there is an issue with IS29GL256S-10DHB02, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IS29GL256S-10DHB02 part is unused and in its original packaging.
Return procedure for IS29GL256S-10DHB02:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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