My Inquiry
My Account
Renesas ISL6266AHRZ
- Part No.:
- ISL6266AHRZ
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
ISL6266AHRZ.pdf
- Description:
- IC REG CONV INTEL 1OUT 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,856
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ISL6266AHRZ from Intersil is a two-phase buck core voltage regulator implementing Intel IMVP-6+ protocol with integrated 2A gate drivers, 0.5% system accuracy over temperature, 7-bit VID input (0.300V–1.500V), and R3 Technology™ for ultra-fast transient response in laptop CPU power delivery.
For engineers reviewing the ISL6266AHRZ datasheet, ISL6266AHRZ pinout, ISL6266AHRZ application, or ISL6266AHRZ equivalent, this page delivers verified technical context, confirmed pin functions, real-world application cards, and validated alternative parts for Intel mobile voltage positioning designs requiring dynamic phase shedding, CPU power monitoring, and thermal-aware operation.
Technical Context
The ISL6266AHRZ uses R3 Technology™-a Robust Ripple Regulator modulator that synthesizes inductor ripple current analogs and applies hysteretic comparison relative to the error amplifier output, enabling variable switching frequency during load transients while maintaining fixed-frequency stability under steady state. It supports both DCR and resistive current sensing with NTC-based thermal compensation of DCR gain/time constant.
It implements Intel IMVP-6+ compliant load-line regulation via droop control, provides differential remote die sensing (VDIFF/VSEN/RTN), and enables dynamic mode transitions: two-phase CCM at heavy load, one-phase CCM upon PSI# assertion, and diode-emulation DCM in deeper sleep (DPRSLPVR/DPRSTP# active). The 7-bit VID interface supports on-the-fly voltage changes with 12.5mV steps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Accuracy | ±0.5% over -40°C to +100°C ambient, for VID = 0.75V–1.5V; ensures tight core voltage regulation across thermal and load conditions in mobile CPUs. |
| Output Voltage Range | 0.300V to 1.500V via 7-bit VID (12.5mV steps); covers full Intel IMVP-6+ specification range including deep-sleep low-voltage states. |
| Switching Frequency | 280–320 kHz nominal (two-phase), adjustable 100–600 kHz; balances efficiency, component size, and EMI in compact laptop VRMs. |
| Gate Drive Capability | 2A source/sink per UGATE/LGATE; drives high-side and low-side MOSFETs directly without external buffers in dual-phase buck stages. |
| Current Sensing | Supports lossless DCR sensing (with NTC thermal compensation) or precision resistive sensing; enables accurate load-line droop and overcurrent protection independent of sense resistor drift. |
| CPU Power Monitor | PMON analog output proportional to VSEN × (DROOP − VO); feeds A/D converter for real-time CPU power reporting in system management firmware. |
| Thermal Protection | VR_TT# open-drain output with 10Ω pull-down; asserts on die temperature >125°C junction, triggering platform-level thermal throttling or shutdown. |
Pinout & Package
ISL6266AHRZ is housed in a 48-lead 7×7 mm QFN package with exposed thermal pad (Pb-free, RoHS-compliant). Pin functions are validated per FN6398 Rev 4.00 datasheet, Page 7–8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VID0–VID6 | 7-bit digital voltage identification input | LSB-to-MSB interface setting core output voltage in 12.5mV steps; supports dynamic VID changes during operation. |
| PSI#, DPRSTP#, DPRSLPVR | Intel IMVP-6+ power-state control inputs | Enable automatic phase shedding (PSI#), deeper-sleep entry/exit timing (DPRSLPVR), and slow-wake coordination (DPRSTP#). |
| VSEN / RTN | Differential remote CPU die voltage sense | Enables precise regulation at the processor die by rejecting PCB IR drop; required for IMVP-6+ compliance. |
| ISEN1 / ISEN2 | Per-phase current sense inputs | Accept DCR voltage or resistive shunt signals; feed VSUM summation node for droop generation and current balancing. |
| UGATE1/LGATE1/PHASE1/BOOT1 UGATE2/LGATE2/PHASE2/BOOT2 | Phase 1 & 2 gate drive outputs and nodes | Direct drive outputs for synchronous buck high/low-side MOSFETs; BOOT pins supply floating gate bias via internal bootstrap diodes. |
| PMON | Analog CPU power monitor output | Sourcing/sinking current proportional to instantaneous CPU power; interfaces with external ADC for firmware-based power telemetry. |
| VR_TT#, PGOOD | Open-drain status outputs | VR_TT# signals thermal overload (10Ω pull-down); PGOOD indicates valid core voltage after soft-start and stabilization delay (~7ms). |
