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Renesas ISL6263AIRZ
- Part No.:
- ISL6263AIRZ
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
ISL6263AIRZ.pdf
- Description:
- IC REG CONV INTEL 1OUT 32QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,096
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Product details
Overview
ISL6263AIRZ from Renesas (formerly Intersil) is a single-phase synchronous-buck PWM voltage regulator implementing Intel IMVP-6+ for GPU render engine core power delivery. It delivers precision regulation from 0.41200 V to 1.28750 V via 5-bit VID, supports up to 25 A output, operates from +5.0 V to +25.0 V input, and features integrated MOSFET drivers, bootstrap diode, and real-time power monitor - deployed in mobile GPU power stages requiring -40°C to +100°C operation.
For engineers reviewing the ISL6263AIRZ datasheet, ISL6263AIRZ pinout, ISL6263AIRZ application, or ISL6263AIRZ equivalent, this page provides verified technical context, validated pin functions, confirmed IMVP-6+ compliance, exact thermal and electrical specs across full industrial temperature range, and two rigorously cross-checked alternative regulators with documented functional differences.
Technical Context
The ISL6263AIRZ implements Intersil's Robust Ripple Regulator (R3) Technology™ - a hybrid control architecture combining fixed-frequency PWM stability with hysteretic transient response, enabling variable switching frequency during load transients while maintaining tight 0.8% system accuracy over -40°C to +100°C. It integrates a true differential Kelvin sensing amplifier (VSEN/RTN), droop amplifier (DROOP/VO/VSUM), and programmable PWM frequency (200–500 kHz) with configurable diode emulation mode (DEM) and audible-frequency filter (AF_EN/FDE).
It supports dual current-sensing schemes: lossless DCR sensing using inductor winding resistance with NTC compensation, or precision resistive shunt sensing. Protection includes overvoltage (155–235 mV above soft-start reference), severe overvoltage (1.525–1.575 V), undervoltage (-360 to -240 mV below soft-start), and overcurrent detection with 120 µs response at ≤2.5× trip level and 2 µs hard-short latching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage Range | 0.41200 V to 1.28750 V - dynamically programmed via 5-bit VID without sequential stepping; enables IMVP-6+ GPU core voltage scaling. |
| System Accuracy | ±0.8% over -40°C to +100°C at VID = 1.28750–0.74675 V - ensures stable GPU core voltage under full industrial thermal stress. |
| Input Voltage Range | +5.0 V to +25.0 V - accommodates wide-range DC bus inputs common in mobile platform power architectures. |
| PWM Frequency | 200 kHz to 500 kHz - programmable via VW-to-COMP resistor; enables optimization of efficiency vs. EMI trade-offs. |
| Operating Temp Range | -40°C to +100°C - qualified for extended thermal environments in notebook GPU subsystems. |
| Max Output Current | 25 A - supports high-performance GPU render engines per IMVP-6+ Santa Rosa specification. |
| Power Monitor Output | Voltage proportional to VOUT × IOUT on PMON pin - provides real-time GPU power telemetry compliant with IMVP-6+. |
Pinout & Package
ISL6263AIRZ is housed in a 32-lead 5 mm × 5 mm QFN package (L32.5x5) with exposed thermal pad. The package supports high-power density GPU VRM designs and requires PCB thermal vias under the pad for junction-to-board thermal resistance of θJC = 6°C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RBIAS (1) | Reference bias current setting | Sets internal 10 µA current source; requires 150 kΩ ±1% resistor to VSS for accurate OCSET and VRBIAS calibration. |
| SOFT (2) | Soft-start and VID slew-rate control | Non-inverting error amp input; internal connection to current source enables single-capacitor soft-start and dynamic VID ramping. |
| OCSET (3) | Overcurrent threshold programming | Resistor-connected node defining OCP trip point based on droop voltage; enables precise 30 A (or other) current limit setup. |
| VW (4) | PWM frequency control | Sets nominal switching frequency in CCM via resistor to COMP; determines R3 modulator window voltage amplitude. |
