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Infineon Technologies IS29GL256S-10TFV01
- Part No.:
- IS29GL256S-10TFV01
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
IS29GL256S-10TFV01.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,021
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Product details
Overview
IS29GL256S-10TFV01 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous XIP-capable read, sector erase, and 512-byte buffered programming in embedded boot code storage applications.
For engineers reviewing the IS29GL256S-10TFV01 datasheet, IS29GL256S-10TFV01 pinout, IS29GL256S-10TFV01 application, or IS29GL256S-10TFV01 equivalent, this device delivers deterministic timing for boot ROM replacement, firmware update storage, and real-time OS image retention where fast random read, sector-level erase control, and on-die ECC are required.
Technical Context
The IS29GL256S-10TFV01 implements a MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous bit-line sensing for higher density and lower power. Its embedded algorithm controller (EAC) manages autonomous program/erase operations using command sequences compliant with Common Flash Interface (CFI) v1.4.
It supports three status monitoring methods-status register polling, data polling, and RY/BY# pin assertion-and features versatile I/O (VIO = 1.65 V to VCC) for mixed-voltage system interfacing. Sector protection includes volatile/non-volatile lock bits per 128 kB sector and a dedicated 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full boot image storage for mid-complexity microcontrollers. |
| Random Access Time | 90 ns at VCC = VIO; enables direct XIP execution without wait states in 5 MHz bus systems. |
| Page Access Time | 15 ns; allows burst reads within 32-byte aligned pages for sequential instruction fetch. |
| Programming Buffer | 512 bytes; reduces effective programming time by >3× vs. single-word writes. |
| ECC Support | On-die hardware single-bit error correction; eliminates need for external ECC logic or software overhead. |
| Endurance & Retention | 100,000 program/erase cycles and 20-year data retention; suitable for field-updatable firmware with infrequent rewrites. |
| Operating Temp | –40°C to +85°C (Industrial grade); validated for use in industrial PLCs and network edge controllers. |
Pinout & Package
IS29GL256S-10TFV01 is packaged in a 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), optimized for high-density PCB layouts and thermal reliability in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit address bus supporting 8-Mword (16-bit) addressing space; A22 is MSB for 256 Mb density. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-aligned reads/writes and CFI query mode. |
| CE# | Chip Enable | Active-low chip select; controls device activation during memory-mapped bus transactions. |
| OE# | Output Enable | Active-low read strobe; gates output drivers during asynchronous read cycles. |
| WE# | Write Enable | Active-low write strobe; initiates command latching or data programming on rising edge. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded program/erase, high when ready. |
| RESET# | Hardware Reset | Active-low asynchronous reset; aborts ongoing operations and returns device to read mode. |
| VCC | Core Supply | 3.0 V core voltage (2.7–3.6 V); powers internal logic, charge pumps, and ECC engine. |
| VIO | I/O Supply | Independent I/O voltage (1.65–VCC); enables interface to 1.8 V or 3.3 V host processors. |
| WP# | Write Protect | Hardware sector protection enable; disables program/erase when asserted low. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page cycle time enables efficient instruction streaming. |
| 512-Byte Programming Buffer | Reduces average programming time to ≤340 µs per buffer fill, accelerating firmware updates. |
| Hardware ECC Engine | Single-bit correction with no CPU intervention; maintains data integrity without software overhead. |
| Uniform 128-kB Sectors | 64 identical sectors simplify partitioning for bootloader, kernel, and application firmware images. |
| Advanced Sector Protection | Volatile/non-volatile lock bits per sector prevent accidental erase during field upgrades or debug sessions. |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot ROM |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with periodic field updates. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch and sector-protected firmware update storage. Use Value: 90 ns random access ensures deterministic startup timing; 128 kB uniform sectors allow atomic firmware patching without corrupting active runtime code. | Use Scenario: Holding calibrated display firmware and safety-critical boot code in automotive digital instrument clusters (AEC-Q100 Grade 3). IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash serving as primary boot ROM with hardware write protection and ECC. Use Value: On-die ECC meets ASIL-B data integrity requirements; –40°C to +85°C operation ensures reliability across vehicle cabin temperature extremes. |
| Network Edge Router Configuration | Medical Diagnostic Imaging Boot Image |
Use Scenario: Storing configuration tables, routing tables, and fail-safe recovery images in carrier-grade edge routers. IC Role / Device Role / Timing Role: High-reliability firmware storage with suspend/resume capability for zero-downtime updates. Use Value: Program/erase suspend allows background configuration reload while maintaining packet forwarding latency. | Use Scenario: Hosting boot firmware and calibration data for FDA-cleared medical imaging devices requiring long-term data retention. IC Role / Device Role / Timing Role: Certified non-volatile memory for critical boot sequence with 20-year data retention guarantee. Use Value: 100,000 erase cycles support lifetime field recalibration; OTP region stores immutable device serial and calibration keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFI01 | Same density and pinout, but uses older 90 nm process; 110 ns random access vs. 90 ns. | Lacks hardware ECC and Versatile I/O; requires external voltage translation for 1.8 V hosts. | Select only if legacy design reuse or cost sensitivity outweighs ECC and timing advantages. |
| MX29GL256FHT2I-90G | Macronix part with 90 ns access, but no on-die ECC; relies on host-side error handling. | Supports same industrial temp range, but lacks OTP array and ASP flexibility. | Prefer when board-level ECC is already implemented and sector protection granularity is less critical. |
Compared with S29GL256P11TFI01 and MX29GL256FHT2I-90G, IS29GL256S-10TFV01 provides superior reliability via integrated ECC, tighter timing for XIP, and finer-grained sector protection-making it optimal for new designs requiring long-term firmware integrity and mixed-voltage compatibility.