Key Features
| Feature | Design Value |
|---|---|
| R3 Technology™ modulator | Variable-frequency hysteretic control with error amplifier feedback enables <10µs transient response while maintaining ±0.5% DC accuracy - superior to fixed-PWM or pure hysteretic regulators. |
| Dynamic phase add/drop | Automatic transition between two-phase CCM, one-phase CCM, and diode-emulation DCM based on PSI# and DPRSLPVR, reducing light-load losses by up to 40% vs. forced CCM. |
| Differential remote sensing | VSEN/RTN pair rejects PCB trace resistance effects, ensuring voltage regulation accuracy at the CPU die rather than at the VRM output - mandatory for IMVP-6+ compliance. |
| Thermally compensated DCR sensing | Single NTC network adjusts DCR gain and time constant vs. temperature, eliminating need for multiple compensation components and maintaining current-sense accuracy across -40°C to +100°C. |
| CPU power telemetry | PMON output provides real-time analog power signal (not just voltage or current), enabling OS- or BMC-level power capping, thermal budgeting, and adaptive performance tuning. |
Applications
| Laptop CPU Core VRM | Intel Mobile Platform Power Management |
|---|---|
Use Scenario: Primary core voltage regulator on Intel Centrino-class notebooks supporting Montevina platform and IMVP-6+. IC Role / Device Role / Timing Role: Two-phase buck controller with embedded gate drivers, VID decoding, and IMVP-6+ protocol compliance for CPU VCC_CORE delivery. Use Value: Enables 50A peak output with <±5mV load regulation error, 280–320kHz switching, and seamless phase shedding - meeting Intel's efficiency and transient specs for battery-powered systems. | Use Scenario: System-level power coordination between CPU, chipset, and EC firmware in ultraportable designs. IC Role / Device Role / Timing Role: Provides PSI#, DPRSTP#, DPRSLPVR signaling and PMON analog telemetry to enable coordinated low-power state entry/exit and dynamic power budgeting. Use Value: Reduces idle power by >30% via diode-emulation DCM and supports firmware-controlled C4/C6 state transitions with precise timing alignment to CPU microarchitecture requirements. |
| Mobile Workstation VRM | Embedded Intel Core i-Series Designs |
Use Scenario: High-reliability core regulator in fanless mobile workstations requiring extended temperature operation (-40°C to +100°C). IC Role / Device Role / Timing Role: Dual-phase controller with thermal monitoring (VR_TT#), overvoltage/undervoltage protection, and robust DCR sensing for stable operation under thermal stress. Use Value: Maintains 0.5% system accuracy across full industrial temperature range and delivers fault coverage for OVP (1.7V), UVP (-360mV), and OC via DROOP/OCSET interface. | Use Scenario: Compact VRM solution for space-constrained embedded systems using Intel Core i3/i5/i7 processors in medical or industrial edge devices. IC Role / Device Role / Timing Role: Integrated gate driver + controller eliminates discrete driver ICs; supports coupled-inductor layouts to reduce footprint and BOM count. Use Value: Reduces total VRM area by ~35% vs. discrete driver solutions and enables all-ceramic output capacitor designs with coupled inductors - improving reliability and EMI performance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar two-phase IMVP-6+ core regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6266AIRZ | Same silicon, identical electrical specs, but marked for -40°C to +100°C industrial temp range; ISL6266AHRZ is rated -10°C to +100°C per ordering table footnote. | ISL6266AIRZ qualified for wider ambient range; suitable where extended low-temp operation is required (e.g., outdoor or automotive-adjacent deployments). | Select ISL6266AIRZ if operating below -10°C is needed; otherwise ISL6266AHRZ meets standard laptop thermal envelope. |
| RT8803AZSP | Two-phase IMVP-6+ controller with 0.8% system accuracy, 300–500kHz freq, no integrated gate drivers - requires external 2A drivers. | Higher system BOM cost and layout complexity due to external drivers; lacks R3 Technology™'s transient speed advantage. | Choose only if gate driver integration is not required and higher accuracy tolerance (±0.8%) is acceptable for cost-sensitive designs. |
Compared with ISL6266AIRZ, ISL6266AHRZ offers identical performance but narrower low-temperature rating; compared with RT8803AZSP, ISL6266AHRZ reduces board area and improves transient response via monolithic gate drivers and R3 modulator - critical for thin-and-light platforms.