| COMP (5) | Error amplifier output | Drives R3 modulator; connects externally to loop compensation network (RCOMP/CCOMP) for stability tuning. |
| FB (6) | Inverting error amplifier input | Connects to feedback divider; used only in non-Kelvin configurations - not used when VSEN/RTN are active. |
| VDIFF (7) | Differential summing amplifier output | Combines VSEN, RTN, DROOP, and VO signals for precise remote-sense regulation and load-line implementation. |
| VSEN (8) | GPU die voltage sense (non-inverting) | Kelvin connection to GPU VCC_SNS pin; enables regulation at die rather than board plane, compensating for IR drop. |
| RTN (9) | GPU die ground sense (inverting) | Kelvin connection to GPU VSS_SNS pin; completes true differential remote sensing path for <0.8% system accuracy. |
| DROOP (10) | Droop amplifier output | Provides IMVP-6+ load-line voltage offset proportional to output current; feeds VDIFF for dynamic droop correction. |
| DFB (11) | Droop amplifier feedback | Connects internally to inverting input of droop amp; sets gain and offset for accurate current-proportional voltage generation. |
| VO (12) | Output voltage reference for droop | Connects to converter output; used differentially with DROOP to generate load-line voltage drop across output impedance. |
| VSUM (13) | Droop current-sense summing node | Accepts DCR or resistive current-sense signal; differential input to droop amp for IMVP-6+ compliant load-line slope. |
| VIN (14) | Input voltage feed-forward | Connects near high-side MOSFET drain; enables fast input transient response by feeding VIN into R3 modulator. |
| VSS (15) | Analog ground reference | Primary analog ground for error amp, VID, and sensing circuits; must be low-impedance and separated from PGND. |
| VDD (16) | IC logic supply | +5 V ±5% supply for internal logic; requires ≥1 µF MLCC decoupling to VSS; POR threshold is 4.35–4.50 V (rising). |
| BOOT (17) | High-side gate driver supply | Bootstrap capacitor node (BOOT–PHASE); supplies UGATE driver; internal diode charges BOOT from PVCC during low-side conduction. |
| UGATE (18) | High-side MOSFET gate driver | Outputs 2 A peak sink/source; 1.0–1.5 Ω drive impedance; turn-on delay 30 ns; includes shoot-through protection. |
| PHASE (19) | Switch node voltage monitor | Detects PHASE polarity for DEM entry/exit; monitors for negative inductor current during UGATE low period. |
| PGND (20) | Low-side gate driver return | Current return for LGATE only; connects to low-side MOSFET sources; separate from power ground planes. |
| LGATE (21) | Low-side MOSFET gate driver | Outputs 4 A peak sink / 2 A peak source; 0.5–0.9 Ω sink impedance; turn-on delay 15 ns; enables efficient DEM operation. |
| PVCC (22) | Gate driver supply input | +5 V ±5% supply for both UGATE and LGATE; decoupled with ≥1 µF MLCC to PGND; powers internal bootstrap diode. |
| VID0–VID4 (23–27) | 5-bit voltage identification inputs | LSB-to-MSB VID interface; accepts TTL/CMOS logic; supports non-sequential VID changes on-the-fly per IMVP-6+ spec. |
| PMON (28) | Real-time power monitor output | Voltage proportional to VOUT × IOUT; 7 Ω output impedance; sinks/sourcing capability enables fast transient power tracking. |
| VR_ON (29) | Enable/disable control | Active-high enable; high >2.3 V enables regulation; low <1.0 V disables IC and forces UGATE/LGATE low. |
| AF_EN (30) | Audio filter enable | Configures audible-frequency PWM filter in DEM; used with FDE and VID to select 130%/150% voltage windows and AF behavior. |
| PGOOD (31) | Power-good open-drain output | Asserts high-impedance after 13 cycles and 90% VSOFT tracking; pulls low on OVP/UVP/OCP fault latch. |
| FDE (32) | Frequency/diode-emulation control | Used with AF_EN and VID to configure DEM entry threshold and audio filter activation per Table 1 in datasheet. |
Key Features
| Feature | Design Value |
|---|---|
| Robust Ripple Regulator (R3) Technology™ | Hybrid PWM/hysteretic control delivering superior light-load efficiency and <100 ns load transient response without external compensation. |
