My Inquiry
My Account
Infineon Technologies IS29GL256S-10DHB02-TR
- Part No.:
- IS29GL256S-10DHB02-TR
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
IS29GL256S-10DHB02-TR.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,313
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IS29GL256S-10DHB02-TR from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory with 3.0 V core supply, 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +85°C (industrial grade) and supports sector erase of uniform 128-kbyte blocks in embedded boot code storage applications.
For engineers reviewing the IS29GL256S-10DHB02-TR datasheet, IS29GL256S-10DHB02-TR pinout, IS29GL256S-10DHB02-TR application, or IS29GL256S-10DHB02-TR equivalent, key selection criteria include its 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V–VCC), OTP array with dual lockable regions, and AEC-Q100 Grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via RY/BY#, data polling, or status register.
The MIRRORBIT™ Eclipse architecture on 65 nm process enables high endurance (100,000 cycles) and 20-year data retention. Internal hardware ECC operates transparently during read operations, correcting single-bit errors without software intervention or latency penalty.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full boot image storage for mid-complexity microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables deterministic XIP execution timing in real-time systems |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages for firmware hot-path acceleration |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| Erase Block Size | 128 kbytes uniform sectors; simplifies firmware update partitioning and wear leveling design |
| Endurance / Retention | 100,000 program/erase cycles / 20 years; validated for industrial lifecycle requirements |
| I/O Voltage Range | VIO = 1.65 V to VCC; permits direct interfacing with 1.8 V or 3.3 V logic without level shifters |
Pinout & Package
IS29GL256S-10DHB02-TR is packaged in a 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.65 mm pitch), optimized for space-constrained industrial and automotive PCBs. The package supports reflow soldering and provides robust mechanical reliability under thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit word-aligned address bus; A23 selects highest 128-kbyte sector (max address = 0x1FFFFFF) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and automatic endian handling |
| CE# | Chip Enable | Active-low chip select; controls device power state and enables multi-chip memory expansion |
| OE# | Output Enable | Active-low read strobe; gates output drivers to prevent bus contention during shared-memory access |
| WE# | Write Enable | Active-low write strobe; initiates internal program/erase commands when combined with address/data sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, used for hardware flow control |
| RESET# | Hardware Reset | Active-low asynchronous reset; aborts ongoing operations and returns device to known initial state |
| WP# | Write Protect | Hardware sector protection enable; disables program/erase when asserted, independent of software locks |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | Single-bit error correction performed automatically on every read; eliminates need for external error-handling firmware |
| 512-byte Programming Buffer | Enables 1.5 MBps effective write speed; cuts firmware update time vs. byte-by-byte programming |
| Suspend/Resume Capability | Allows interruption of erase or program operations to service higher-priority reads; critical for real-time response |
| OTP Array with Dual Lock Regions | 1024-byte one-time-programmable area segmented into two independently lockable zones for secure key or calibration storage |
| Advanced Sector Protection (ASP) | Combines volatile (SRAM-based) and non-volatile (flash-based) locking per sector; supports field-upgradable protection schemes |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency. Use Value: Ensures deterministic startup timing and immunity to power loss during field updates due to sector erase granularity and hardware ECC. | Use Scenario: Holding boot code and configuration data for radar processing units requiring AEC-Q100 Grade 3 compliance. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +85°C operation and OTP for calibration constants. Use Value: Meets functional safety requirements via built-in ECC and supports secure field updates using dual-lock OTP regions. |
| Medical Imaging System BIOS | Telecom Base Station Control |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in diagnostic imaging equipment with strict data integrity mandates. IC Role / Device Role / Timing Role: High-reliability firmware storage with 20-year data retention and 100,000-cycle endurance. Use Value: Eliminates periodic refresh cycles and reduces maintenance overhead through verified long-term bit stability. | Use Scenario: Storing control plane firmware and patch tables in carrier-grade baseband units operating in telecom infrastructure racks. IC Role / Device Role / Timing Role: Parallel interface flash enabling fast boot and hot-swap firmware reload via CE#/OE# handshaking. Use Value: Supports zero-downtime upgrades using suspend/resume during active traffic, minimizing service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S10TFI020 | Same die, 56-pin TSOP package; no BGA mechanical footprint compatibility | Limited to board-level space where BGA is not feasible; lacks VBU's thermal performance | Select for legacy PCB designs or prototyping with socketed interfaces |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access but no integrated hardware ECC or OTP array | Requires external error management; unsuitable for safety-critical or secure key storage use cases | Select only when cost sensitivity outweighs ECC and security requirements |
Compared with S29GL256S10TFI020 and MX29GL256FHT2I-90G, IS29GL256S-10DHB02-TR uniquely delivers BGA reliability, hardware ECC, and dual-lock OTP in a single industrial-grade package-enabling safer, smaller, and more maintainable embedded firmware architectures.
Availability
IS29GL256S-10DHB02-TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for IS29GL256S-10DHB02-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing XIP-capable flash with enhanced data integrity, offering MIRRORBIT™ Eclipse technology for density, speed, and endurance in industrial and automotive applications.
FAQ
Does IS29GL256S-10DHB02-TR support execute-in-place (XIP) operation?
Yes. It supports true XIP with ≤90 ns random access time and page-mode reads (15 ns), enabling direct CPU instruction fetch from flash without copying to RAM. The 32-byte page alignment and asynchronous interface ensure deterministic timing for real-time interrupt response.
What is the function of the VBU package's fortified construction?
The VBU Fortified BGA uses enhanced mold compound and substrate design to improve resistance to mechanical stress and thermal cycling. This meets IPC/JEDEC standards for automotive and industrial environments, reducing risk of solder joint fatigue in vibration-prone applications.
How does the OTP array differ from standard flash sectors?
The 1024-byte OTP array is physically separate from main memory, with two independent lock bits allowing permanent write-protection of each 512-byte region. Once locked, contents cannot be erased or rewritten-even with high-voltage commands-ensuring immutable storage of keys or calibration data.
Can IS29GL256S-10DHB02-TR operate with mixed VCC and VIO voltages?
Yes. It supports Versatile I/O: VCC may be 3.3 V while VIO is set to 1.8 V (within 1.65 V–VCC range), enabling direct connection to low-voltage FPGAs or ASICs without external level shifters-reducing BOM count and signal integrity complexity.
IS29GL256S-10DHB02-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
IS29GL256S-10DHB02-TR FAQ
1.How can I place an order for IS29GL256S-10DHB02-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for IS29GL256S-10DHB02-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IS29GL256S-10DHB02-TR reliable?
The price and inventory of IS29GL256S-10DHB02-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IS29GL256S-10DHB02-TR is usually 5 days.
3.What payment methods are accepted for IS29GL256S-10DHB02-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IS29GL256S-10DHB02-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IS29GL256S-10DHB02-TR?
IS29GL256S-10DHB02-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IS29GL256S-10DHB02-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IS29GL256S-10DHB02-TR?
For technical support, including IS29GL256S-10DHB02-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IS29GL256S-10DHB02-TR requirements.
6.How does Aetrix verify that IS29GL256S-10DHB02-TR is sourced from the original manufacturer or authorized distributors?
All IS29GL256S-10DHB02-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IS29GL256S-10DHB02-TR meets industry standards.
7.What is the process for return or replacement of IS29GL256S-10DHB02-TR?
All IS29GL256S-10DHB02-TR units undergo pre-shipment inspection (PSI). If there is an issue with IS29GL256S-10DHB02-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IS29GL256S-10DHB02-TR part is unused and in its original packaging.
Return procedure for IS29GL256S-10DHB02-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IS29GL256S-10DHB02-TR Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