Availability
IS29GL256S-10TFV01 is available at Aetrix Electronics and suitable for industrial automation, automotive instrumentation, and medical diagnostics requiring stable component supply, long-lifecycle support, and guaranteed AEC-Q100 compliance.
Supply support for IS29GL256S-10TFV01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and mission-critical applications.
The GL-S family targets embedded systems needing deterministic boot performance, firmware update resilience, and extended data retention-designed specifically for industrial control, automotive clusters, and medical equipment where NOR flash reliability is non-negotiable.
FAQ
What is the maximum operating frequency supported by IS29GL256S-10TFV01?
The device does not operate synchronously and has no clock input; its performance is defined by access times-not frequency. With 90 ns random access and 15 ns page access, it supports effective bus throughput up to ~11 MBps in page mode and ~11.1 MBps in burst read scenarios, assuming standard 5 MHz asynchronous bus timing and proper setup/hold margins.
Does IS29GL256S-10TFV01 support JEDEC-standard command sets?
Yes-it implements the Common Flash Interface (CFI) v1.4 specification and supports industry-standard command sequences for read, program, sector erase, and status polling. All commands are issued via the DQ bus using the Intel Extended Command Set, fully compatible with standard NOR flash drivers in Linux, VxWorks, and bare-metal BSPs.
Can the OTP region be reprogrammed after initial programming?
No-the 1024-byte OTP (One-Time Programmable) array is permanently programmed; once a bit is set to '0', it cannot be changed back to '1'. The two lockable regions allow independent locking of calibration data and device identity blocks, ensuring cryptographic key or serial number immutability after final test.
Is hardware reset (RESET#) required during power-up?
Yes-asserting RESET# for ≥100 ns after VCC reaches 2.7 V ensures proper initialization of internal state machines and status registers. Skipping hardware reset may result in undefined behavior, including incorrect status reporting or failure to enter read mode, especially after brown-out conditions or hot insertion.
IS29GL256S-10TFV01 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
IS29GL256S-10TFV01 FAQ
1.How can I place an order for IS29GL256S-10TFV01 through Aetrix?
Please submit a Request for Quotation (RFQ) for IS29GL256S-10TFV01 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IS29GL256S-10TFV01 reliable?
The price and inventory of IS29GL256S-10TFV01 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IS29GL256S-10TFV01 is usually 5 days.
3.What payment methods are accepted for IS29GL256S-10TFV01?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IS29GL256S-10TFV01 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IS29GL256S-10TFV01?
IS29GL256S-10TFV01 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IS29GL256S-10TFV01 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IS29GL256S-10TFV01?
For technical support, including IS29GL256S-10TFV01 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IS29GL256S-10TFV01 requirements.
6.How does Aetrix verify that IS29GL256S-10TFV01 is sourced from the original manufacturer or authorized distributors?
All IS29GL256S-10TFV01 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IS29GL256S-10TFV01 meets industry standards.
7.What is the process for return or replacement of IS29GL256S-10TFV01?
All IS29GL256S-10TFV01 units undergo pre-shipment inspection (PSI). If there is an issue with IS29GL256S-10TFV01, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IS29GL256S-10TFV01 part is unused and in its original packaging.
Return procedure for IS29GL256S-10TFV01:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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