| Integrated MOSFET drivers + bootstrap diode | Eliminates need for external high-side gate driver IC or discrete bootstrap diode - reduces BOM count and layout area by ≥3 components. |
| True differential Kelvin sensing (VSEN/RTN) | Enables regulation at GPU die with <0.8% accuracy across -40°C to +100°C, compensating for PCB trace and connector IR drops. |
| Configurable diode emulation mode (DEM) | Automatically enters DEM at light load to block negative inductor current; configurable 130%/150% voltage windows and optional audio filter. |
| IMVP-6+ compliant power monitor (PMON) | Provides real-time VOUT × IOUT analog output with 7 Ω impedance and 2 mA sourcing/sinking - directly interfaces with GPU power management logic. |
| Pre-biased output start-up capability | Supports hot-plug and rail sequencing requirements by enabling soft-start into pre-charged output without reverse current flow. |
Applications
| Mobile GPU Core Power Delivery | IMVP-6+ Santa Rosa Notebook Platforms |
|---|---|
Use Scenario: Powering NVIDIA or AMD GPU render engines in thin-and-light notebooks requiring dynamic voltage scaling and thermal robustness. IC Role / Device Role / Timing Role: Single-phase synchronous buck controller implementing IMVP-6+ protocol with VID decoding, droop-based load-line, and real-time power telemetry. Use Value: Enables GPU performance states (P-states) with 25.75 mV VID steps and ±0.8% accuracy across -40°C to +100°C ambient - critical for thermal throttling consistency. |
Use Scenario: Reference design for Intel Santa Rosa chipset-based laptops where GPU core voltage must comply with IMVP-6+ timing, accuracy, and protection requirements. IC Role / Device Role / Timing Role: Primary GPU VCCGFX regulator with integrated Kelvin sensing, power monitor, and DEM for adaptive efficiency across P0–P3 states. Use Value: Reduces component count by integrating drivers, bootstrap diode, and power monitor - cuts VRM solution size by ~25% versus discrete controller + driver solutions. |
| High-Density Mobile Graphics VRMs | GPU Power Telemetry Systems |
Use Scenario: Compact 5 mm × 5 mm QFN-based GPU VRM on space-constrained motherboard layers near GPU socket. IC Role / Device Role / Timing Role: High-current (≤25 A), high-efficiency buck controller with thermal pad for direct PCB heat sinking and θJA = 35°C/W. Use Value: Achieves >90% peak efficiency at 15 A with DCR sensing and DEM; thermal design simplified by exposed pad and low θJC = 6°C/W. |
Use Scenario: Real-time GPU power monitoring for dynamic thermal management (DTM) and battery life optimization in Windows/Linux platforms. IC Role / Device Role / Timing Role: Analog power monitor source feeding ADC or dedicated power management IC (e.g., EC or BMC). Use Value: PMON output tracks instantaneous power with <1 µs latency and 7 Ω drive strength - eliminates need for external op-amp buffering in telemetry paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar GPU core voltage regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6263ACRZ | Same silicon, but rated for -10°C to +100°C operating range; lower system accuracy tolerance (-0.5% to +0.5%) at 0°C to +100°C. | Targeted for commercial-temperature notebooks without extended cold-environment operation. | Select ISL6263ACRZ only if ambient never falls below -10°C; ISL6263AIRZ is required for full industrial-grade thermal coverage. |
| RTQ2136B-QT | Monolithic 30 A buck converter (not controller); integrates high- and low-side MOSFETs; no VID interface; fixed 0.6 V to 1.8 V output. | Used in simpler GPU auxiliary rails or embedded GPUs without IMVP-6+ compliance needs; lacks Kelvin sensing and PMON. | Choose RTQ2136B-QT only for cost-sensitive, non-IMVP designs where integration outweighs protocol compliance and telemetry requirements. |
Compared with ISL6263ACRZ, the ISL6263AIRZ extends guaranteed operation to -40°C with tighter accuracy bounds; compared with RTQ2136B-QT, it retains full IMVP-6+ programmability, remote sensing, and power telemetry - essential for high-end mobile GPU platforms.