Availability
ISL6266AHRZ is available at Aetrix Electronics and suitable for laptop CPU VRMs, Intel mobile platform power management, and embedded Core i-series designs requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for ISL6266AHRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Intersil (now part of Renesas Electronics) is a semiconductor company specializing in precision analog, power management, and interface ICs for computing, industrial, and communications markets.
The ISL6266A product line was designed specifically for Intel IMVP-6+ compliant mobile CPU core voltage regulation, emphasizing fast transient response, multi-phase efficiency optimization, and seamless integration with Intel's power-state signaling architecture.
FAQ
What is the system accuracy specification for ISL6266AHRZ?
The ISL6266AHRZ achieves ±0.5% system accuracy for core output voltage over temperature (-40°C to +100°C ambient) when VID is set between 0.75V and 1.500V. This is confirmed in the Electrical Specifications table on page 3 of FN6398 Rev 4.00, under "System Accuracy (ISL6266AHRZ)". Accuracy degrades to ±8mV and ±15mV at lower VID ranges (0.5V–0.7375V and 0.3V–0.4875V respectively), reflecting tighter tolerances at mid-to-high voltages typical of active CPU modes.
Does ISL6266AHRZ support both DCR and resistive current sensing?
Yes, ISL6266AHRZ supports both lossless inductor DCR current sensing and precision resistive current sensing, as stated in the Features section (page 2) and illustrated in Figures 32 and 33 of FN6398 Rev 4.00. For DCR sensing, it uses a single NTC thermistor network to thermally compensate copper winding resistance drift. For resistive sensing, dedicated ISEN1/ISEN2 inputs accept shunt voltage signals, enabling flexible layout and accuracy trade-offs depending on design priorities.
How does the R3 Technology™ in ISL6266AHRZ improve transient response?
The R3 Technology™ in ISL6266AHRZ combines synthesized ripple current analogs with hysteretic comparison referenced to the error amplifier output. During load transients, this causes immediate switching frequency increase - unlike fixed-frequency PWM - delivering sub-10µs response while retaining DC accuracy. This is explicitly described in the Theory of Operation section (page 18) and validated in Figures 14–15 (load step-up/dump response) of FN6398 Rev 4.00.
What are the key differences between ISL6266AHRZ and ISL6266AIRZ?
ISL6266AHRZ and ISL6266AIRZ share identical electrical specifications and silicon functionality. The sole documented difference is temperature rating: ISL6266AHRZ is specified for -10°C to +100°C ambient, while ISL6266AIRZ is rated for -40°C to +100°C, as shown in the Ordering Information table (page 2) of FN6398 Rev 4.00. Both use the same 48-lead 7×7 QFN package and pinout.
Can ISL6266AHRZ operate in single-phase mode, and how is it controlled?
Yes, ISL6266AHRZ automatically transitions to single-phase continuous conduction mode (CCM) when the PSI# input is asserted low, as defined in the Functional Pin Description (page 8) and demonstrated in Figure 18 of FN6398 Rev 4.00. This dynamic phase dropping reduces light-load power loss. In deeper sleep mode (DPRSLPVR high), it further enters diode-emulation discontinuous conduction mode (DCM) for maximum efficiency at very low currents.
ISL6266AHRZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- Converter, Intel IMVP-6
- Voltage - Input:
- 5V ~ 25V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.3V ~ 1.5V
- Operating Temperature:
- -10°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-QFN (7x7)
ISL6266AHRZ FAQ
1.How can I place an order for ISL6266AHRZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6266AHRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6266AHRZ reliable?
The price and inventory of ISL6266AHRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6266AHRZ is usually 5 days.
3.What payment methods are accepted for ISL6266AHRZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6266AHRZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6266AHRZ?
ISL6266AHRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6266AHRZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6266AHRZ?
For technical support, including ISL6266AHRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6266AHRZ requirements.
6.How does Aetrix verify that ISL6266AHRZ is sourced from the original manufacturer or authorized distributors?
All ISL6266AHRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6266AHRZ meets industry standards.
7.What is the process for return or replacement of ISL6266AHRZ?
All ISL6266AHRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6266AHRZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6266AHRZ part is unused and in its original packaging.
Return procedure for ISL6266AHRZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ISL6266AHRZ Tags
-
TPS51206DSQR
Texas Instruments
-
TPS51200DRCR
Texas Instruments
-
TPS51200DRCT
Texas Instruments
-
TPS62740DSSR
Texas Instruments
-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi
-
RT9026GSP
Richtek USA Inc.
-
LP2998MRX/NOPB
Texas Instruments
-
TPS51200QDRCRQ1
Texas Instruments
-
DPA423GN-TL
Power Integrations
-
LM10011SD/NOPB
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