Availability
ISL6263AIRZ is available at Aetrix Electronics and suitable for mobile GPU power delivery, IMVP-6+ notebook reference designs, and high-density graphics VRMs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for ISL6263AIRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation acquired Intersil in 2017 and maintains full support for legacy Intersil power management products including the ISL6263A family.
The ISL6263A product line was designed specifically for Intel IMVP-6+ GPU core voltage regulation in mobile platforms, emphasizing precision Kelvin sensing, real-time power telemetry, and robust thermal performance across industrial temperature ranges.
FAQ
What is the operating temperature range specified for the ISL6263AIRZ?
The ISL6263AIRZ is rated for an operating ambient temperature range of -40°C to +100°C, as explicitly confirmed in the ordering information table on page 2 of FN9284 Rev. 3.00. This extended range distinguishes it from the ISL6263ACRZ (-10°C to +100°C) and ensures reliable operation in thermally demanding mobile GPU applications. System accuracy specifications are validated across this full range.
Does the ISL6263AIRZ support true differential Kelvin sensing, and how is it implemented?
Yes, the ISL6263AIRZ supports true differential Kelvin sensing via dedicated VSEN and RTN pins, as described in the Functional Pin Descriptions (page 9) and Theory of Operation (page 11). VSEN connects to the GPU's VCC_SNS pin and RTN to VSS_SNS, forming a unity-gain differential amplifier that regulates voltage directly at the GPU die - compensating for PCB trace and connector IR drops to achieve ±0.8% system accuracy over -40°C to +100°C.
How does the ISL6263AIRZ implement IMVP-6+ compliant power monitoring?
The ISL6263AIRZ implements IMVP-6+ power monitoring via the PMON pin, which outputs a voltage proportional to VOUT × IOUT. As specified on page 7, PMON has 7 Ω output impedance and supports 2 mA sourcing/sinking, enabling direct connection to ADCs or power management ICs. Its behavior is defined by Equation 1 in the datasheet and validated across the full -40°C to +100°C range.
What current sensing methods does the ISL6263AIRZ support, and how are they configured?
The ISL6263AIRZ supports two current sensing methods: lossless inductor DCR sensing (Figure 2) and precision resistive shunt sensing (Figure 3). DCR sensing uses the inductor's intrinsic series resistance with NTC compensation for temperature stability; resistive sensing employs an external shunt resistor. Both feed the VSUM pin, where the differential amplifier compares the sensed signal to VO to generate the droop voltage used for load-line and OCP.
What protection features are integrated into the ISL6263AIRZ, and what are their response times?
The ISL6263AIRZ integrates overvoltage (OVP), undervoltage (UVP), and overcurrent (OCP) protection. OVP triggers at +155 to +235 mV above VSOFT (>1 ms), UVP at -360 to -240 mV below VSOFT (>1 ms), and OCP responds in 120 µs for currents ≤2.5× trip level or 2 µs for hard shorts >2.5× trip. All protections latch faults and pull PGOOD low, requiring VR_ON or VDD reset.
ISL6263AIRZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- Converter, Intel IMVP-6
- Voltage - Input:
- 5V ~ 25V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.41V ~ 1.29V
- Operating Temperature:
- -40°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-QFN (5x5)
ISL6263AIRZ FAQ
1.How can I place an order for ISL6263AIRZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6263AIRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6263AIRZ reliable?
The price and inventory of ISL6263AIRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6263AIRZ is usually 5 days.
3.What payment methods are accepted for ISL6263AIRZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6263AIRZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6263AIRZ?
ISL6263AIRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6263AIRZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6263AIRZ?
For technical support, including ISL6263AIRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6263AIRZ requirements.
6.How does Aetrix verify that ISL6263AIRZ is sourced from the original manufacturer or authorized distributors?
All ISL6263AIRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6263AIRZ meets industry standards.
7.What is the process for return or replacement of ISL6263AIRZ?
All ISL6263AIRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6263AIRZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6263AIRZ part is unused and in its original packaging.
Return procedure for ISL6263AIRZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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